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1. 发明申请

WO2016065399A1 A METHOD OF FORMING AN ENCLOSURE 审中-公开
标题翻译：形成外壳的方法
公开(公告)号：WO2016065399A1
公开(公告)日：2016-05-06
申请号：PCT/AU2015/000646
申请日：2015-10-28
申请人： THE UNIVERSITY OF MELBOURNE , NATIONAL ICT AUSTRALIA LIMITED
发明人： PRAWER, Steven , GANESAN, Kumaravelu , GARRETT, David , APOLLO, Nicholas , STACEY, Alastair , ESCUDIE, Mathilde , MEFFIN, Hamish , LICHTER, Samantha
IPC分类号： A61N1/05 , A61F2/14
CPC分类号： A61N1/375 , A61N1/36046 , B23K1/0016 , B23K1/19 , B23K26/21 , B23K26/364 , B23K35/0222 , B23K35/0238 , B23K35/0255 , B23K35/3006 , B23K35/3013 , B23K2203/50
摘要： The present disclosure provides a method of forming a hermetically sealed enclosure that comprises a diamond material. The method comprises providing first and second enclosure components comprising the diamond material and having first and second recesses, respectively, at edge portions. At least one of the first and second enclosure components has a cavity. The enclosure components have respective contact surfaces at the first and second recesses and are shaped such that an outer channel is formed by the co-operation of the first and second recesses when the first and second enclosure components are contacted at the contact surfaces to form the enclosure. The method further comprises bonding a first type of material to at least surface portions of the first and second recesses of the first and second enclosure components, respectively. The method also comprises bonding a second type of material to the first type of material so that the second type of material covers at least portions of the first type of material. The second type of material is biocompatible and suitable for forming a hermetically sealed seal. In addition, the method comprises contacting the enclosure components to form the enclosure and bonding the second type of material of the first enclosure component to the second type of material of the second enclosure component so as to form a hermetically sealed seal in the outer channel.
摘要翻译：本公开提供了形成包含金刚石材料的气密密封外壳的方法。该方法包括提供包括金刚石材料的第一和第二外壳部件，并且在边缘部分分别具有第一和第二凹部。第一和第二外壳部件中的至少一个具有空腔。外壳部件在第一和第二凹部处具有相应的接触表面，并且被成形为使得当第一和第二外壳部件在接触表面处接触时，通过第一和第二凹部的协作形成外部通道，以形成外壳。该方法还包括分别将第一类型的材料粘合到第一和第二外壳部件的第一和第二凹部的至少表面部分。该方法还包括将第二类型的材料粘合到第一类型的材料，使得第二类型的材料覆盖第一类型的材料的至少一部分。第二种类型的材料是生物相容的并且适于形成密封的密封件。此外，该方法包括使外壳部件接触以形成外壳，并将第一外壳部件的第二类型的材料接合到第二外壳部件的第二类型的材料，以便在外部通道中形成气密密封。

2. 发明申请

WO2014205489A1 A CIRCUIT BOARD COMPRISING AN INSULATING DIAMOND MATERIAL 审中-公开
标题翻译：包含绝缘金刚石材料的电路板
公开(公告)号：WO2014205489A1
公开(公告)日：2014-12-31
申请号：PCT/AU2014/000660
申请日：2014-06-25
申请人： THE UNIVERSITY OF MELBOURNE , NATIONAL ICT AUSTRALIA LIMITED
发明人： LICHTER, Samantha , APOLLO, Nicholas , GARRETT, David , GANESAN, Kumaravelu , MEFFIN, Hamish , PRAWER, Steven
IPC分类号： H05K1/00 , H01L23/00 , A61N1/00
CPC分类号： H05K1/0306 , A61N1/0543 , A61N1/36046 , H01L23/053 , H01L23/14 , H01L2224/14 , H01L2224/17 , H01L2924/0002 , H05K1/09 , H05K1/111 , H05K3/0044 , H05K3/107 , H05K3/146 , H05K2201/0323 , H05K2201/0376 , H01L2924/00
摘要： A circuit board is described. The circuit board comprises an electrically insulating diamond material having a surface. The electrically insulating diamond material has at least one recess extending into only a portion of a thickness of the electrically insulating diamond material from the surface of the electrically insulating diamond material. The circuit board also comprises an electrically conductive material located at least partially within the recess.
摘要翻译：描述电路板。电路板包括具有表面的电绝缘金刚石材料。电绝缘金刚石材料具有至少一个从电绝缘金刚石材料的表面延伸到电绝缘金刚石材料的厚度的一部分的凹部。电路板还包括至少部分地位于凹部内的导电材料。

3. 发明公开

EP3212278A1 A METHOD OF FORMING AN ENCLOSURE 有权
标题翻译：一种形成外壳的方法
公开(公告)号：EP3212278A1
公开(公告)日：2017-09-06
申请号：EP15853945.2
申请日：2015-10-28
申请人： The University of Melbourne , National ICT Australia Limited
发明人： PRAWER, Steven , GANESAN, Kumaravelu , GARRETT, David , APOLLO, Nicholas , STACEY, Alastair , ESCUDIE, Mathilde , MEFFIN, Hamish , LICHTER, Samantha
IPC分类号： A61N1/05 , A61F2/14 , B23K35/02 , A61N1/375 , B23K35/30 , B23K103/00
CPC分类号： A61N1/375 , A61N1/36046 , B23K1/0016 , B23K1/19 , B23K26/21 , B23K26/364 , B23K35/0222 , B23K35/0238 , B23K35/0255 , B23K35/3006 , B23K35/3013 , B23K2203/50
摘要： The present disclosure provides a method of forming a hermetically sealed enclosure that comprises a diamond material. The method comprises providing first and second enclosure components comprising the diamond material and having first and second recesses, respectively, at edge portions. At least one of the first and second enclosure components has a cavity. The enclosure components have respective contact surfaces at the first and second recesses and are shaped such that an outer channel is formed by the co-operation of the first and second recesses when the first and second enclosure components are contacted at the contact surfaces to form the enclosure. The method further comprises bonding a first type of material to at least surface portions of the first and second recesses of the first and second enclosure components, respectively. The method also comprises bonding a second type of material to the first type of material so that the second type of material covers at least portions of the first type of material. The second type of material is biocompatible and suitable for forming a hermetically sealed seal. In addition, the method comprises contacting the enclosure components to form the enclosure and bonding the second type of material of the first enclosure component to the second type of material of the second enclosure component so as to form a hermetically sealed seal in the outer channel.
摘要翻译：本公开提供了一种形成包括金刚石材料的气密密封外壳的方法。该方法包括提供包含金刚石材料并分别在边缘部分具有第一和第二凹陷的第一和第二外壳部件。第一和第二外壳部件中的至少一个具有空腔。外壳部件在第一凹部和第二凹部处具有相应的接触表面并且被成形为使得当第一外壳部件和第二外壳部件在接触表面处接触以形成外部通道时通过第一凹部与第二凹部的协作形成外壳。该方法还包括将第一类型的材料分别结合到第一和第二外壳部件的第一和第二凹部的至少表面部分。该方法还包括将第二类型的材料结合到第一类型的材料，使得第二类型的材料覆盖第一类型的材料的至少部分。第二种类型的材料是生物相容性的并且适合于形成气密密封。另外，该方法包括接触外壳部件以形成外壳并且将第一外壳部件的第二类型材料结合到第二外壳部件的第二类型材料，以便在外部通道中形成气密密封。

4. 发明申请

WO2019090396A1 A METHOD OF FABRICATING AN ELECTRODE STRUCTURE 审中-公开
公开(公告)号：WO2019090396A1
公开(公告)日：2019-05-16
申请号：PCT/AU2018/051210
申请日：2018-11-09
申请人： THE UNIVERSITY OF MELBOURNE
发明人： APOLLO, Nicholas , GARRETT, David
IPC分类号： A61B5/04 , A61N1/04 , H05K3/00 , G01N27/30
摘要： The present disclosure provides a method of fabricating an electrode structure. The method provides an electrically insulating substrate having a first surface, a second surface opposite the first surface, and a plurality of through-holes, each through-hole extending across a thickness of the insulating substrate. The method further comprises extruding a material sequentially or simultaneously through at least some of the through-holes resulting in a plurality of elongate electrically conductive elements extending through and protruding from the through-holes at the first surface of the electrically insulating substrate. In addition, the method comprises forming a plurality of electrically conductive regions at the second surface of the electrically insulating substrate. Each electrically conductive region is located at a respective through-hole, whereby the electrically conductive regions are electrically coupled to the elongate electrically conductive elements.

5. 发明公开

EP3706624A1 A METHOD OF FABRICATING AN ELECTRODE STRUCTURE 无效
公开(公告)号：EP3706624A1
公开(公告)日：2020-09-16
申请号：EP18876136.5
申请日：2018-11-09
申请人： The University Of Melbourne
发明人： APOLLO, Nicholas , GARRETT, David
IPC分类号： A61B5/04 , A61N1/04 , H05K3/00 , G01N27/30

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