会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明申请
    • PASSIVE THERMAL MANAGEMENT SYSTEM
    • 被动热管理系统
    • WO2007053939A1
    • 2007-05-18
    • PCT/CA2006/001827
    • 2006-11-08
    • TIR SYSTEMS LTD.SCHICK, PhilippeJAMES, Daryl
    • SCHICK, PhilippeJAMES, Daryl
    • F28F1/12F21V15/01F21V15/06F28D1/04
    • F21V29/004F21V29/713F21V29/77F21V29/773F28D15/0266F28D15/0275F28F1/14F28F1/20F28F1/24F28F1/32F28F1/34
    • A traditional passive thermal management system can only be used effectively in a single orientation because it relies on the buoyancy of the heated air to create natural convection. A passive thermal management system is provided which includes means for transferring heat away from a heat source (10) in any orientation. The system comprises a heat pipe (14) which is thermally coupled to the heat source (10). The heat pipe (14) is capable of transferring heat away from the heat source (10), wherein this heat is transferred along the length of the heat pipe (14). Thermally coupled to the heat pipe (14) is a fin system (12), which provides a means for extraction of the heat from the heat pipe (14) and transfer of this heat to the environment thereby dissipating the heat generated at the heat source (10). The fin system (12) is configured to provide a desired level of heat transfer to the environment independent of the orientation of the thermal management system.
    • 传统的被动热管理系统只能在单一方向上有效使用,因为它依赖于热空气的浮力来产生自然对流。 提供了一种被动热管理系统,其包括用于以任何方向从热源(10)传递热量的装置。 该系统包括热耦合到热源(10)的热管(14)。 热管(14)能够将热量从热源(10)传出,其中该热量沿着热管(14)的长度传送。 与热管(14)热耦合的是翅片系统(12),其提供用于从热管(14)提取热量并将热量传递到环境的装置,从而消散在热源处产生的热量 (10)。 翅片系统(12)被配置为提供与热管理系统的取向无关的所需水平的传热到环境。
    • 3. 发明申请
    • ELECTRONIC DEVICE PACKAGE WITH AN INTEGRATED EVAPORATOR
    • 具有集成蒸发器的电子设备包装
    • WO2006105638A1
    • 2006-10-12
    • PCT/CA2006/000492
    • 2006-04-04
    • TIR SYSTEMS LTD.SCHICK, Philippe
    • SCHICK, Philippe
    • H01L23/46H01L23/02
    • F21V29/51F21V29/54F21V29/83F28D15/0275F28D15/04H01L23/3675H01L23/427H01L33/648H01L2924/0002H01L2924/12044H05K1/0203H05K1/0209H05K2201/10106H01L2924/00
    • The present invention provides an electronic device package that can be fabricated using standard package fabrication technologies while providing a desired level of thermal transfer capability to an attachable thermal management system. The electronic device package according to the present invention comprises a housing that is specifically designed to couple with an evaporator portion of a thermal management system, for example a heat pipe. One or more electronic devices are mounted in thermal contact with the evaporator portion of the thermal management system. Upon completion of the fabrication of the package using standard techniques, the evaporator portion of the electronic device package is operatively coupled with a secondary portion of the thermal management system. In this manner the electronic device package can be fabricated to incorporate a desired thermal management system, while being fabricated using standard package fabrication processes and machinery.
    • 本发明提供一种可以使用标准封装制造技术制造的电子器件封装,同时向可附接的热管理系统提供期望水平的热传递能力。 根据本发明的电子器件封装包括专门设计成与热管理系统(例如热管)的蒸发器部分连接的壳体。 一个或多个电子装置与热管理系统的蒸发器部分热接触地安装。 在使用标准技术完成封装的制造之后,电子器件封装的蒸发器部分与热管理系统的次级部分可操作地耦合。 以这种方式,可以制造电子器件封装以并入期望的热管理系统,同时使用标准封装制造工艺和机械制造。
    • 10. 发明公开
    • ELECTRONIC DEVICE PACKAGE WITH AN INTEGRATED EVAPORATOR
    • ELEKTRONISCHE BAUELEMENTEKAPSELUNG麻醉药整体蒸发器
    • EP1872401A1
    • 2008-01-02
    • EP06721749.7
    • 2006-04-04
    • Tir Systems Ltd.
    • SCHICK, Philippe
    • H01L23/46H01L23/02
    • F21V29/51F21V29/54F21V29/83F28D15/0275F28D15/04H01L23/3675H01L23/427H01L33/648H01L2924/0002H01L2924/12044H05K1/0203H05K1/0209H05K2201/10106H01L2924/00
    • The present invention provides an electronic device package that can be fabricated using standard package fabrication technologies while providing a desired level of thermal transfer capability to an attachable thermal management system. The electronic device package according to the present invention comprises a housing that is specifically designed to couple with an evaporator portion of a thermal management system, for example a heat pipe. One or more electronic devices are mounted in thermal contact with the evaporator portion of the thermal management system. Upon completion of the fabrication of the package using standard techniques, the evaporator portion of the electronic device package is operatively coupled with a secondary portion of the thermal management system. In this manner the electronic device package can be fabricated to incorporate a desired thermal management system, while being fabricated using standard package fabrication processes and machinery.
    • 本发明提供一种可以使用标准封装制造技术制造的电子器件封装,同时向可附接的热管理系统提供期望的热传递能力水平。 根据本发明的电子器件封装包括专门设计成与热管理系统(例如热管)的蒸发器部分连接的壳体。 一个或多个电子装置与热管理系统的蒸发器部分热接触地安装。 在使用标准技术完成封装的制造之后,电子器件封装的蒸发器部分与热管理系统的次级部分可操作地耦合。 以这种方式,可以制造电子器件封装以并入期望的热管理系统,同时使用标准封装制造工艺和机械制造。