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1. 发明专利

GB2222886B METHOD AND DEVICE FOR MEASURING SURFACE ROUGHNESS 未知
公开(公告)号：GB2222886B
公开(公告)日：1992-08-19
申请号：GB8921194
申请日：1989-09-19
申请人： TOKYO SEIMITSU CO LTD
发明人： SUZUKI TORU , ARAI MASATOSHI
IPC分类号： G01B21/20 , G01B7/28 , G01B11/30 , G01B21/30
摘要： A method and device for measuring the surface contour such as the surface roughness of a member to be measured having a curved surface shape. In the surface contour measuring device, a cubic curved line corresponding to the curved surface of the member to be measured is obtained from a measurement signal according to a method of least squares, and the cubic curved line is removed from the measurement signal to obtain a roughness curved line, so that, even when the member to be measured has a curved surface, the surface roughness of the member can be obtained with accuracy.

2. 发明专利

GB2222886A Method and device for measuring a surface contour eg. roughness 未知
公开(公告)号：GB2222886A
公开(公告)日：1990-03-21
申请号：GB8921194
申请日：1989-09-19
申请人： TOKYO SEIMITSU CO LTD
发明人： SUZUKI TORU , ARAI MASATOSHI
IPC分类号： G01B21/20 , G01B7/28 , G01B11/30 , G01B21/30
摘要： Errors in gauging the roughness of a curved surface are corrected by using a least squares analysis of measurement signals to obtain a cubic equation describing the curve of the surface and then removing from the measurement signals a component corresponding to this equation to leave a signal indicative of roughness only. … …

3. 发明专利

DE3931132A1 未知
公开(公告)号：DE3931132A1
公开(公告)日：1990-03-22
申请号：DE3931132
申请日：1989-09-18
申请人： TOKYO SEIMITSU CO LTD
发明人： SUZUKI TORU , ARAI MASATOSHI
IPC分类号： G01B21/20 , G01B7/28 , G01B11/30 , G01B21/30
摘要： A method and device for measuring the surface contour such as the surface roughness of a member to be measured having a curved surface shape. In the surface contour measuring device, a cubic curved line corresponding to the curved surface of the member to be measured is obtained from a measurement signal according to a method of least squares, and the cubic curved line is removed from the measurement signal to obtain a roughness curved line, so that, even when the member to be measured has a curved surface, the surface roughness of the member can be obtained with accuracy.

4. 发明专利

JPH07321074A SWINGING SLICING OF SEMICONDUCTOR WAFER 失效
公开(公告)号：JPH07321074A
公开(公告)日：1995-12-08
申请号：JP11291994
申请日：1994-05-26
申请人： TOKYO SEIMITSU CO LTD
发明人： HONDA KATSUO , SUZUKI TORU
IPC分类号： H01L21/304
摘要： PURPOSE:To improve the cutting efficiency of an inner peripheral blade by a method wherein the feed-in traveling speed of the inner peripheral blade is slowed down in such a way that it is slowed down after a cutting of a semiconductor material is started and is decreased to the minimum speed before the blade reaches the axial center of the material and after reaching the minimum speed, the traveling speed is gradually accelerated and when the terminal of the material is cut, the traveling speed is made to return to the speed at the time of start of the cutting of the material. CONSTITUTION:The feed-in traveling speed of an inner peripheral blade is controlled in such a way that the traveling speed is gradually slowed down so that it is decreased to the minimum speed before the inner peripheral blade 10 reaches the axial center of a semiconductor material and after reaching the minimum speed, the traveling speed is gradually accelerated and when the terminal of the material is cut, the traveling speed is made to return to the speed at the time of start of a cutting of the material. When the feed-in traveling speed of the blade 10 is controlled in such a way, the peak of the peak value or the maximum cutting amount becomes gentle. As a result, the cutting work done of the blade 10 is also made uniform and as an abrupt load at the time of the cutting is also not applied, the quality of the cut surface of the wafer is also improved.

5. 发明专利

JPH07335595A ROCKING SLICING METHOD FOR SEMICONDUCTOR WAFER 失效
公开(公告)号：JPH07335595A
公开(公告)日：1995-12-22
申请号：JP12785694
申请日：1994-06-09
申请人： TOKYO SEIMITSU CO LTD
发明人： HONDA KATSUO , SUZUKI TORU
IPC分类号： B26D3/16 , B23D45/08 , B26D5/00 , B28D5/02 , H01L21/304
摘要： PURPOSE:To obtain a rocking slicing method in which the feeding movement speed of an internal circumferential blade or a semiconductor material is decelerated gradu ally after starting a rocking operation, in which the speed is decelerated so as to become a minimum speed immediately before finishing the rocking operation, in which the speed is accelerated after reaching the minimum speed, in which the speed is returned to a speed at the start of the rocking operation after finishing the rocking operation and in which a cutting load applied to the internal circumferential blade is made uniform. CONSTITUTION:The feeding movement speed of an internal circumferential blade 10 in one rocking operation is decelerated gradually after starting a rocking operation. Then, the speed is decelerated so as to become a minimum speed immediately before finishing the rocking operation. After the speed has reached the minimum speed, it is accelerated, and it is controlled so as to be returned to a speed at the start of the rocking operation when the rocking operation is finished. When the feeding movement speed of the internal circumferential blade 10 is controlled in this manner, the mountain of the peak value of a maximum cutting amount becomes gentle. As a result, the cutting work load of the internal circumferential blade 10 can be made uniform, and a sudden load in a cutting operation is not applied, and the product life of the internal circumferential blade 10 can be extended.

6. 发明专利

JPH0280909A MEASURING MACHINE FOR CONTOUR SHAPE SUCH AS SURFACE ROUGHNESS 失效
公开(公告)号：JPH0280909A
公开(公告)日：1990-03-22
申请号：JP23266188
申请日：1988-09-19
申请人： TOKYO SEIMITSU CO LTD
发明人： SUZUKI TORU , ARAI MASATOSHI
IPC分类号： G01B21/20 , G01B7/28 , G01B11/30 , G01B21/30
摘要： PURPOSE:To accurately measure the surface roughness of a curved surface shape by measuring the surface shape of an object to be measured and calculating a cubic curve along a contour shape from the measuring signal using a method of least squares and removing the cubic curve from the measuring signal to calculate a roughness curve. CONSTITUTION:The probe 20 of a measuring part 10 is moved in contact with the surface of a work 22 and the up-and-down moving quantity thereof is converted to an electric signal through a core 24 to be inputted to a synchronous detection circuit 26. After said electric signal is converted by an A/D converter 28, the cubic curve corresponding to a curved surface shape contained in a measuring signal is calculated in a curve correction and operation part 30 using a method of least squares and subtracted from the measuring signal to calculate a roughness curve. After this signal is converted by a D/A converter 32, an undulation signal component is removed by a high-pass filter (HPF) 34 to be displayed on a recorder 40 and a roughness parameter is operated. By this method, the surface roughness of a curved surface shape can be accurately measured.

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