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1. 发明申请

WO2010082820A3 A NON-INVASIVE CHEMICAL SENSOR, A SKIN PATCH, A PACKAGING MATERIAL AND A MONITORING SYSTEM USING THE SAME 审中-公开
标题翻译：非侵入性化学传感器，皮肤贴剂，包装材料和使用该包装材料的监测系统
公开(公告)号：WO2010082820A3
公开(公告)日：2010-12-02
申请号：PCT/NL2010050015
申请日：2010-01-13
申请人： TNO , VAN DEN BRAND JEROEN , SHARPE RUBEN BERNARDUS ALFRED , KOETSE MARINUS MARC
发明人： VAN DEN BRAND JEROEN , SHARPE RUBEN BERNARDUS ALFRED , KOETSE MARINUS MARC
IPC分类号： A61B5/00
CPC分类号： G01N33/521 , A61B5/14514 , A61B5/14521 , A61B5/14532 , A61B5/14546 , A61B5/1486 , A61B5/6833
摘要： The invention relates to a non-invasive chemical sensor 10 for detecting a substance present on an object, comprising a surface conceived to be arranged in contact with the object, wherein the surface is formed by a soft porous material comprising a chemical reagent arranged to undergo a chemical interaction with the substance. A surface area of the sensor 10 may be divided into a suitable number of compartments, which may be arranged as a matrix having a number of columns C1, ..., Cn and a number of rows R1, ..., Rn. It will be appreciated that the compartments, alternatively, may be irregularly positioned and/or they may have an irregular size. The compartments C1, ..., Cn may be arranged with the same reagent. In this case it is possible to differentiate signals originating from different compartments by means of suitable detection and data processing.
摘要翻译：本发明涉及一种用于检测物体上存在的物质的非侵入性化学传感器10，包括被设计为与物体接触的表面，其中该表面由软质多孔材料形成，该软质多孔材料包括经过与物质的化学相互作用。传感器10的表面区域可以被划分为合适数量的隔间，其可以被布置为具有多个列C1，...，Cn和行数R1，...，Rn的矩阵。应当理解，隔间可以不规则地定位和/或它们可以具有不规则的尺寸。隔室C1，...，Cn可以配置有相同的试剂。在这种情况下，可以通过适当的检测和数据处理来区分源自不同隔间的信号。

2. 发明申请

WO2011099848A3 AIR FLOW ASSISTED CHIP SELF-ASSEMBLY 审中-公开
标题翻译：空气流辅助芯片自组装
公开(公告)号：WO2011099848A3
公开(公告)日：2012-10-26
申请号：PCT/NL2011050089
申请日：2011-02-08
申请人： TNO , DIETZEL ANDREAS HEINRICH , VAN DEN BRAND JEROEN
发明人： DIETZEL ANDREAS HEINRICH , VAN DEN BRAND JEROEN
IPC分类号： H01L21/98 , G06K19/077 , H01L21/60 , H01L21/68
CPC分类号： H01L24/95 , B81C3/005 , B81C99/002 , H01L21/67721 , H01L21/68 , H01L23/13 , H01L23/4985 , H01L23/5387 , H01L24/80 , H01L24/83 , H01L25/0655 , H01L25/50 , H01L2224/80001 , H01L2224/80003 , H01L2224/80121 , H01L2224/804 , H01L2224/83121 , H01L2224/834 , H01L2224/8349 , H01L2224/95001 , H01L2224/95093 , H01L2224/95115 , H01L2224/95122 , H01L2224/95123 , H01L2224/95136 , H01L2224/95148 , H01L2924/01015 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/15151 , H01L2924/15153 , H01L2924/15165 , H01L2924/0001
摘要： The invention relates to a placement method for placement of a chip component (10) on a flexible substrate (20), comprising: providing a support face (21 ) comprised of the flexible substrate (20) or of a support structure (70) to be aligned with the flexible substrate (20); administering a chip (10) to the support face (21 ); generating with a pressure chamber (60) an air flow in an out of plane orientation relative to the support face (21); and directing the chip (10) to a placement position (30) by means of a directional structure (40) provided on the support face (21 ). In particular the chip (10) is levitated from the support face (21 ) by said air flow or by vibrational contact between the support face (21 ) and the chip (10) induced by said air flow. When the support face (21 ) is comprised by a support structure (70) distinct from the flexible substrate (20), the support face (21 ) is aligned with the flexible substrate (20). Accordingly, air cushion or intermittent contact forces (modulated in time and space using modulated micro-features) can be used to provide local interactions with the micro-part (chip) (10) so as to position micro-parts (10) with reference to micro-features arranged on the flexible substrate (20). The placement method may be applied for self-assembly of chips (10) on the flexible substrate (20), using a reel-to-reel process.
摘要翻译：本发明涉及一种用于将芯片部件（10）放置在柔性基板（20）上的放置方法，包括：提供由柔性基板（20）或支撑结构（70）组成的支撑面（21），与柔性基板（20）对准; 向所述支撑面（21）施加芯片（10）; 用压力室（60）产生相对于支撑面（21）的面外取向的空气流; 以及通过设置在所述支撑面（21）上的定向结构（40）将所述芯片（10）引导到放置位置（30）。特别地，芯片（10）通过所述空气流从支撑面（21）悬浮，或通过由所述空气流引起的支撑面（21）和芯片（10）之间的振动接触。当支撑面（21）由与柔性基板（20）不同的支撑结构（70）构成时，支撑面（21）与柔性基板（20）对准。因此，可以使用气垫或间歇接触力（使用调制的微特征在时间和空间上调制）以提供与微零件（芯片）（10）的局部相互作用，以便以参考方式定位微零件（10）涉及布置在柔性基板（20）上的微特征。放置方法可以应用于使用卷到卷工艺在芯片（10）上自组装在柔性基板（20）上。

3. 发明申请

WO2011093713A3 ASSEMBLY, COMPONENT FOR AN ASSEMBLY AND METHOD OF MANUFACTURING AN ASSEMBLY 审中-公开
标题翻译：组装件，组件的组件和制造组件的方法
公开(公告)号：WO2011093713A3
公开(公告)日：2011-09-29
申请号：PCT/NL2011050064
申请日：2011-01-31
申请人： TNO , VAN HECK GERARDUS TITUS , DE KOK MARGARETHA MARIA , VAN DEN BRAND JEROEN
发明人： VAN HECK GERARDUS TITUS , DE KOK MARGARETHA MARIA , VAN DEN BRAND JEROEN
IPC分类号： H05K3/32 , A41D1/00 , A41D27/08 , H01R13/62 , H05K3/36
CPC分类号： H05K1/0277 , G09F9/00 , G09F19/22 , H01L27/3293 , H01L31/0392 , H01L31/042 , H01L51/5203 , H01L2251/5338 , H01L2251/5361 , H01R4/04 , H01R4/70 , H01R12/7076 , H05B33/0896 , H05B33/10 , H05K1/0283 , H05K1/038 , H05K1/147 , H05K1/189 , H05K3/321 , H05K3/325 , H05K3/365 , H05K13/04 , H05K2201/029 , H05K2201/0311 , H05K2201/046 , H05K2201/083 , H05K2201/09081 , H05K2201/09281 , H05K2201/10106 , H05K2201/10287 , H05K2201/10484 , Y02E10/50 , Y10T29/4913
摘要： An assembly is provided of an electro-physical transducer (10) on a flexible foil (20) with a carrier (40). The flexible foil (20) has a first main surface (22) provided with at least a first electrically conductive track (24) connected to the electro-physical transducer and opposite said first main surface a second main surface (23) facing towards the carrier. At least a first incision (25a) extends through the flexible foil alongside said at least a first electrically conductive track, therewith defining a strip shaped portion (27) of the flexible foil that carries a portion of the at least a first electrically conductive track. The at least a first electrically conductive track is electrically connected to an electrical conductor (421) of the carrier, and the flexible foil is attached to the carrier with its strip shaped portion.
摘要翻译：在具有载体（40）的柔性箔（20）上提供电 - 物理换能器（10）的组件。所述柔性箔片（20）具有第一主表面（22），所述第一主表面（22）设置有至少第一导电轨道（24），所述第一导电轨道连接到所述电 - 物理换能器并且与所述第一主表面相对的第二主表面（23）。至少第一切口（25a）在所述至少第一导电轨道旁边延伸穿过柔性箔片，从而限定承载至少第一导电轨道的一部分的柔性箔片的条形部分（27）。至少第一导电轨道电连接到载体的电导体（421），并且柔性箔以其带状部分附着到载体。

4. 发明专利

ES2877174T3 Pantalla de longitud variable, sistema que comprende la misma y método de fabricación 未知
公开(公告)号：ES2877174T3
公开(公告)日：2021-11-16
申请号：ES16813168
申请日：2016-12-16
申请人： TNO
发明人： AMMERLAAN JOHANNES ANDREAS MARIA , ANDRIESSEN HIERONYMUS ANTONIUS JOSEPHUS MARIA , VAN HECK GERARDUS TITUS , VAN DEN BRAND JEROEN , SCHOO HARMANNUS FRANCISCUS MARIA
IPC分类号： E06B9/24 , E04F10/02 , E06B9/262
摘要： Pantalla (1) que comprende al menos un primer y un segundo elemento (27, 28) de guía alargado que se extiende en una primera dirección (D1) y una lámina (10) con una superficie frontal y una superficie trasera, teniendo dicha lámina al menos una primera y una segunda porción (11a1+11a2, 11b1+11b2) en forma de tablilla que se extienden en una segunda dirección (D2) transversal a dicha primera dirección y al menos una primera y una segunda porción (12ab, 12ab') de conexión, dicha al menos una primera y una segunda porción (11a1+11a2, 11b1+11b2) en forma de tablilla están provistas de elementos (20) fotovoltaicos que se pueden conectar a terminales externas para el suministro de energía eléctrica, siendo al menos una primera y una segunda porción en forma de tablilla que es deslizable acoplada con dichos al menos un primer y un segundo elementos de guía alargados, para permitir que dichas porciones en forma de tablilla se deslicen en dicha primera dirección a lo largo de dichos elementos de guía, en los que dicha al menos una primera y una segunda porción de conexión están configuradas para flexionarse en una dirección transversal a dicha primera y dicha segunda dirección, para permitir que la al menos una primera y una segunda porción en forma de tablilla se desplace una con respecto a la otra en dicha primera dirección, caracterizada porque dicha lámina está estructurada en dicha al menos una primera y una segunda porción en forma de tablilla y dicha al menos una primera y una segunda porción (12ab, 12ab') de conexión por secciones (13ab, 13ab', 13ab") que se extienden desde dicha superficie frontal a dicha superficie posterior a través de la lámina (10), que dejan dicha al menos una primera y una segunda porción (11a, 11b) en forma de tablilla y dicha al menos una primera y una segunda porción de conexión mutuamente integrales en la que dicha al menos una primera y una segunda porción de conexión puentean independientemente dicha al menos una primera y una segunda porción (11a1+11a2 , 11b1+11b2) en forma de tablilla en posiciones respectivas en dicha segunda dirección, en la que la suma del ancho de al menos una primera porción de conexión y una segunda porción de conexión en la segunda dirección es menor que una quinta del ancho de una porción en forma de tablilla en dicha segunda dirección.

5. 发明申请

WO2016175653A3 APPARATUS AND METHOD FOR SOLDERING A PLURALITY OF CHIPS USING A FLASH LAMP AND A MASK 审中-公开
标题翻译：使用闪光灯和面罩焊接多余的灯泡的装置和方法
公开(公告)号：WO2016175653A3
公开(公告)日：2017-01-05
申请号：PCT/NL2016050295
申请日：2016-04-26
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO
发明人： ARUTINOV GARI , SMITS EDSGER CONSTANT PIETER , VAN DEN BRAND JEROEN
IPC分类号： H01L21/60 , H01L21/67 , H01L21/683 , H01L21/98
CPC分类号： H01L24/75 , H01L21/6835 , H01L21/6836 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/97 , H01L2221/68354 , H01L2221/68381 , H01L2224/1131 , H01L2224/1132 , H01L2224/131 , H01L2224/16227 , H01L2224/75252 , H01L2224/75253 , H01L2224/7526 , H01L2224/75502 , H01L2224/75611 , H01L2224/7565 , H01L2224/75702 , H01L2224/75753 , H01L2224/75804 , H01L2224/75824 , H01L2224/759 , H01L2224/7598 , H01L2224/81005 , H01L2224/81191 , H01L2224/81192 , H01L2224/81193 , H01L2224/81224 , H01L2224/8123 , H01L2224/81815 , H01L2224/97 , H05K3/3436 , H05K3/3494 , H05K2201/0145 , H01L2924/014 , H01L2224/81 , H01L2924/00012 , H01L2924/00014
摘要： A substrate (3) and two or more different chips (la, lb) having different heating properties (e.g. caused by different dimensions (surface area and/or thickness), heat capacity (CI, C2), absorptivity, conductivity, number and/or size of solder bonds) are provided. A solder material (2) is disposed between the chips (la, lb) and the substrate (3). A flash lamp (5) generates a light pulse (6) for heating the chips (la, lb), wherein the solder material (2) is at least partially melted by contact with the heated chips (la, lb). A masking device (7) is disposed between the flash lamp (5) and the chips (la, lb) causing different light intensities (la, lb) in different areas (6a, 6b) of the light pulse (6) passing the masking device (7), thereby heating the chips (la, lb) with different light intensities (la, lb). This may compensate the different heating properties to reduce a spread in temperature between the chips (la, lb) as a result of the heating by the light pulse (6). The chips (la, lb) may be releasably carried by a chip carrier disposed between the flash lamp (5) and the substrate (3) before being positioned on the substrate (3), wherein the light (6a, 6b) of the light pulse (6) transmitted by the masking device (7) is projected onto the chips (la, lb) held by the chip carrier for heating the chips (la, lb), releasing them from the chip carrier and transferring them to the substrate (3), wherein the heated chips (la, lb) cause melting of the solder material (2) between the chips (la, lb) and the substrate (3) for attaching the chips (la, lb) to the substrate (3).
摘要翻译：具有不同加热特性（例如由不同尺寸（表面积和/或厚度），热容量（CI，C2），吸收率，电导率，数量和/或尺寸等）引起的基板（3）和两种或更多种不同的芯片（1a，或焊料接合的尺寸）。焊料材料（2）设置在芯片（1a，1b）和衬底（3）之间。闪光灯（5）产生用于加热芯片（1a，1b）的光脉冲（6），其中焊料材料（2）通过与加热的芯片（1a，1b）接触而至少部分地熔化。掩模装置（7）设置在闪光灯（5）和芯片（1a，1b）之间，在通过掩模的光脉冲（6）的不同区域（6a，6b）中引起不同的光强度（1a，1b）装置（7），从而以不同的光强度（1a，1b）加热芯片（1a，1b）。这可以补偿不同的加热特性，以便通过光脉冲（6）的加热来减小芯片（1a，1b）之间的温度扩散。在定位在基板（3）上之前，芯片（1a，1b）可以由设置在闪光灯（5）和基板（3）之间的芯片载体可释放地承载，其中光（6a，6b）由掩模装置（7）传输的脉冲（6）被投影到由芯片载体保持的用于加热芯片（1a，1b）的芯片（1a，1b）上，从芯片载体上释放它们并将其转移到基板 3），其中加热的芯片（1a，1b）引起芯片（1a，1b）和衬底（3）之间的焊料材料（2）熔化，以将芯片（1a，1b）附着到衬底（3）。

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