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1. 发明申请

WO2006020488A1 MICROELECTRONIC CONNECTION STRUCTURES AND METHODS CROSS-REFERENCE TO RELATED APPLICATIONS 审中-公开
标题翻译：微电子连接结构和方法相关申请的交叉引用
公开(公告)号：WO2006020488A1
公开(公告)日：2006-02-23
申请号：PCT/US2005/027748
申请日：2005-08-02
申请人： TESSERA, INC. , HABA, Belgacem , BEROZ, Masud , TUCKERMAN, David B. , HUMPSTON, Giles , CRISP, Richard D.
发明人： HABA, Belgacem , BEROZ, Masud , TUCKERMAN, David B. , HUMPSTON, Giles , CRISP, Richard D.
IPC分类号： H01L23/498
CPC分类号： H01L23/49838 , H01L23/49827 , H01L2924/0002 , H05K1/115 , H05K3/041 , H05K3/06 , H05K3/202 , H05K3/4038 , H05K2201/09609 , H05K2201/097 , H05K2201/09827 , H05K2201/09881 , H05K2203/0733 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49147 , Y10T29/49149 , Y10T29/49165 , H01L2924/00
摘要： Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate (10) is included having opposing surfaces and a plurality of holes (12A-D) extending through the surfaces. Also included is a plurality of electrically conductive posts (18A-D). Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate (20) may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts (28A-D) may be provided having tips in corresponding holes (22A-D) of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.
摘要翻译：提供了用于微电子器件的连接结构和用于形成结构的方法。包括具有相对表面的基板（10）和延伸穿过表面的多个孔（12A-D）。还包括多个导电柱（18A-D）。每个柱从基部延伸到位于基板的相应孔内的尖端。可以设置另外的基板（20），使得每个柱的基部位于其表面上。可以在附加基板的相应孔（22A-D）中提供附加的导电柱（28A-D）。可选地，介电材料可以放置在基板和柱之间。

2. 发明申请

WO2006004671A2 STRUCTURE WITH SPHERICAL CONTACT PINS 审中-公开
标题翻译：结构与球形接触针
公开(公告)号：WO2006004671A2
公开(公告)日：2006-01-12
申请号：PCT/US2005/022750
申请日：2005-06-24
申请人： TESSERA, INC. , HUMPSTON, Giles , BEROZ, Masud , TUCKERMAN, David, B.
发明人： HUMPSTON, Giles , BEROZ, Masud , TUCKERMAN, David, B.
CPC分类号： H01L21/563 , H01L21/4853 , H01L21/568 , H01L21/6835 , H01L23/3114 , H01L23/3121 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/4985 , H01L24/48 , H01L24/81 , H01L2221/68345 , H01L2224/05147 , H01L2224/05155 , H01L2224/05568 , H01L2224/0557 , H01L2224/05571 , H01L2224/05644 , H01L2224/11003 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/81801 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/19041 , H01L2924/3011 , H01L2924/3511 , H05K3/3436 , H05K2201/0221 , H05K2201/0379 , H05K2201/10234 , Y02P70/613 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package includes a microelectronic element having faces and contacts, and a flexible substrate spaced from and overlying a first face of the microelectronic element, the flexible substrate having conductive pads facing away from the first face of the microelectronic element. The package includes a plurality of spheres attached to the conductive pads of the flexible substrate and projecting away from the first face of the microelectronic element, each sphere having a contact surface remote from the conductive pads, the contact surfaces of the spheres including a contact metal devoid of solder. The package also includes a plurality of support elements disposed between the microelectronic element and the substrate for supporting the flexible substrate over the microelectronic element, the spheres being offset from the support elements.
摘要翻译：微电子封装包括具有面和触点的微电子元件，以及与微电子元件的第一面间隔开并覆盖微电子元件的第一面的柔性基板，柔性基板具有背离微电子元件的第一面的导电焊盘。该封装包括附接到柔性基板的导电焊盘并远离微电子元件的第一面突出的多个球体，每个球体具有远离导电焊盘的接触表面，球体的接触表面包括接触金属没有焊料。所述包装还包括多个支撑元件，其设置在所述微电子元件和所述基板之间，用于将所述柔性基板支撑在所述微电子元件上方，所述球体与所述支撑元件相抵消。

3. 发明申请

WO2005065424A2 MICRO PIN GRID ARRAY WITH WIPING ACTION 审中-公开
标题翻译：微型针阵列与WIPING动作
公开(公告)号：WO2005065424A2
公开(公告)日：2005-07-21
申请号：PCT/US2004/044088
申请日：2004-12-21
申请人： TESSERA, INC. , HABA, Belgacem , BEROZ, Masud , HUMPSTON, Giles , PARK, Jae, M.
发明人： HABA, Belgacem , BEROZ, Masud , HUMPSTON, Giles , PARK, Jae, M.
IPC分类号： H01L21/48 , H01L23/13 , H01R13/24 , H01R13/62
CPC分类号： H01L23/13 , H01L21/4846 , H01L2924/0002 , H01R13/2414 , H01R13/2464 , H01L2924/00
摘要： A microelectronic package includes a mounting structure (136), a microelectronic element associated with the mounting structure, and a plurality of conductive posts (146) physically connected to the mounting structure and electrically connected to the microelectronic element. The conductive posts (146) project from the mounting structure (136) in an upward direction (Z), at least one of the conductive posts being an offset post. Each offset post has a base (154) connected to the mounting structure (136), the base of each offset post defining a centroid (156). Each offset post also defines an upper extremity (178) having a centroid (160), the centroid of the upper extremity being offset from the centroid (156) of the base (154) in a horizontal offset direction transverse to the upward direction (Z). The mounting structure (136) is adapted to permit tilting of each offset post about a horizontal axis so that the upper extremities (178) may wipe across a contact pad of an opposing circuit board.
摘要翻译：微电子封装包括安装结构（136），与安装结构相关联的微电子元件以及物理连接到安装结构并电连接到微电子元件的多个导电柱（146）。导电柱（146）从安装结构（136）沿向上的方向（Z）突出，至少一个导电柱是偏移柱。每个偏移柱具有连接到安装结构（136）的基部（154），每个偏移柱的基部限定重心（156）。每个偏置柱还限定具有质心（160）的上端（178），上端的质心在横向于向上方向（Z）的水平偏移方向上偏离基座（154）的重心（156））。安装结构（136）适于允许每个偏置柱围绕水平轴线倾斜，使得上端（178）可以穿过相对的电路板的接触垫。

4. 发明申请

WO2007056069A1 COMPACT LENS TURRET ASSEMBLY 审中-公开
标题翻译：紧凑型镜头组合
公开(公告)号：WO2007056069A1
公开(公告)日：2007-05-18
申请号：PCT/US2006/042829
申请日：2006-11-02
申请人： TESSERA, INC. , HUMPSTON, Giles , HONER, Kenneth, Allen , TUCKERMAN, David, B.
发明人： HUMPSTON, Giles , HONER, Kenneth, Allen , TUCKERMAN, David, B.
IPC分类号： H01L27/146
CPC分类号： H01L27/14618 , G02B7/02 , H01L27/14625 , H01L27/14685 , H01L31/0203 , H01L31/02325 , H01L2924/0002 , H04N5/2253 , H04N5/2254 , H04N5/2257 , Y10T29/49117 , H01L2924/00
摘要： An electronic camera module incorporates a sensor unit (20) having a semiconductor chip (22) such as a CCD imager and a cover (34) overlying the front surface of the chip. An optical unit (50) includes one or more optical elements such as lenses (58). The optical unit has engagement features (64) which abut alignment features on the sensor unit as, for example, portions (44) of the cover outer surface (38), so as to maintain a precise relationship between the optical unit and sensor unit.
摘要翻译：电子照相机模块包括具有诸如CCD成像器的半导体芯片（22）的传感器单元（20）和覆盖在芯片的前表面上的盖（34）。光学单元（50）包括一个或多个光学元件，例如透镜（58）。光学单元具有接合特征（64），其接合传感器单元上的对准特征，例如覆盖外表面（38）的部分（44），以保持光学单元和传感器单元之间的精确关系。

5. 发明申请

WO2006102351A1 WIRE BONDED WAFER LEVEL CAVITY PACKAGE 审中-公开
公开(公告)号：WO2006102351A1
公开(公告)日：2006-09-28
申请号：PCT/US2006/010290
申请日：2006-03-21
申请人： TESSERA, INC. , HONER, Kenneth Allen , HUMPSTON, Giles , TUCKERMAN, David B. , NYSTROM, Michael
发明人： HONER, Kenneth Allen , HUMPSTON, Giles , TUCKERMAN, David B. , NYSTROM, Michael
IPC分类号： B81B7/00
CPC分类号： B81B7/0006 , B81C1/00269 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2224/8592 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/10253 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A microelectronic device includes a chip (10') having a front surface and a rear surface, the front surface having an active region (14) and a plurality of contacts (18) exposed at the front surface outside of the active region. The device further includes a lid (20') overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses (32') extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.
摘要翻译：微电子器件包括具有前表面和后表面的芯片（10'），所述前表面具有有源区域（14）和暴露在有源区域外部的前表面处的多个触点（18）。该装置还包括覆盖在前表面上的盖（20'）。所述盖具有边缘的边缘，所述边缘中的至少一个包括一个或多个外部部分和一个或多个从所述外部部分横向向内延伸的凹部（32'），所述触头与所述凹部对准并暴露在所述凹部中。

6. 发明申请

WO2005086532A2 PACKAGED ACOUSTIC AND ELECTROMAGNETIC TRANSDUCER CHIPS 审中-公开
标题翻译：包装声音和电磁传感器卡
公开(公告)号：WO2005086532A2
公开(公告)日：2005-09-15
申请号：PCT/US2005/006565
申请日：2005-03-01
申请人： TESSERA, INC. , HUMPSTON, Giles , OSBORN, Philip, R. , THOMPSON, Jesse, Burl , KUBOTA, Yoichi , TSENG, Chung-Chuan , BURTZLAFF, Robert , HABA, Belgacem , TUCKERMAN, David, B. , WARNER, Michael
发明人： HUMPSTON, Giles , OSBORN, Philip, R. , THOMPSON, Jesse, Burl , KUBOTA, Yoichi , TSENG, Chung-Chuan , BURTZLAFF, Robert , HABA, Belgacem , TUCKERMAN, David, B. , WARNER, Michael
IPC分类号： H04R19/00
CPC分类号： B81B7/0077 , B81B2201/0257 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/05568 , H01L2224/05624 , H01L2224/16 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/07811 , H01L2924/09701 , H01L2924/10155 , H01L2924/10253 , H01L2924/12041 , H01L2924/19041 , H01L2924/3025 , H04R19/005 , H01L2924/00 , H01L2924/00014
摘要： Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed to one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chop and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of the said device and from said device.
摘要翻译：本文公开了封装芯片的各种实施例及其制造方法。本文公开的一种这样的封装芯片包括具有前表面，与正面相对的后表面的芯片和在前表面和后表面之一上的器件，该器件可操作为声能和电磁能中的至少一个的换能器并且所述芯片包括暴露于所述前表面和后表面中的一个的多个接合焊盘。封装芯片包括具有介电元件和设置在电介质元件上的金属层的封装元件，封装元件具有面向斩波的内表面和背离芯片的外表面。金属层包括暴露在内表面和外表面中的至少一个的多个触点，触点导电地连接到接合焊盘。金属层还包括第一开口，用于沿着所述装置和所述装置中的至少一个的方向通过声能和电磁能中的至少一个。

7. 发明申请

WO2007103224A2 STRUCTURE AND METHOD OF MAKING LIDDED CHIPS 审中-公开
标题翻译：结构及其制作方法
公开(公告)号：WO2007103224A2
公开(公告)日：2007-09-13
申请号：PCT/US2007/005456
申请日：2007-03-01
申请人： TESSERA, INC. , TUCKERMAN, David, B. , HUMPSTON, Giles , NYSTROM, Michael, J. , GOUDGE, Charles, Liam , WOLL, Anita
发明人： TUCKERMAN, David, B. , HUMPSTON, Giles , NYSTROM, Michael, J. , GOUDGE, Charles, Liam , WOLL, Anita
IPC分类号： H01L21/50 , H01L23/10 , B81B7/00 , B81C1/00
CPC分类号： B81C1/00301 , B81B2207/095 , B81C2203/0118 , C04B2237/366 , H01L27/14618 , H01L31/0203 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/11334 , H01L2224/32225 , H01L2224/48227 , H01L2224/4824 , H01L2224/73265 , H01L2224/8592 , H01L2924/01322 , H01L2924/01327 , H01L2924/07811 , H01L2924/10253 , H01L2924/1461 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： Methods are provided for fabricating packaged chips (2901) having protective layers, e.g., lids (2912) or other overlying layers (2903) having transparent, partially transparent, or opaque characteristics or a combination of such characteristics. Methods are provided for fabricating the packaged chips. Lidded chip structures (2901) and assemblies (3031) including lidded chips are also provided.
摘要翻译：提供了用于制造具有保护层的封装芯片（2901）的方法，例如具有透明，部分透明或不透明特性或这些特性的组合的盖（2912）或其它覆盖层（2903）。提供了制造封装芯片的方法。还提供了包括带芯芯片的芯片结构（2901）和组件（3031）。

8. 发明申请

WO2006026372A1 PACKAGE HAVING INTEGRAL LENS AND WAFER-SCALE 审中-公开
标题翻译：具有整体镜头和尺寸的包装
公开(公告)号：WO2006026372A1
公开(公告)日：2006-03-09
申请号：PCT/US2005/030288
申请日：2005-08-25
申请人： TESSERA, INC. , DE VILLENEUVE, Catherine , HUMPSTON, Giles , TUCKERMAN, David, B.
发明人： DE VILLENEUVE, Catherine , HUMPSTON, Giles , TUCKERMAN, David, B.
IPC分类号： H01L31/0203 , H01L31/0232 , H01L23/10 , H01L23/04
CPC分类号： H01L27/14618 , H01L23/04 , H01L23/10 , H01L27/14625 , H01L31/0203 , H01L31/02325 , H01L31/18 , H01L33/58 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2924/00014 , H01S5/02248 , H01S5/02292 , H01S5/4025 , H04N5/2257 , H01L2224/05599
摘要： A covered chip (10 )having an optical element (14) integrated in the cover (12) is provided which includes a chip (11) having a front surface (18), an optically active circuit area (16), and bond pads (20) disposed at the front surface. The chip is covered by an at least partially optically translucent or transparent unitary cover (12) that is mounted to the front surface of the chip, and has at least one optical element (14) integrated in the unitary cover. The cover (12) is aligned with the optically active circuit area (16) and vertically spaced from the optically active circuit area.
摘要翻译：提供一种具有集成在盖（12）中的光学元件（14）的覆盖芯片（10），其包括具有前表面（18），光学有效电路区域（16）和接合焊盘 20）设置在前表面。该芯片由至少部分光学上半透明或透明的整体盖（12）覆盖，该盖（12）安装到芯片的前表面，并且具有集成在单一盖中的至少一个光学元件（14）。盖（12）与光学有源电路区域（16）对准，并且与光学有源电路区域垂直间隔开。

9. 发明申请

WO2006071611A1 MICROELECTRONIC PACKAGE HAVING STACKED SEMICONDUCTOR DEVICES AND A PROCESS FOR ITS FABRICATION 审中-公开
标题翻译：具有堆叠半导体器件的微电子封装及其制造工艺
公开(公告)号：WO2006071611A1
公开(公告)日：2006-07-06
申请号：PCT/US2005/046012
申请日：2005-12-19
申请人： TESSERA, INC. , CRISP, Richard D. , HARA, Belgacem , HUMPSTON, Giles
发明人： CRISP, Richard D. , HARA, Belgacem , HUMPSTON, Giles
IPC分类号： H01L25/065
CPC分类号： H01L24/73 , H01L25/0657 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/73207 , H01L2224/73257 , H01L2225/06572 , H01L2924/00014 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07811 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A microelectronic assembly includes a first microelectronic element (110, 125) having conductive posts (130) extending from one major surface, and a second microelectronic element (140) which is electrically interconnected with the first microelectronic element by the conductive posts. The interconnected elements may have coordinated functionality, such as where one microelectronic element is a field programmable gate array and the other microelectronic element is a memory device. In a manufacturing process, a transfer substrate (215) is used to transfer solder masses (210') onto the conductive posts or onto contacts on the second microelectronic element. The solder masses are then used to electrically interconnect the conductive posts with the contacts.
摘要翻译：微电子组件包括具有从一个主表面延伸的导电柱（130）的第一微电子元件（110,125）和通过导电柱与第一微电子元件电互连的第二微电子元件（140）。互连的元件可以具有协调的功能，例如其中一个微电子元件是现场可编程门阵列，而另一微电子元件是存储器件。在制造过程中，转移衬底（215）用于将焊料块（210'）转移到导电柱上或第二微电子元件上的触点上。焊料块然后用于将导电柱与触点电互连。

10. 发明申请

WO2006044219A3 WAFER LEVEL MICROELECTRONIC PACKAGING WITH DOUBLE ISOLATION 审中-公开
公开(公告)号：WO2006044219A3
公开(公告)日：2006-04-27
申请号：PCT/US2005/035962
申请日：2005-10-06
申请人： TESSERA, INC. , HUMPSTON, Giles , MCWILIAMS, Bruce, M
发明人： HUMPSTON, Giles , MCWILIAMS, Bruce, M
IPC分类号： H01L21/50 , B81B7/00 , G01N21/59
摘要： A microelectronic package may include front and rear covers (46', 60') overlying the front and rear surfaces of a microelectronic element (22') such as an infrared sensor and spaces between the microelectronic element and the covers to provide thermal isolation. A sensing unit including a microelectronic package may include a reflector (76) spaced from the front cover to provide an analyte space, and the microelectronic element may include an emitter (28) and a detector (30) so that radiation directed from the emitter will be reflected by the sensor to the detector, and such radiation will be affected by the properties of the analyte in the analyte space. Such a unit provides a compact, economical chemical sensor. Other packages include elements such as valves (515, 521) for passing fluids into and out of the spaces within the package itself.

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