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1. 发明专利

JPH0794858A ELECTRONIC CIRCUIT PARTS 失效
公开(公告)号：JPH0794858A
公开(公告)日：1995-04-07
申请号：JP23387293
申请日：1993-09-20
申请人： TOSHIBA CORP
发明人： EBITANI TAKASHI , UCHIDA TATSUAKI , MORI MIKI , KIZAKI YUKIO , TOGASAKI TAKASHI , SAITO MASAYUKI
IPC分类号： H01R43/02 , H01G4/252 , H01L23/12 , H05K1/11 , H05K3/34
摘要： PURPOSE:To prevent exfoliation of solder bumps and deterioration of reliability due to cracks, after bump mounting. CONSTITUTION:A circuit board 5 wherein a pair of lands 3 are formed on the surface, and an electronic chip parts 1 having electrodes 2 which face the lands 3 via solder bumps 4 and are connected electrically with the lands ate prepared. The end portion 4a of the solder bump 4 outside the longitudinal direction of the electronic parts 1 and the end portion 2a of the electrode 2 outside the longitudinal direction of the electronic parts 1 coincide almost with each other. The end portion 4b of the bump 4 inside the longitudinal direction of the electronic chip parts 1 stretches toward the inside of the longitudinal direction of the electronic chip parts 1 more than the end portion 2b of the electrode 2 inside the longitudinal direction of the electronic chip parts 1.

2. 发明专利

JPH09115911A SEMICONDUCTOR DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH09115911A
公开(公告)日：1997-05-02
申请号：JP27119295
申请日：1995-10-19
申请人： TOSHIBA CORP
发明人： EBITANI TAKASHI , TOGASAKI TAKASHI , SHIMIZU SEISABURO , TAKAHASHI KUNIAKI
IPC分类号： H01L21/60 , H01L21/321
摘要： PROBLEM TO BE SOLVED: To easily form a barrier metal layer and a solder bump on an electrode pad by the non-plating method by transferring a junction layer including a second metal which can be subjected to solid-phase diffusion with a first metal on an elastic sheet onto a connection pad, causing a solid-phase diffusion reaction between both metals, and joining the junction layer on the connection pad. SOLUTION: A copper foil 5b where gold coating 5a coats one surface of a resin film and nickel layer 5c/metal layer 5d are coated on the other surface in this order is punched. Then, a punched barrier metal lamination body 5 and a connection pad 3 on a semiconductor substrate 1 are aligned and the barrier metal lamination body 5 is transferred onto the connection pad 3 on the semiconductor substrate 1, where the barrier metal lamination body 5 is heated to a temperature where the barrier metal lamination body 5 and the connection pad 3 cannot be melted and a diffusion reaction is generated between the connection pad 3 of the semiconductor substrate 1 and the junction layer 5a consisting of gold coating on the barrier metal layer 5b, thus joining the covering of the barrier metal lamination body 5 on the connection pad 3.

3. 发明专利

JPH08340000A SEMICONDUCTOR DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH08340000A
公开(公告)日：1996-12-24
申请号：JP14490195
申请日：1995-06-12
申请人： TOSHIBA CORP
发明人： KIZAKI YUKIO , MORI MIKI , EBITANI TAKASHI , SAITO MASAYUKI , MURAKAMI TAIJUN
IPC分类号： H01L21/60 , H01L21/321 , H01L21/603
摘要： PURPOSE: To facilitate repairing and provide a highly reliable connection by aligning an interconnection layer with a connecting means through a repairing function layer, temporarily connecting them by heating at the melting point temperature of the low melting point connecting metal or below and forming a reaction layer by the solid-phase diffusion of the interconnection layer and the connecting means. CONSTITUTION: A gold bump 212 is formed on a semiconductor element 211, and a low melting point connecting metal bump is formed on the gold bump 212. Molybdenum/aluminum interconnection 214 is formed on a glass board 213. In a first connecting process (temporary connection), the semiconductor element is heated to the temperature of the melting point of the low melting point connecting metal bump or below to allow press-contact, and all the pads are connected at one time. Then, in a second connecting process (major connection), the semiconductor element is heated to approximately 400 deg.C to allow press-contact and all the pads are connected at one time. A reaction layer is formed by solid-phase diffusion reaction on the interface between the gold bump and the aluminum pad, and electrical and mechanical connection is performed.

4. 发明专利

JPH08227917A MOUNTING STRUCTURE OF SEMICONDUCTOR ELEMENT, LIQUID CRYSTAL DISPLAY AND SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH08227917A
公开(公告)日：1996-09-03
申请号：JP24432295
申请日：1995-09-22
申请人： TOSHIBA CORP
发明人： KIZAKI YUKIO , MORI MIKI , EBITANI TAKASHI , SAITO MASAYUKI , MURAKAMI TAIJUN
IPC分类号： H01L21/60 , H01L21/321 , H01L21/603
摘要： PURPOSE: To connect a semiconductor element well by maximizing the percentage of Au4 Al in an intermetallic compound when a wiring pattern and a bump are connected electrically and mechanically by forming the intermetallic compound through solid phase diffusion reaction caused by thermocompression. CONSTITUTION: An Al wiring pattern 2 is formed on the surface of an insulating board 1. A large number of gold bumps 4 are formed on the surface of a semiconductor element 3. The semiconductor element 3 is connected electrically and mechanically by forming an intermetallic compound, in the Al wiring pattern 2 on the insulating board 1, through solid phase diffusion reaction caused by thermocompression of the gold bump 4. The intermetallic compound has such composition as the percentage of Au4 Al is maximized. Since occurrence of crack and void due to thermal impact is prevented at the joint, a highly reliable mounting structure for semiconductor element is realized.

5. 发明专利

JPH0883799A METHOD FOR FORMING SOLDER BUMP 失效
公开(公告)号：JPH0883799A
公开(公告)日：1996-03-26
申请号：JP21717994
申请日：1994-09-12
申请人： TOSHIBA CORP
发明人： EBITANI TAKASHI , MORI MIKI , UCHIDA TATSUAKI , TOGASAKI TAKASHI , KIZAKI YUKIO
IPC分类号： H01L21/60 , H05K3/12 , H05K3/34 , H01L21/321
摘要： PURPOSE: To provide a method which can simply form a solder bum having a predetermined height on a connecting pad of the circuit board of a ceramic package, a module board, etc. CONSTITUTION: A method for forming a solder bump 19 on the connecting pad 2 of a circuit board or a module board 1 comprises the steps of printing cream solder on the pad 2 of the circuit board or the board 1, further allowing the solder to reflow, conducting at least one of the step of flattening the upper part, then printing the solder on the solder flattened at its upper part, and allowing the solder to reflow.

6. 发明专利

JPH07169875A ELECTRONIC CIRCUIT DEVICE, MANUFACTURE THEREOF, CIRCUIT BOARD, LIQUID CRYSTAL DISPLAY DEVICE, THERMAL HEAD, AND PRINTER 失效
公开(公告)号：JPH07169875A
公开(公告)日：1995-07-04
申请号：JP3819294
申请日：1994-03-09
申请人： TOSHIBA CORP
发明人： MORI MIKI , KIZAKI YUKIO , EBITANI TAKASHI , SAITO MASAYUKI , TOGASAKI TAKASHI , UCHIDA TATSUAKI , YASUMOTO YASUAKI , YAMAKAWA KOJI
IPC分类号： H05K1/18 , H01L21/60 , H01L23/12
摘要： PURPOSE:To obtain a highly reliable connection whereby a semiconductor element and a board are connected and which has a large connective strength, a high allowable current value and a low connective resistance, by connecting the semiconductor element with the board through the solid phase diffusion performed between a bump formed on the semiconductor element and a wiring formed on the board, while mounting facedown the semiconductor element on the board in a short time and with a high mounting density. CONSTITUTION:In a semiconductor device wherein a semiconductor element 51 mounted facedown on a glass board 53 configuring a flat display or on a ceramic board 53 configuring a thermal head, the semiconductor element 51 is bonded to the board 53 through a solid phase diffusion performed between a bump 52 formed on the semiconductor element 51 and a wiring 54 formed on the board 53.

7. 发明专利

JP2003308418A Chemical substance management system, chemical substance management method and recording medium 有权
标题翻译：化学物质管理系统，化学物质管理方法和记录介质
公开(公告)号：JP2003308418A
公开(公告)日：2003-10-31
申请号：JP2003108043
申请日：2003-04-11
申请人： Toshiba Corp , 株式会社東芝
发明人： EBITANI TAKASHI , MIZUKAMI HIROSHI , AMANO MASARU , MIYAZAWA TADAHISA , OTSUKA HISANORI , NAKAE HIROKI , MACHIDA SHIGERU , SUGIYAMA TORU , NOMAKI TATSUO , MOTOMIYA AKINORI , SHOJI YUICHI
IPC分类号： G06Q50/04 , G06Q50/00 , G06Q50/26 , G06F17/60
CPC分类号： Y02P90/30
摘要： PROBLEM TO BE SOLVED: To precisely manage retained chemical substances in the component material unit. SOLUTION: This chemical substance management system manages the use quantities of the retained chemical substances every chemical substance by a computer. The use quantity of each retained chemical substance is managed by use of a database including a table for managing the use quantity, each component material contained in the chemical substance, and the content of the component material. The use quantity of each chemical substance, each component material of the chemical substance and the content of the component material are acquired from the database, and the user quantity of each chemical substance is calculated in the component material unit based on the use quantity of each chemical substance, each component of the chemical substance, and the content of the component material. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：精确管理部件材料单元中的残留化学物质。
解决方案：该化学物质管理系统通过计算机管理每种化学物质的残留化学物质的使用量。通过使用包含用于管理使用量的表，化学物质中所含的各成分材料和成分材料的含量的数据库来管理各残留化学物质的使用量。从数据库中取出各化学物质的使用量，化学物质的各成分物质和成分材料的含量，根据各化学物质的使用量，在成分材料单元中计算各化学物质的使用量化学物质，化学物质的每种组分以及组分材料的含量。版权所有（C）2004，JPO

8. 发明专利

JP2000137747A SYSTEM AND METHOD FOR MANAGING CHEMICAL SUBSTANCES AND RECORDING MEDIUM 失效
公开(公告)号：JP2000137747A
公开(公告)日：2000-05-16
申请号：JP31131498
申请日：1998-10-30
申请人： TOSHIBA CORP
发明人： EBITANI TAKASHI , MIZUKAMI HIROSHI , AMANO MASARU , MIYAZAWA TADAHISA , OTSUKA HISANORI , NAKAE HIROKI , MACHIDA SHIGERU , SUGIYAMA TORU , NOMAKI TATSUO , MOTOMIYA AKINORI , SHOJI YUICHI
IPC分类号： G06Q50/00 , G06Q50/26 , G06F17/60
摘要： PROBLEM TO BE SOLVED: To provide an ideal chemical substance managing system capable of speedily and easily investigating influences to be exerted upon natural environments or safety by summing up environmental discharges based on a used quantity for each chemical substance and the environmental discharge ratio of that chemical substance. SOLUTION: Data are inputted from a chemical user himself by a software 12 for user management for managing the used chemical substance and on the side of center, while using a software H for center management, based on these input data, the history management of stock, use, abandonment and movement or the like, summing-up and report preparation or the like are performed. Thus, the environmental discharges generated as a result of contained materials, environmental influence degree latent in contained materials and further the coefficient of the fire laws can be multi-laterally managed/summed up. Namely, since almost all the required parameters are registered and managed, concerning the influences upon natural environments or safety, statistic values can be easily found from various viewpoints.

9. 发明专利

JPH09129647A SEMICONDUCTOR ELEMENT 失效
公开(公告)号：JPH09129647A
公开(公告)日：1997-05-16
申请号：JP28077795
申请日：1995-10-27
申请人： TOSHIBA CORP
发明人： HONMA SOICHI , YAMADA HIROSHI , TATEYAMA KAZUKI , EBITANI TAKASHI , SAITO MASAYUKI
IPC分类号： H01L21/60 , H01L21/321
摘要： PROBLEM TO BE SOLVED: To obtain a barrier metal having a high mobility capable of avoiding the decline in share strength and the release of a bump by forming a barrier metal of the laminated films successively formed of the first film containing titanium, the second film containing nickel titanium compound and the third film containing nickel. SOLUTION: A bump 8' is formed on an electrode pad 2 through the intermediary of barrier metals 7. In such a constitution, the barrier metals 7 are composed of laminated layer films successively formed of the first film 4 containing titanium, the second film 5 containing nickel titanium and the third film 6 containing nickel. For example, an Au bump 8' is formed on a semiconductor chip 1 whereon an aluminum pad 2 is formed through the intermediary of the barrier metals 7. That is, the barrier metals 7 are structured of the successively laminated layers of the titanium film 4, the nickel titanium compound (nickel titanium solid solution) film 5 and the nickel film 6.

10. 发明专利

JPH03117340A END RING FOR GENERATOR 失效
公开(公告)号：JPH03117340A
公开(公告)日：1991-05-20
申请号：JP21648090
申请日：1990-08-18
申请人： TOSHIBA CORP
发明人： YAMAMOTO MASAO , EBITANI TAKASHI , KAWAI MITSUO , TAJIMA KOICHI
IPC分类号： H02K3/51
摘要： PURPOSE:To improve resistance against uniform corrosion, pitting corrosion, gap corrosion and stress corrosion cracking by reducing the amount of carbon and increasing the amount of nitrogen. CONSTITUTION:The title end ring is constituted of a non-magnetic steel containing 12-20weight% of chrome, 13-25weight% of mangan, 0.4weight% or less of carbon, 0.45-1weight% of nitrogen, 5weight% or less of molybdenum and the balance or iron substantially while the total amount of chrome and mangan is higher than 30weight%. The end ring 4 is provided around coil end turns 2 and supporting ring 3 near the end of a rotor shaft 1, for example. Carbon stabilizes the phase of austenite and improves the strength of the ring, however, its excessive addition deteriorates resistance against pitting corrosion and rigidity whereby the upper limit should be 0.4%. It is necessary to add nitrogen exceeding 0.45% in order to improve a strength as well as resistances against pitting corrosion and stress corrosion cracking, however, the upper limit should be 1% in order to increase rigidity.

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