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    • 8. 发明专利
    • Manufacturing method of electrode for semiconductor, and solar cell using the same
    • 用于半导体的电极的制造方法和使用其的太阳能电池
    • JP2009238824A
    • 2009-10-15
    • JP2008080033
    • 2008-03-26
    • Tokyo Ohka Kogyo Co Ltd東京応化工業株式会社
    • HIRAI TAKAAKITANITSU KATSUYA
    • H01L31/04
    • Y02E10/50
    • PROBLEM TO BE SOLVED: To provide a method of surely and selectively forming an impurity diffusion region without needing a complicated process, and manufacturing an electrode including such an impurity diffusing agent layer. SOLUTION: This electrode manufacturing method includes processes of: forming an impurity diffusing agent layer on a semiconductor substrate; selectively heating the impurity diffusing agent layer by using a laser to diffuse an impurity diffusing agent in the heated part into the semiconductor substrate; and removing the impurity diffusing agent layer. The impurity diffusing agent contains a compound of a group III element or a compound of a group V element. COPYRIGHT: (C)2010,JPO&INPIT
    • 解决的问题:提供一种确定地且有选择地形成杂质扩散区而不需要复杂工艺的方法,以及制造包括这种杂质扩散剂层的电极。 解决方案:该电极制造方法包括以下工序:在半导体衬底上形成杂质扩散剂层; 通过使用激光来选择性地加热杂质扩散剂层,以将加热部分中的杂质扩散剂扩散到半导体衬底中; 并去除杂质扩散剂层。 杂质扩散剂含有III族元素的化合物或V族元素的化合物。 版权所有(C)2010,JPO&INPIT
    • 9. 发明专利
    • Method for forming resist pattern, method for forming pattern, solar cell and positive resist composition
    • 形成电阻图案的方法,形成图案,太阳能电池和积极电阻组合物的方法
    • JP2013218269A
    • 2013-10-24
    • JP2012249630
    • 2012-11-13
    • Tokyo Ohka Kogyo Co Ltd東京応化工業株式会社
    • TOMITA HIROAKIYOSHII YASUHIROHIRAI TAKAAKI
    • G03F7/022H01L31/04
    • Y02E10/50Y02P70/521
    • PROBLEM TO BE SOLVED: To improve removability of a resist film in a recessed part of a support body.SOLUTION: A method for forming a resist pattern includes steps of: applying the following positive resist composition on a support body including a solar cell substrate to form a resist film; selectively irradiating the resist film with light to expose; and developing the exposed resist film with an alkali solution to remove the exposed part. The positive resist composition comprises a novolac resin (A) and a photosensitive agent (B) including an ester compound of phenols (B1) having a tris(hydroxyphenyl)methane skeleton with a quinone diazide group-containing sulfonyl compound (B2), and shows 10% or more transmittance for light at a wavelength of 365 nm in a resist film of the composition having 3 μm film thickness.
    • 要解决的问题:提高支撑体的凹部中的抗蚀剂膜的可除去性。解决方案:形成抗蚀剂图案的方法包括以下步骤:将以下正性抗蚀剂组合物施加到包括太阳能电池基板的支撑体上, 形成抗蚀膜; 用光选择性地照射抗蚀剂膜以曝光; 并用碱溶液显影曝光的抗蚀剂膜以除去暴露的部分。 正型抗蚀剂组合物包含酚醛清漆树脂(A)和包含具有三(羟基苯基)甲烷骨架的苯酚(B1)与含醌二叠氮基基团的磺酰基化合物(B2)的酯化合物的感光剂(B),并且显示 在具有3μm膜厚的组合物的抗蚀剂膜中,波长365nm的光的透射率为10%以上。
    • 10. 发明专利
    • Diffusion method of impurity diffusing component, and method of manufacturing solar cell
    • 绝缘扩散部件的扩散方法和制造太阳能电池的方法
    • JP2011171600A
    • 2011-09-01
    • JP2010035277
    • 2010-02-19
    • Tokyo Ohka Kogyo Co Ltd東京応化工業株式会社
    • MUROTA ATSUSHIKAMIZONO TAKASHIHIRAI TAKAAKITANITSU KATSUYA
    • H01L31/04
    • Y02E10/50
    • PROBLEM TO BE SOLVED: To suppress the generation of abnormal diffusion while preventing the reduction of the number of semiconductor substrates placeable in a diffusion furnace at once and an increase of the number of manufacturing processes. SOLUTION: A diffusion method of an impurity diffusing component includes steps of: forming an N-type diffusion layer 2 containing an N-type impurity diffusing component on one surface of a semiconductor substrate 1; forming a P-type diffusion layer 4 containing a P-type impurity diffusion component on the other surface of the semiconductor substrate 1; arranging a plurality of the semiconductor substrates 1 so that the diffusion layers containing the same conductive impurity diffusion components are opposed to each other in a diffusion furnace; diffusing the N-type impurity diffusion component on the one surface of the semiconductor substrate 1; and also diffusing the P-type impurity diffusing component on the other surface of the semiconductor substrate 1 by heating the semiconductor substrates 1 in the diffusion furnace. COPYRIGHT: (C)2011,JPO&INPIT
    • 解决的问题:为了抑制异常扩散的产生,同时防止一次放置在扩散炉中的半导体衬底的数量的减少以及制造工艺数量的增加。 解决方案:杂质扩散组分的扩散方法包括以下步骤:在半导体衬底1的一个表面上形成含有N型杂质扩散组分的N型扩散层2; 在半导体衬底1的另一个表面上形成包含P型杂质扩散组分的P型扩散层4; 布置多个半导体衬底1,使得包含相同导电杂质扩散组分的扩散层在扩散炉中彼此相对; 在半导体衬底1的一个表面上扩散N型杂质扩散组分; 并且还通过加热扩散炉中的半导体衬底1将P型杂质扩散组分扩散到半导体衬底1的另一个表面上。 版权所有(C)2011,JPO&INPIT