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1. 发明公开

KR20180051398A 열교환 매체 공급 장치 및 기판 처리 장치 审中-公开
公开(公告)号：KR20180051398A
公开(公告)日：2018-05-16
申请号：KR20170146510
申请日：2017-11-06
申请人： TOKYO ELECTRON LTD
发明人： HIROKI TSUTOMU
IPC分类号： H01L21/67
CPC分类号： H01J37/32724 , F28D7/0066 , F28D7/12 , F28F27/02 , H01J37/32091 , H01J37/32467 , H01J37/32495 , H01L21/67103 , H01L21/67109 , H01L21/67248 , H01L21/6831 , H01L21/6833
摘要： 온도가상이한 2개의열교환매체를스테이지에교대로공급하는공급장치를제공한다. 공급장치는하나이상의밸브장치를구비한다. 하나이상의밸브장치의각각은통 형상의하우징및 축체를갖는다. 하우징은제 1 내지제 2 입구, 및제 1 내지제 2 출구를제공한다. 제 1 내지제 2 입구는각각제 1 내지제 2 매체온도조절기에접속되어있다. 제 1 내지제 2 출구는스테이지의대응존에접속되어있다. 축체는하우징내에삽입되어있다. 축체에는제 1 공급홈 및제 2 공급홈이형성되어있다. 축체의중심축선주위의회전각도위치가제 1 각도범위에있을때, 제 1 공급홈이제 1 입구와제 1 출구를접속하고, 축체의중심축선주위의회전각도위치가제 2 각도범위에있을때, 제 2 공급홈이제 2 입구와제 2 출구를접속한다.

2. 发明公开

KR20180055721A 스테이지 및 기판 처리 장치 审中-公开
公开(公告)号：KR20180055721A
公开(公告)日：2018-05-25
申请号：KR20170151482
申请日：2017-11-14
申请人： TOKYO ELECTRON LTD
发明人： HIROKI TSUTOMU
IPC分类号： H01L21/683 , H01L21/67
CPC分类号： H02N13/00 , F28D1/04
摘要： 본발명의과제는스테이지에있어서의열교환매체와정전척 사이의열교환의효율을높이는것이다. 일태양에따른스테이지는, 열교환기와, 열교환기상에마련되고서로대향하는제 1 주면및 제 2 주면을갖는플레이트로서, 그판두께방향으로연장되는복수의관통구멍이형성된, 상기플레이트와, 기판이탑재되는표면및 이면을갖는정전척으로서, 이면이제 1 주면에접착된, 상기정전척을구비하고, 열교환기는복수의관통구멍에대해서노출되는이면의복수의영역에대면하는복수의개구단을각각제공하는복수의제 1 관과, 복수의관통구멍에각각연통하는복수의제 2 관을포함한다.

3. 发明专利

AU2003231451A1 SUBSTRATE PROCESSING DEVICE 未知
公开(公告)号：AU2003231451A1
公开(公告)日：2003-11-11
申请号：AU2003231451
申请日：2003-05-09
申请人： TOKYO ELECTRON LTD
发明人： MATSUOKA TAKAAKI , IWABUCHI KATSUHIKO , ISHIZAWA SHIGERU , HIROKI TSUTOMU
IPC分类号： H01L21/00 , H01L21/68 , B65G49/07
摘要： Processing chambers (3A-3F) for applying a process to a substrate W housed therein are provided at a periphery of a conveying chamber 2. A conveying case (4) houses the substrate (W) in a state isolated from an outside atmosphere. The conveyance case (4) has a gate valve (30) and a transfer mechanism (22). A conveying mechanism (5) supports the conveyance case 4, and carries the conveyance case (4) to a position for conveying in/conveying out a substrate. The number of processing chambers connectable to a conveying chamber is not limited, and conveyance to the processing chamber can be executed while maintaining a predetermined ambience for an atmosphere of a substrate that is to be processed.

4. 发明专利

AT380314T 未知
公开(公告)号：AT380314T
公开(公告)日：2007-12-15
申请号：AT06007596
申请日：2006-04-11
申请人： TOKYO ELECTRON LTD
发明人： HIROKI TSUTOMU
IPC分类号： F16K51/02 , F16K31/528
摘要： A gate valve apparatus includes a valve body (52) to open and close a target object transfer port (37) in a vacuum processing system. The valve body (52) is reciprocated in a first direction relative to the transfer port (37). A support rod (54) is connected to the valve body (52) and extends in the first direction. A driving mechanism (56) is configured to drive the valve body (52) through the support rod (54). The driving mechanism (56) includes a movable shaft structure (75) reciprocated in a second direction perpendicular to the first direction. A first cam structure (82, 106) coupling the movable shaft structure (75) to the support rod (54) includes a portion (106A) that converts reciprocation movement of the movable shaft structure (75) in the second direction into reciprocation movement of the support rod (54) in the first direction. A swing drive (80, 116) is configured to swing the support rod (54) and valve body (52) about the central axis of the movable shaft structure (75).

5. 发明专利

CH698528B1 Schiebereinrichtung eines Vakuumprozesssystems. 未知
公开(公告)号：CH698528B1
公开(公告)日：2009-08-31
申请号：CH19972005
申请日：2005-12-16
申请人： TOKYO ELECTRON LTD
发明人： HIROKI TSUTOMU
IPC分类号： F16K51/02 , F16K1/24 , H01L21/00
摘要： Eine Schiebereinrichtung eines Vakuumprozesssystems besitzt eine umgebende Wand (36), welche einen Übergaberaum definiert, und besitzt einen Übergabeanschluss (37). Ein erster Ventilsitz (37s) ist um den Übergabeanschluss angeordnet. Ein Ventilkörper (44) ist innerhalb der Wand beweglich angeordnet um den Übergabeanschluss zu öffnen und zu schliessen. Ein erstes Dichtungselement (66) ist auf dem Ventilkörper angeordnet um mit dem ersten Ventilsitz zusammenzuwirken. Ein Wartungsanschluss (72) ist in der Wand ausgeformt um eine Wartung des ersten Dichtungselements durchzuführen. Ein zweiter Ventilsitz (72s) ist um den Wartungsanschluss angeordnet. Ein zweites Dichtungselement (68) ist am Ventilkörper um das erste Dichtungselement angeordnet um mit dem zweiten Ventilsitz zusammenzuwirken. Ein Wartungsdeckel (74) ist aussen abnehmbar angeordnet, um den Wartungsanschluss zu schliessen. Ein Antriebsmechanismus (46) treibt den Ventilkörper innerhalb der Wand an.

6. 发明专利

DE602006000287D1 未知
公开(公告)号：DE602006000287D1
公开(公告)日：2008-01-17
申请号：DE602006000287
申请日：2006-04-11
申请人： TOKYO ELECTRON LTD
发明人： HIROKI TSUTOMU
IPC分类号： F16K51/02 , F16K31/528
摘要： A gate valve apparatus includes a valve body (52) to open and close a target object transfer port (37) in a vacuum processing system. The valve body (52) is reciprocated in a first direction relative to the transfer port (37). A support rod (54) is connected to the valve body (52) and extends in the first direction. A driving mechanism (56) is configured to drive the valve body (52) through the support rod (54). The driving mechanism (56) includes a movable shaft structure (75) reciprocated in a second direction perpendicular to the first direction. A first cam structure (82, 106) coupling the movable shaft structure (75) to the support rod (54) includes a portion (106A) that converts reciprocation movement of the movable shaft structure (75) in the second direction into reciprocation movement of the support rod (54) in the first direction. A swing drive (80, 116) is configured to swing the support rod (54) and valve body (52) about the central axis of the movable shaft structure (75).

7. 发明公开

EP1482545A4 SUBSTRATE SUPPORT MECHANISM FOR SEMICONDUCTOR PROCESSING SYSTEM 审中-公开
标题翻译：衬底载体机构半导体加工系统
公开(公告)号：EP1482545A4
公开(公告)日：2009-08-26
申请号：EP03703076
申请日：2003-01-29
申请人： TOKYO ELECTRON LTD
发明人： HIROKI TSUTOMU , SAEKI HIROAKI
IPC分类号： B65G49/00 , H01L21/68 , H01L21/677 , H01L21/687
CPC分类号： H01L21/68742 , H01L21/68 , H01L21/68714 , H01L21/6875 , Y10S414/139
摘要： A substrate support mechanism (12A) in a semiconductor processing system used for transferring a processed substrate (W) in association with a conveying arm (32), comprising first and second holding parts (38A to 38C, 40A to 40C) liftable and exchangeable the substrate with the conveying arm and first and second drive parts (46, 48) for lifting the first and second holding parts, and a control part (68) for controlling the first and second drive parts, wherein the first and second holding parts are vertically movable relative to each other without spatially interfering with each other and disposed so as to hold the substrate having a substantially same horizontal coordinate, and the control part controls the first and second drive parts so as to selectively hold the substrate by the first and second holding parts.

8. 发明公开

EP1657743A4 TRANSFER APPARATUS AND DRIVING MECHANISM 有权
标题翻译：传输装置和传动装置
公开(公告)号：EP1657743A4
公开(公告)日：2011-10-05
申请号：EP04747644
申请日：2004-07-09
申请人： TOKYO ELECTRON LTD
发明人： SAEKI HIROAKI , ISHIZAWA SHIGERU , SHINDO TAKEHIRO , HIROKI TSUTOMU , MACHIYAMA WATARU
IPC分类号： H01L21/68 , B25J9/04 , B25J9/10 , H01L21/687
CPC分类号： H01L21/67742 , B25J9/042 , B25J9/107 , H01L21/68707 , Y10T74/20305

9. 发明公开

EP1898445A4 CONVEYING EQUIPMENT OF ARTICLE TO BE PROCESSED 审中-公开
标题翻译：输送机制造到条的
公开(公告)号：EP1898445A4
公开(公告)日：2011-08-10
申请号：EP06766987
申请日：2006-06-20
申请人： TOKYO ELECTRON LTD
发明人： MACHIYAMA WATARU , ISHIZAWA SHIGERU , KOIZUMI HIROSHI , HIROKI TSUTOMU , KONDOH KEISUKE
IPC分类号： H01L21/677
CPC分类号： H01L21/67745 , H01L21/67276 , H01L21/67742

10. 发明公开

EP1608002A4 GATE VALVE FOR SEMICONDUCTOR TREATMENT SYSTEM AND VACUUM CONTAINER 有权
标题翻译：闸阀用于半导体处理系统和真空罐
公开(公告)号：EP1608002A4
公开(公告)日：2008-08-06
申请号：EP04715563
申请日：2004-02-27
申请人： TOKYO ELECTRON LTD
发明人： HIROKI TSUTOMU
IPC分类号： B65G49/00 , B01J3/00 , B01J3/02 , F16K3/02 , F16K51/02 , H01L21/00 , H01L21/02 , H01L21/677 , H01L21/68
CPC分类号： H01L21/67126 , F16K3/029 , F16K51/02 , Y10S414/135 , Y10S414/139
摘要： A gate valve (20) for a semiconductor treatment system, comprising a housing (21) forming a plurality of passages (22A to 22D) arranged parallel with each other along a first direction, the passages further comprising ports (23A to 23D) facing a first specified side in a second direction orthogonal to the first direction. Valve seats (25A to 25D) are disposed on the ports at more backward positions in the second direction as the valve seats are positioned nearer the second specified side in the first direction. A plurality of valve plates (24A to 24D) opening and closing the ports are disposed parallel with each other in the second direction. The valve plates are slid by drive mechanisms (30A to 30D).

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