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1. 发明专利

JP2002064057A TREATMENT EQUIPMENT 失效
公开(公告)号：JP2002064057A
公开(公告)日：2002-02-28
申请号：JP2001175446
申请日：2001-06-11
申请人： TOKYO ELECTRON LTD
发明人： SAKAMOTO YASUHIRO , AKUMOTO MASAMI
IPC分类号： G03F7/16 , B05C11/00 , B05C13/02 , B65G49/06 , B65G49/07 , H01L21/027 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To obtain convenience when switching between retaining and holding is automated in the case that an object to be treated is transferred by using a transferring mechanism. SOLUTION: As a control means for switching between usage of a sucking part 64 and usage of pawls 61 in an arm 59 for transferring a wafer W, a film thickness sensor of an optical interference type or the like which measures thickness of a film formed on a surface of the wafer W or a peripheral part of the wafer W, and a control device like a microcomputer which judges a kind of the film on the basis of the measured result, are installed in the transferring mechanism.

2. 发明专利

JPH07235581A PROCESSING EQUIPMENT AND TRANSFER METHOD 失效
公开(公告)号：JPH07235581A
公开(公告)日：1995-09-05
申请号：JP27708794
申请日：1994-10-17
申请人： TOKYO ELECTRON LTD , TEL KYUSHU KK
发明人： SAKAMOTO YASUHIRO , AKUMOTO MASAMI
IPC分类号： B65G49/07 , H01L21/027 , H01L21/677 , H01L21/68
摘要： PURPOSE:To enable transfer without exchanging arms, smoothly deliver an object to be treated to each treatment mechanism and enable effectively a series of treatments, by enabling selecting either one of a supporting means or a holding means in each treatment process, and controlling and changing the operation range of the arms. CONSTITUTION:In a processing equipment having a plurality of processing equipments which perform processing on wafers and a transferring mechanism which transfers wafers to the processing equipments, the transferring mechanism is provided with a retaining means 61 which retains the peripheral part of a wafer at a plurality of parts, and an arm 59 having a holding means which has at lest one suction part 61 which is made to abut against the lower surface in the vicinity of the periphery of the wafer and holds the wafer.

3. 发明专利

JPH03211749A SEMICONDUCTOR MANUFACTURING DEVICE 失效
公开(公告)号：JPH03211749A
公开(公告)日：1991-09-17
申请号：JP543490
申请日：1990-01-13
申请人： TOKYO ELECTRON LTD , TEL KYUSHU KK
发明人： HIRAKAWA OSAMU , SAKAMOTO YASUHIRO , IWAKIRI YOSHIO , AKUMOTO MASAMI
IPC分类号： B65G49/07 , G03F7/20 , H01L21/027 , H01L21/312 , H01L21/677
摘要： PURPOSE:To sharply reduce the dusting from a board to be processed, occurrence and adherence of dust to the board to be processed, during its transfer by arranging the constitution such that a first transfer mechanism catches the margin of the board to be processed at plurality of points by the aid of a plurality of claws for holding the board and that a second transfer mechanism can suck the board to be processed by vacuum. CONSTITUTION:A wafer holder 50 is provided with a ring-shaped supporting frame 52 at the top of an arm 51. Three pieces of supporting members 60 are attached at approximately regular intervals to the supporting frame 52 so that the supporting members at the tops may project inward from the supporting frame 52. It is to be desired that these supporting members 60 should be made of material which hardly produce dust and is small in thermal conductivity. The suction pinsette 204 of a cassette station 200 sucks and holds by vacuum the substance to be processed at the suction face 22, which is provided at the top of a pinsette body 21 and whose contact area with a wafer W is made extremely small, so the mutual contact area with the substance to be processed becomes small, and the dust occurrence at the time of holding the substance to be processed with this suction pinsette 204 can be reduced.

4. 发明专利

JPH02164050A DEVICE FOR MANUFACTURE SEMICONDUCTOR 失效
公开(公告)号：JPH02164050A
公开(公告)日：1990-06-25
申请号：JP32028288
申请日：1988-12-19
申请人： TOKYO ELECTRON LTD , TEL KYUSHU KK
发明人： SAKAMOTO YASUHIRO , KIMURA YOSHIO
IPC分类号： H01L21/677 , H01L21/68
摘要： PURPOSE:To perform carrying-out and carrying-in movements of treated substances with certainty even though a distortion and a warp and the like develop in a housing vessel by controlling movements of the carrying-out and carrying-in mechanism for the treated substances on the basis of the position information of the stored substances to be treated. CONSTITUTION:A wafer map is prepared by detecting in advance semiconductor wafers 2 in a wafer carrier 21 through a wafer detecting mechanism 32 and then, ascent and descent control of a carrier going up and down mechanism 30 is performed on the basis of the wafer map information. Then, even though the development of distortions land warps in the wafer carrier 21 makes the disposition of the semiconductor wafer ununiform, going up and down movements of the wafer carrier 21 are controlled in consideration of the foregoing distortions and warps in the wafer carrier. This approach improves the reliability of carrying-in movements of wafers and enables one to perform going up and down control of the carrier with high accuracy.

5. 发明专利

JP2011155081A Flow rate measuring device and flow rate measuring method 有权
标题翻译：流量测量装置和流量测量方法
公开(公告)号：JP2011155081A
公开(公告)日：2011-08-11
申请号：JP2010014725
申请日：2010-01-26
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： SAKAMOTO YASUHIRO
IPC分类号： H01L21/027 , B05C11/00 , B05C11/08 , G01F1/00 , G01F1/708 , G01P5/20
摘要： PROBLEM TO BE SOLVED: To provide a flow rate measuring device and a flow rate measuring method capable of stably measuring a flow rate of exhaust from an exhaust path. SOLUTION: In the flow rate measuring device 8 measuring the flow rate of the exhaust from the exhaust path, a mist feeder 81 feeds the inside of the exhaust path 7 with mist. In the flow rate measuring device, an imaging portion 82 image the exhaust path 7 positioned downstream than the mist feeder 81 while an estimator 200 estimates the flow rate of the exhaust on the basis of the result of imaging the mist fed from the mist feeder 81 by the imaging portion 82. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够稳定地测量排气通道的排气流量的流量测量装置和流量测量方法。解决方案：在测量排气通道排气流量的流量测量装置8中，雾气馈送器81将喷射通道7的内部喷入雾中。在流量测量装置中，成像部分82将位于下游的排气路径7成像，同时估计器200基于从雾化供给器81供给的雾的成像结果来估计排气流量通过成像部分82.版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2001085323A THERMAL TREATMENT METHOD AND THERMAL TREATMENT APPARATUS 失效
公开(公告)号：JP2001085323A
公开(公告)日：2001-03-30
申请号：JP2000218484
申请日：2000-07-19
申请人： TOKYO ELECTRON LTD
发明人： AKUMOTO MASAMI , SAKAMOTO YASUHIRO , HARADA KOJI
IPC分类号： G03F7/38 , H01L21/027 , H01L21/205
摘要： PROBLEM TO BE SOLVED: To reduce heating/cooling time of a plate-type treatment object, make the surface temperature distribution of the treatment object uniform and improve the production yield of the treatment object. SOLUTION: A heater 23 is embedded in a placing table 24, on which a semiconductor wafer W is placed so as to heat up the semiconductor wafer W to a prescribed temperature. A shutter 26 is formed outside the placing table 24, to surround it so as to be movable relative to it. A support pin 32, by which the semiconductor wafer W, is moved onto the placing table 24 or to a position above the placing table 24 is provided, and a cooling temperature adjustment unit 40 which can advance/retreat toward/from the semiconductor wafer W placed above the placing table 24 by the support pin 32 is provided. With this constitution, after the semiconductor wafer 32, which is subjected to a heating treatment on the placing table 24, is moved to a position above the placing table 24, the cooling temperature adjustment unit 40 is moved toward the semiconductor wafer W to cool down the semiconductor wafer W to a prescribed temperature.

7. 发明专利

JPH0897134A APPLICATOR 失效
公开(公告)号：JPH0897134A
公开(公告)日：1996-04-12
申请号：JP25915494
申请日：1994-09-29
申请人： TOKYO ELECTRON LTD , TEL KYUSHU KK
发明人： FUJIMOTO AKIHIRO , SAKAMOTO YASUHIRO
IPC分类号： G03F7/16 , B05C11/08 , B05C11/10 , H01L21/027 , H01L21/683 , H01L21/68
摘要： PURPOSE: To improve the maintenance property by removing the solidification or clogging of processing liquid within a cup for recovering the processing liquid scattering from a board to be processed. CONSTITUTION: A circular cup CP is arranged at the center of the bottom of a unit, and a spin chuck 52 is arranged inside of it. Within the cup CP are defined one chamber by the outer peripheral wall face, the inner peripheral wall, and the bottom, and at the bottom is provided one or many drain ports 56. This drain port 56 is connected to a tank 72 through a drain pipe 70. The tank 72 is a sealed container, and the drain port 72a is provided at the bottom, and an exhaust port 72b is provided at the topside, and they are connected to a drain processor and an exhaust pump, respectively, through pipes 74 and 76.

8. 发明专利

JPH05234867A 失效
公开(公告)号：JPH05234867A
公开(公告)日：1993-09-10
申请号：JP7317292
申请日：1992-02-25
申请人： TOKYO ELECTRON LTD , TEL KYUSHU KK
发明人： FUJIMOTO AKIHIRO , SAKAMOTO YASUHIRO , TAKEKUMA TAKASHI
IPC分类号： G03F7/16 , H01L21/027 , H01L21/30
摘要： PURPOSE:To uniformly supply a processing liquid to a processing object by controlling atmospheric temperature around the processing object. CONSTITUTION:A processing apparatus for processing a processing object W by supplying a processing liquid to the surface thereof comprises a circulating path 32 of constant temperature fluid which circulates the constant temperature fluid around a processing object W and a heat exchange means 35 for heat exchange between the constant temperature fluid within the circulating path 32 and atmosphere A flowing into the periphery of the processing object. Thereby, the atmosphere A flowing into the periphery of the processing object is heat-exchanged successfully with the constant temperature fluid for the purpose of temperature adjustment. The periphery of processing object can be temperature-controlled by the temperature-controlled atmosphere A.

9. 发明专利

JPH04155848A RESIST TREATER 失效
公开(公告)号：JPH04155848A
公开(公告)日：1992-05-28
申请号：JP28079990
申请日：1990-10-19
申请人： TOKYO ELECTRON LTD , TEL KYUSHU KK
发明人： SAKAMOTO YASUHIRO , AKUMOTO MASAMI
IPC分类号： H01L21/677 , H01L21/027 , H01L21/68
摘要： PURPOSE:To increase the transfer speed of a material to be treated and to make it possible to contrive the improvement of a throughput by a method wherein a resist treater is provided with a plurality of treating units and a transfer mechanism for carrying-in or carrying-out the material to be treated in or from these units and a servo motor is used for the drive part of the transfer mechanism. CONSTITUTION:In a drive part of a transfer unit 12, an AC servo motor 12c is used for a drive source of an X drive part 12b which moves a wafer tweezers 12a in a direction X. When the tweezers 12a is inserted under the lower part of a semiconductor wafer 10, a stage pin 16a is made to descend and the wafer 10 on the pin 16a is delivered to the tweezers 12a. After this, the wafer 10 is transferred in order to prescribed treating units 11a to 11f and a prescribed treatment is performed. When the length in the direction X of a treatment part 2 is long, the transfer distance of the wafer 10 using the tweezers 12a becomes longer. As the motor 12c is used for the drive source of the drive part 12b, a large acceleration/deceleration torque can be generated and a high- speed response is possible. A throughput is improved as the whole resist treater 1.

10. 发明专利

JP2012119536A Coating device, coating method and storage medium 审中-公开
标题翻译：涂料装置，涂料方法和储存介质
公开(公告)号：JP2012119536A
公开(公告)日：2012-06-21
申请号：JP2010268778
申请日：2010-12-01
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： TAKAYANAGI YASUHARU , HATAKEYAMA SHINICHI , YOSHIHARA KOSUKE , KONDO YOSHIHIRO , SAKAMOTO YASUHIRO , KAWAHARA KOZO
IPC分类号： H01L21/027 , B05C9/14 , B05C11/08 , B05D1/40 , B05D3/00
CPC分类号： G03F7/162 , G03F7/16
摘要： PROBLEM TO BE SOLVED: To provide a technology which ensures high in-plane uniformity in the thickness of a coating film formed on a substrate by spin coating.SOLUTION: The in-plane film thickness distribution of a wafer W is determined according to a processing recipe including the type of resist liquid and the transition pattern of the number of revolutions of the wafer W. Coating of the wafer W with resist by using the processing recipe not including irradiation by means of an LED 41 is performed previously, and the in-plane film thickness distribution of the wafer W is determined. A recess 8 in the in-plane film thickness distribution of the wafer W is grasped in advance, and the position of the recess 8 in the film thickness distribution is irradiated by means of the LED 41 and that part on the wafer W is heated locally.
摘要翻译：要解决的问题：提供通过旋涂确保在基板上形成的涂膜的厚度在面内均匀性高的技术。＆lt; P＆gt;解决方案：根据包括抗蚀剂液体的类型和晶片W的转数的转变图案的处理配方，确定晶片W的面内膜厚分布。具有抗蚀剂的晶片W的涂布通过使用不包括通过LED 41照射的处理配方，预先进行了晶片W的面内膜厚分布。预先抓住晶片W的面内膜厚分布中的凹部8，利用LED41照射凹部8的膜厚分布的位置，将该晶片W上的部分局部加热。版权所有（C）2012，JPO＆INPIT

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