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1. 发明申请

WO1992021047A1 METHOD OF CONNECTING OPTICAL WAVEGUIDE TO OPTICAL FIBER 审中-公开
标题翻译：将光波导连接到光纤的方法
公开(公告)号：WO1992021047A1
公开(公告)日：1992-11-26
申请号：PCT/JP1992000643
申请日：1992-05-20
申请人： THE FURUKAWA ELECTRIC CO., LTD. , NAKAMURA, Shirou , SHIMIZU, Takeo , YANAGAWA, Hisaharu , OHTA, Toshihiko , SHIGEMATSU, Takashi , OCHIAI, Toshihiro , KOBAYASHI, Koichi
发明人： THE FURUKAWA ELECTRIC CO., LTD.
IPC分类号： G02B06/30
CPC分类号： G02B6/3838 , G02B6/30 , G02B6/3839 , G02B6/3858 , G02B6/3865 , G02B6/3873 , G02B6/3885 , Y10S359/90
摘要： A method of connecting an optical waveguide to an optical fiber, in which an optical waveguide and a marker are formed at the same time on an optical waveguide substrate when patterning an optical waveguide by photolithography method, the waveguide is buried into a clad layer formed in other area than said marker, grooves for insertion pins are formed with the marker as a positional reference, and an optical waveguide module is connected to an optical fiber connector by the use of said grooves for insertion pins. In this way, an expensive positioning/setting device is no more needed and an optical waveguide can be connected to an optical fiber in alignment with each other and in an exceedingly simple manner and a short period of time.

2. 发明申请

WO1994023321A1 TERMINAL OF OPTICAL FIBER, METHOD OF ITS MANUFACTURE, AND STRUCTURE FOR CONNECTING THE TERMINAL AND OPTICAL DEVICE 审中-公开
标题翻译：光纤终端，其制造方法和连接终端和光学设备的结构
公开(公告)号：WO1994023321A1
公开(公告)日：1994-10-13
申请号：PCT/JP1994000536
申请日：1994-03-31
申请人： THE FURUKAWA ELECTRIC CO., LTD. , SHIGEMATSU, Takashi , YANAGAWA, Hisaharu , SHIMIZU, Takeo , NAKAMURA, Shiro , FUKASAWA, Kazuya , WATANABE, Tomohiro
发明人： THE FURUKAWA ELECTRIC CO., LTD.
IPC分类号： G02B06/40
CPC分类号： G02B6/4249 , G02B6/30 , G02B6/3834 , G02B6/3865 , G02B6/4237
摘要： An optical fiber terminal (10) for optically connecting an optical fiber and an optical device comprises a ferrule (11) having an abutting end (11e) which faces an optical device (20) or abuts on it and a single fiber hole or a plurality of fiber holes which are arranged in parallel at given pitches and through which the ends of optical fibers are passed and fixed with adhesive. The ferrule is a molded product of synthetic resin. At least one connecting member (12) is provided on the abutting end (11e). The linear expansion coefficient of the connecting member (12) is smaller than that of the synthetic resin constituting the ferrule.
摘要翻译：一种用于光学连接光纤和光学装置的光纤端子（10）包括：具有邻接端（11e）的套圈（11），所述邻接端（11e）面向光学装置（20）或邻接光纤装置（20）或单个光纤孔或多个的纤维孔，其以给定的间距平行布置，光纤的端部通过该光纤通过并用粘合剂固定。套圈是合成树脂的模制产品。至少一个连接构件（12）设置在抵接端（11e）上。连接构件（12）的线膨胀系数小于构成套圈的合成树脂的线膨胀系数。

3. 发明申请

WO1993019389A1 WAVEGUIDE TYPE OPTICAL PART 审中-公开
标题翻译：波导型光学部件
公开(公告)号：WO1993019389A1
公开(公告)日：1993-09-30
申请号：PCT/JP1993000314
申请日：1993-03-17
申请人： THE FURUKAWA ELECTRIC CO., LTD. , UEKI, Ken , SHIMIZU, Takeo , YANAGAWA, Hisaharu
发明人： THE FURUKAWA ELECTRIC CO., LTD.
IPC分类号： G02B06/12
CPC分类号： G02B6/132 , G02B6/12004 , G02B2006/12038 , G02B2006/12061 , G02B2006/12069 , G02B2006/12078 , G02B2006/12147 , G02B2006/12159
摘要： A waveguide type optical part as a light branching and combining device capable or reducing the wavelength dependency of the optical coupling efficiency between optical waveguides is provided. The optical part is provided with a first optical coupling member (A) consisting of optical waveguides (A1, A2) the propagation constants of which are equal to each other, a second optical coupling member B consisting of optical waveguides (B1, B2) the propagation constants of which are different from each other, and a third optical coupling member (A') consisting of optical waveguides (A'1, A'2) the propagation constants of which are equal to each other, the corresponding optical waveguides (A1, B1, A'1; A2, B2, A'2) being series-connected together.
摘要翻译：提供了作为能够或降低光波导之间的光耦合效率的波长依赖性的光分支和组合装置的波导型光学部件。光学部件设置有由光传播常数彼此相等的光波导（A1，A2）组成的第一光耦合部件（A），由光波导（B1，B2）构成的第二光耦合部件B，传播常数彼此不同的第三光耦合构件（A'）和由光传播常数彼此相等的光波导（A'1，A'2）组成的第三光耦合构件（A'），对应的光波导，B1，A'1; A2，B2，A'2）串联连接在一起。

4. 发明申请

WO1993010478A1 SEMICONDUCTOR OPTICAL PART AND PROCESS FOR MANUFACTURING THE SAME 审中-公开
标题翻译：半导体光学部件及其制造方法
公开(公告)号：WO1993010478A1
公开(公告)日：1993-05-27
申请号：PCT/JP1992001526
申请日：1992-11-20
申请人： THE FURUKAWA ELECTRIC CO., LTD. , ONO, Takahiro , YANAGAWA, Hisaharu
发明人： THE FURUKAWA ELECTRIC CO., LTD.
IPC分类号： G02F01/313
CPC分类号： H01S5/026 , G02F1/3138 , H01S5/20 , H01S5/50
摘要： A process for manufacturing a semiconductor optical part in which a ridge type semiconductor optical amplifier section and a ridge type semiconductor optical waveguide connected to the optical amplifier section are integrally formed on a single substrate. The semiconductor optical amplifier section has a path width narrower than that of the semiconductor optical waveguide. The current density of the semiconductor optical part thus manufactured can be high since the injected current in the semiconductor optical amplifier can be much constricted. Therefore, optical amplification of a high efficiency can be performed even in the case of a small injected current, and the semiconductor optical part is useful as an optical amplifier of a high efficiency.

5. 发明申请

WO1995025973A1 METHOD OF PRODUCTION OF REFLECTING WAVEGUIDE DEVICE 审中-公开
标题翻译：反射波导装置的制造方法
公开(公告)号：WO1995025973A1
公开(公告)日：1995-09-28
申请号：PCT/JP1995000472
申请日：1995-03-17
申请人： THE FURUKAWA ELECTRIC CO., LTD. , MUGINO, Akira , KAMATA, Yoshiyuki , YANAGAWA, Hisaharu
发明人： THE FURUKAWA ELECTRIC CO., LTD.
IPC分类号： G02B06/12
CPC分类号： G02B6/125
摘要： A reflecting waveguide device which comprises a bent waveguide and a reflecting portion formed at the bent portion. The waveguide device is produced by forming a resist mask having a combined planar pattern, in which a planar pattern of the bent waveguide and another planar pattern similar to and greater area than the planar pattern at the reflecting portion partially overlap each other at the bent portion of the planar pattern of the bent waveguide, on a device substrate; and then carrying out dry etching so as to form a ridge portion having the same planar pattern as that of the combined planar pattern, and the step of forming a resist mask having the same planar pattern as that of the reflecting portion on the device substrate and then carrying out dry etching to form a recess having the same planar pattern as that of the reflecting portion on the device substrate.
摘要翻译：一种反射波导装置，其包括弯曲波导和形成在弯曲部分处的反射部分。波导器件通过形成具有组合的平面图案的抗蚀剂掩模来制造，其中弯曲波导的平面图案和与反射部分处的平面图案相似和更大的面积的另一平面图案在弯曲部分处彼此部分重叠的弯曲波导的平面图案; 然后进行干蚀刻以形成具有与组合的平面图案相同的平面图案的脊部分，以及形成具有与器件基板上的反射部分相同的平面图案的抗蚀剂掩模的步骤，以及然后进行干蚀刻以形成具有与器件基板上的反射部分相同的平面图案的凹部。

6. 发明申请

WO1998015995A1 OPTICAL SEMICONDUCTOR MODULE 审中-公开
标题翻译：光学半导体模块
公开(公告)号：WO1998015995A1
公开(公告)日：1998-04-16
申请号：PCT/JP1997003622
申请日：1997-10-08
申请人： THE FURUKAWA ELECTRIC CO., LTD. , MORI, Hajime , MUGINO, Akira , SHIMIZU, Takeo
发明人： THE FURUKAWA ELECTRIC CO., LTD.
IPC分类号： H01S03/18
CPC分类号： H01S5/02252 , G02B6/4224 , G02B6/423 , H01S5/0224 , H01S5/1014 , H01S5/227
摘要： An optical semiconductor module which is constituted by mounting an optical semiconductor element forming a projecting section composed of an abnormally grown crystal on its surface on a substrate having a recessed section, which can house the projecting section of the semiconductor element in a non-contacting state on its surface by using the junction down system. Therefore, the mounted element is not damaged nor broken and the characteristics of the element are not deteriorated.
摘要翻译：一种光学半导体模块，其通过在其表面上安装形成由异常生长的晶体构成的突出部分的光学半导体元件，该基板具有凹部，该半导体元件能够将半导体元件的突出部分容纳在非接触状态在其表面上通过使用结下降系统。因此，安装的元件不会损坏或破损，并且元件的特性不会劣化。

7. 发明申请

WO1998010105A1 COPPER ALLOY FOR ELECTRONIC DEVICES 审中-公开
标题翻译：铜合金电子设备
公开(公告)号：WO1998010105A1
公开(公告)日：1998-03-12
申请号：PCT/JP1997003080
申请日：1997-09-03
申请人： THE FURUKAWA ELECTRIC CO., LTD. , EGUCHI, Tatsuhiko , HIRAI, Takao , KURIHARA, Masaaki
发明人： THE FURUKAWA ELECTRIC CO., LTD.
IPC分类号： C22C09/04
CPC分类号： C22C9/04 , H01L23/49579 , H01L2924/0002 , H01L2924/00
摘要： A copper alloy for electronic devices, comprising 5 to 42 % by weight of Zn, at least one of elements selected from the group consisting of Sn, Si, Al, Ni, Mn, Ti, Zr, In, Mg, 0.005 to 0.5 % by weight of Pb, and 0.005 to 0.5 % by weight of Te in a total amount of 0.1 to 3 % by weight, at least one of elements selected from the group consisting of Bi, Ca, Sr and Ba in a total amount of 0.005 to 3 % by weight, the residue being copper and unavoidable impurities. The copper alloy containing 10 to 35 % by weight of Zn, 0.1 to 2 % by weight of Sn, the residue being copper and unavoidable impurities and having a crystal particle size of 5 to 35 mu m, is particularly suited for a material for lead frames for semiconductor devices.
摘要翻译： 1.一种电子器件用铜合金，其含有5〜42重量％的Zn，选自Sn，Si，Al，Ni，Mn，Ti，Zr，In，Mg，0.005〜0.5重量％的Pb和0.005〜0.5重量％的Te，总量为0.1〜3重量％，选自Bi，Ca，Sr和Ba中的至少一种元素的总量为0.005 至3重量％，残留物为铜和不可避免的杂质。含有10〜35重量％的Zn，0.1〜2重量％的Sn，残渣为铜和不可避免的杂质，结晶粒径为5〜35μm的铜合金特别适用于铅的材料半导体器件的框架。

8. 发明申请

WO1997041272A1 ALUMINIUM-SILICON-MAGNESIUM ALLOY FOR MOTOR VEHICLE BODY 审中-公开
标题翻译：用于汽车车身的铝 - 硅 - 镁合金
公开(公告)号：WO1997041272A1
公开(公告)日：1997-11-06
申请号：PCT/FR1997000755
申请日：1997-04-28
申请人： PECHINEY RHENALU , KAISER ALUMINIUM & CHEMICAL CORPORATION , THE FURUKAWA ELECTRIC CO., LTD. , KAWASAKI STEEL CORPORATION , EHRSTRÖM, Jean-Christophe , SIGLI, Christophe , PILLET, Georges
发明人： PECHINEY RHENALU , KAISER ALUMINIUM & CHEMICAL CORPORATION , THE FURUKAWA ELECTRIC CO., LTD. , KAWASAKI STEEL CORPORATION
IPC分类号： C22C21/14
CPC分类号： C22F1/043 , C22C21/02 , C22C21/14 , C22C21/16 , C22F1/057
摘要： The invention discloses an aluminium alloy, to be used particularly in the manufacture of the external parts of a motor vehicle body, of the following composition (wt.%): Si: 0.5-0.8, Mg 0.45-0.65, Cu: 0.55-0.75, Mn and/or Cr: 0.1-0.3 with 1.6
摘要翻译：本发明公开了一种特别用于制造机动车身外部部件的铝合金，其组成如下（重量％）：Si：0.5-0.8，Mg 0.45-0.65，Cu：0.55-0.75 ，Mn和/或Cr：0.1-0.3，1.6

9. 发明申请

WO1994009575A1 LIGHT PATH SWITCHING SYSTEM 审中-公开
标题翻译：光路切换系统
公开(公告)号：WO1994009575A1
公开(公告)日：1994-04-28
申请号：PCT/JP1993001464
申请日：1993-10-12
申请人： THE FURUKAWA ELECTRIC CO., LTD. , IWATATE, Kazuo , WATANABE, Kazunori , HATTORI, Nobuhiko , YAMASHITA, Tetsuhiro
发明人： THE FURUKAWA ELECTRIC CO., LTD.
IPC分类号： H04B10/12
CPC分类号： H04B10/032
摘要： The system comprises first and second stations (1 and 5) which are provided with transmitting means (2 and 6) for transmitting light signals to be transmitted, and receiving means (3 and 7) for receiving the light signals. The two stations (1 and 5) are connected by at least two optical transmission lines (10 and 20) having first optical switches (11 and 21) and second optical switches (12 and 22) installed on both ends thereof, and having light paths (10a and 20a) and square light paths (10b and 20b) for alternate route. By use of the first and second optical switches, the optical transmission routes through which the light signals are transmitted are switched over from the optical paths to the spare optical paths for connection. For the optical transmission lines (10 and 20), first and second control means (30 and 35) are provided in the first station and the second station in order to detect the light signals, and switch over on each of the receiving means sides the first and second optical switches in accordance with the level of the detected light.
摘要翻译：该系统包括第一和第二站（1和5），它们设置有用于发射要发送的光信号的发送装置（2和6）以及用于接收光信号的接收装置（3和7）。两个站（1和5）通过至少两个具有安装在其两端的第一光开关（11和21）和第二光开关（12和22）的光传输线（10和20）连接，并具有光路（10a和20a）和用于替代路线的方形光路（10b和20b）。通过使用第一和第二光开关，将光信号通过其发送的光传输路径从光路切换到用于连接的备用光路。对于光传输线（10和20），第一和第二控制装置（30和35）设置在第一站和第二站中以检测光信号，并且在每个接收装置侧切换第一和第二光学开关根据检测到的光的水平。

10. 发明申请

WO1990009036A1 METHOD OF PRODUCING HEAT PIPE-TYPE SEMICONDUCTOR COOLING DEVICE 审中-公开
标题翻译：制造热管式半导体冷却装置的方法
公开(公告)号：WO1990009036A1
公开(公告)日：1990-08-09
申请号：PCT/JP1990000145
申请日：1990-02-06
申请人： THE FURUKAWA ELECTRIC CO., LTD. , MURASE, Takashi
发明人： THE FURUKAWA ELECTRIC CO., LTD.
IPC分类号： H01L23/427
CPC分类号： F28D15/0275 , B21C23/14 , F28F2265/24 , H01L23/427 , H01L2924/0002 , Y10T29/49353 , Y10T29/49373 , Y10T29/49393 , H01L2924/00
摘要： A method of producing a heat pipe-type semiconductor cooling device wherein one or a plurality of through holes are provided in a long metallic member, which is then cut into a predetermined length to obtain predetermined metallic blocks. The ends of the through holes of the metallic blocks are sealed and the heat-absorbing portion is constituted of the heat-junction and then one end of a heat pipe is fitted thereto. Or the end of the heat pipe is fitted to the through hole, the end of the through hole is sealed, and they are heat-joined to constitute the heat-absorbing portion. Then, a fin is forced into the other end of the heat pipe to constitute the heat-radiating portion.
摘要翻译：一种制造热管式半导体冷却装置的方法，其中将一个或多个通孔设置在长的金属构件中，然后将其切割成预定长度以获得预定的金属块。金属块的通孔的端部被密封，并且吸热部分由热连接部分组成，然后将热管的一端安装在其上。或者将热管的端部安装到通孔，通孔的端部被密封，并且它们被热接合以构成吸热部分。然后，将翅片推入热管的另一端，构成散热部。

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