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1. 发明专利

JPH0633479B2 失效
公开(公告)号：JPH0633479B2
公开(公告)日：1994-05-02
申请号：JP19162486
申请日：1986-08-18
申请人： TOKUYAMA SODA KK
发明人： TAKADA KUNIAKI , IZEKI JUJI , TAKESUE MASAHIRO , KAWAHARA TAKEO
IPC分类号： C25B9/00 , C25B1/46 , C25B9/08 , C25B13/08

2. 发明专利

JPH03278592A MANUFACTURE OF PRINTED WIRING BOARD 失效
公开(公告)号：JPH03278592A
公开(公告)日：1991-12-10
申请号：JP7709190
申请日：1990-03-28
申请人： TOKUYAMA SODA KK
发明人： KAWAHARA TAKEO , SAWACHI SHINJI , MATSUBARA KUNIO
IPC分类号： H05K3/28 , H05K3/22 , H05K3/34
摘要： PURPOSE:To make it possible to obtain a highly reliable printed wiring board by allowing an expansible resist to exist between board soldering conductors having a plurality of soldering conductors corresponding to leads of electronic components, and expanding the expansible resist. CONSTITUTION:A glass epoxy copper-foiled laminated board is used where wiring patterns with soldering conductors 2 arrayed on a board 1, are formed on the surface. The surface of the board which contains soldering conductors, is coated with expansible resist ink. Then, after the coating, it is tentatively hardened so that an expansible resist 3 may exist between the soldering conductors 2. The surface which comprises the soldering conductors 2 and the expansible resist 3, is smoothly ground. After the expansible resist 3 is arranged to exist between the soldering conductors 2, the expansible resist is heated and expanded so that it may be completely hardened.

3. 发明专利

JPH02298357A ION EXCHANGE RESIN BODY AND UTILIZATION THEREOF 失效
公开(公告)号：JPH02298357A
公开(公告)日：1990-12-10
申请号：JP11605089
申请日：1989-05-11
申请人： TOKUYAMA SODA KK
发明人： OMURA NOBUHIKO , IHARA TAKAFUMI , KAWAHARA TAKEO , TANAKA SHINSUKE
IPC分类号： C08J5/20 , B01J41/14
摘要： PURPOSE:To enhance ion exchange efficiency and to also enhance current efficiency in a film state by using bis(vinylphenyl)alkane as a crosslinking agent of an ion exchange resin body. CONSTITUTION:In the preparation of a spherical or film-like ion exchange resin body, bis(vinylphenyl)alkane is used as a crosslinking agent suppressing the swelling pressure of the resin body as a constituent component. Whereupon, bis(vinylphenyl)alkane allows an ion exchange group in the vicinity of a crosslinking point to act effectively as compared with divinylbenzene. Therefore, the spherical ion exchange rosin body using this compound has high ion exchange efficiency and, when the film-like ion exchange resin body is used to concentrate seawater in an electrodyalytic cell, current efficiency becomes high and osmotic pressure is lowered.

4. 发明专利

JPH04122086A EMI COUNTERMEASURE WIRING BOARD AND ITS MANUFACTURING METHOD THEREOF 失效
公开(公告)号：JPH04122086A
公开(公告)日：1992-04-22
申请号：JP24125990
申请日：1990-09-13
申请人： TOKUYAMA SODA KK
发明人： KAWAHARA TAKEO , MIYAZAKI JUNICHI
IPC分类号： H05K9/00 , H05K1/02 , H05K1/09 , H05K3/00 , H05K3/46
摘要： PURPOSE:To obtain sufficient radiation noise reduction effect by a method wherein an insulating layer and a conductive layer solder-resist layer made of conductive copper paste are successively coated on via holes. CONSTITUTION:On front and/or rear surface(s) of an insulating board made of epoxy resin, a plurality of conductive layers 2 made of copper and insulating layers 3 on which a wiring pattern is formed are laminated by one layer or alternately in such a condition that the insulating layer 3 partially covers the conductive layer 2. Further, a conductive layer 4 made of conductive copper paste and a solder-resist layer 5 which are electrically connected to an earthing circuit in the conductive layer 2 are successively laminated. At this time, a via hole 7 in 'the conductive layer 2 on which the wiring pattern' adjacent to the conductive layer 4 is formed are also coated with the insulating layer 3, the conductive layer 4 and the solder-resist layer 5 in order. When the insulating layer is formed on the via hole 7, the entire front and rear surfaces of the board are coated, exposed and developed in such a condition that the via hole is filled with a liquefied photoresist.

5. 发明专利

JPS643140A FLUORODIVINYL ETHER COMPOUND AND PRODUCTION THEREOF 失效
公开(公告)号：JPS643140A
公开(公告)日：1989-01-06
申请号：JP15761187
申请日：1987-06-26
申请人： TOKUYAMA SODA KK
发明人： IZEKI YUJI , TAKESUE MASAHIRO , TAKADA KUNIAKI , KAWAHARA TAKEO
IPC分类号： C07C51/377 , C07C41/00 , C07C41/18 , C07C43/17 , C07C51/00 , C07C59/135 , C07C59/60 , C07C67/00 , C07C67/32 , C07C69/708 , C07C231/12 , C07C235/04 , C07C301/00 , C07C303/22 , C07C303/30 , C07C303/40 , C07C309/10 , C07C309/68 , C07C309/82 , C07C311/10 , C07C311/23 , C07C313/00 , C07C323/12 , C08F16/32
摘要： NEW MATERIAL:The fluorodivinyl ether compound of formula I (X is an acid group, a group convertible to acid group or halogen; k is integer of >=1; l, m and n are independently integer of >=0). EXAMPLE:The compound of formula II. USE:A raw material monomer for an ion exchange membrane satisfying high ion exchange capacity and high crosslinking density at the same time. PREPARATION:The compound of formula I can be produced by the thermal decomposition of a fluorodicarbonyl compound of formula III [A is F or OA' (A' is alkali metal or hydrocarbon residue)].

6. 发明专利

JPS63305593A MANUFACTURE OF PRINTED WIRING SUBSTRATE 失效
公开(公告)号：JPS63305593A
公开(公告)日：1988-12-13
申请号：JP14169687
申请日：1987-06-06
申请人： TOKUYAMA SODA KK
发明人： SHIMAMOTO TOSHIJI , KAWAHARA TAKEO , YAMAMURA TAKESHI
IPC分类号： H05K3/46
摘要： PURPOSE:To make this substrate applicable to a wiring substrate for high-speed signal processing, by using a copper foil on a surface of a copper-stuck laminated plate so as to form a signal layer and next using outer wiring pattern layers made of conductive paste so as to form power source and/or earth layers. CONSTITUTION:In a printed wiring substrate 10 formed of a plurality of wiring pattern layers by using conductive paste 12 on one side or both sides of a copper stuck laminated plate 4B, a copper foil 3 on the surface of the copper stuck laminated plate 4B is used to form a signal layer 3X, and a plurality of wiring pattern layers are used to form power source and/or earth layers 12X. Accordingly a resistance value of the conductive paste 12 can be neglected. Further when the copper foil 3 low in its resistance value is used as the signal layer 3X, a multilayer printed substrate 10 of simple composition can be realized to be applicable to a wiring substrate for high-speed signal processing.

7. 发明专利

JPS6337134A FLUORINE-CONTAINING ION EXCHANGE MEMBRANE 失效
公开(公告)号：JPS6337134A
公开(公告)日：1988-02-17
申请号：JP18019186
申请日：1986-08-01
申请人： TOKUYAMA SODA KK
发明人： TAKADA KUNIAKI , TAKESUE MASAHIRO , IZEKI YUJI , KAWAHARA TAKEO
IPC分类号： C08J5/22 , C25B13/08 , H01M2/16 , H01M8/02
摘要： PURPOSE:To obtain a fluorine-containing ion exchange membrane, by using a reinforcing material constituted of porous fibers consisting of a fluorine- containing polymer, having a low electrolytic voltage, improve mechanical properties, e.g. flex resistance, tensile strength, etc., and suitable as diaphragms for electrolytic reduction, etc. CONSTITUTION:A fluorine-containing divinyl compound, e.g. a compound expressed by the formula, and fluorine-containing vinyl compound having ion exchange groups or functional groups convertible into the ion exchange groups are polymerized in the presence of a reinforcing material constituted of porous fibers, consisting of a fluorine-containing polymer, e.g. tetrafluoroethylene homopolymer, etc., and having 0.01-10mum pore diameter and 10-95% porosity.

8. 发明专利

JPS62153257A PRODUCTION OF PERFLUOROMONOESTER CARBOXYLIC ACID CHLORIDE 失效
公开(公告)号：JPS62153257A
公开(公告)日：1987-07-08
申请号：JP29199185
申请日：1985-12-26
申请人： TOKUYAMA SODA KK
发明人： KAWAHARA TAKEO , TAKESUE MASAHIRO
IPC分类号： C07C69/62 , C07C67/14
摘要： PURPOSE:To obtain a compound useful as a synthetic intermediate for various fluorine-containing compounds in high yield with good selectivity, by reacting a perfluorodicarboxylic acid dichloride with an alcohol in an inert solvent. CONSTITUTION:A perfluorodicarboxylic acid dichloride is reacted with an alco hol in an inert polar solvent, e.g. polyakylene ether such as ethylene glycol dimethyl ether or alkylnitrile such as acetonitrile, etc., at -80-+100 deg.C, prefer ably -50-+50 deg.C to afford the aimed substance. The solvent is used in an amount of 0.01-10, preferably 0.1-1 expressed in terms of dilution ratio (l/mol) based on the total amount of the alcohol to the perfluorodicarboxylic acid dichloride is preferably 0.1-2.0 to carry out the reaction.

9. 发明专利

JPH06310893A EMI COUNTER WIRING BOARD 失效
公开(公告)号：JPH06310893A
公开(公告)日：1994-11-04
申请号：JP9596893
申请日：1993-04-22
申请人： TOKUYAMA SODA KK
发明人： KAWAHARA TAKEO
IPC分类号： H05K1/02 , H05K1/09 , H05K3/46 , H05K9/00
摘要： PURPOSE:To increase wiring density and reduce noise, by directly laminating a symbol ink layer on the peripheral part of a conducting part for soldering a wiring pattern on the upper surface of an insulative board or an insulating layer or a conducting layer of conductive copper paste. CONSTITUTION:A conducting layer 2 wherein a pad part 7 for soldering as a soldering conducting part and a wiring pattern containing a through hole part 8 and an earth circuit 6 are formed is arranged on an insulative board 1. An insulating layer 3 is formed so as to cover the conducting layer 2. A conducting layer 4 composed of conductive copper paste which covers the insulating layer 3 is formed, and a part of the layer 14 electrically connects the conducting layer 2 with the earth circuit. A symbol ink layer 5 is laminated on the peripheral parts of the pad 7 for component, and the through hole 8 on the upper surface of the conducting layer 4 or the insulating layer 3 or the insulative board 1. Thereby a solder bridge is not generated at the time of component mount, and noise reduction effect can be effectively exhibited.

10. 发明专利

JPH0543704B2 失效
公开(公告)号：JPH0543704B2
公开(公告)日：1993-07-02
申请号：JP18282986
申请日：1986-08-05
申请人： TOKUYAMA SODA KK
发明人： KAWAHARA TAKEO , TAKADA KUNIAKI
IPC分类号： C07D327/02 , C07C67/00 , C07C301/00 , C07C303/22 , C07C309/79

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