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1. 发明申请

WO2012061199A2 NO FLOW UNDERFILL 审中-公开
标题翻译：无流动性不足
公开(公告)号：WO2012061199A2
公开(公告)日：2012-05-10
申请号：PCT/US2011/058080
申请日：2011-10-27
申请人： TESSERA, INC. , HABA, Belgacem , MOHAMMED, Ilyas , CHAU, Ellis , LEE, Sang II , DESAI, Kishor
发明人： HABA, Belgacem , MOHAMMED, Ilyas , CHAU, Ellis , LEE, Sang II , DESAI, Kishor
IPC分类号： H01L21/56
CPC分类号： H01L23/49811 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/1601 , H01L2224/1605 , H01L2224/16225 , H01L2224/1703 , H01L2224/73104 , H01L2224/73204 , H01L2224/81143 , H01L2224/81193 , H01L2224/814 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/8349 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/014 , H01L2924/00014 , H01L2924/00
摘要： A method for making a microelectronic assembly includes providing a microelectronic element 30 with first conductive elements and a dielectric element 50 with second conductive elements. At least some of either the first conductive elements or the second conductive elements may be conductive posts 40 and other of the first or second conductive elements may include a bond metal 10 disposed between some of the conductive posts 40. An underfill layer 60 may overly some of the first or second conductive elements. At least one of the first conductive elements may be moved towards the other of the second conductive elements so that the posts pierce the underfill layer 60 and at least deform the bond metal 10. The microelectronic element 30 and the dielectric element 50 can be heated to join them together. The height of the posts 40 above the surface may be at least forty percent of a distance between surfaces of the microelectronic element 30 and dielectric element 50.
摘要翻译：制造微电子组件的方法包括提供具有第一导电元件的微电子元件30和具有第二导电元件的电介质元件50。第一导电元件或第二导电元件中的至少一些可以是导电柱40，并且第一导电元件或第二导电元件中的另一个可以包括设置在一些导电柱40之间的键合金属10.底部填充层60可以过多地的第一或第二导电元件。第一导电元件中的至少一个可以朝向第二导电元件中的另一个移动，使得柱刺穿底部填充层60并且至少使键合金属10变形。微电子元件30和介电元件50可以被加热到加入他们在一起。在表面之上的柱40的高度可以是微电子元件30和电介质元件50的表面之间的距离的至少百分之四十。

2. 发明申请

WO2008130097A1 METHOD FOR ALTERNATING CYLINDER HEAD AND HEAD-ALTERNATED CYLINDER HEAD 审中-公开
标题翻译：用于替换气缸头和头部气缸盖的方法
公开(公告)号：WO2008130097A1
公开(公告)日：2008-10-30
申请号：PCT/KR2008/001047
申请日：2008-02-22
申请人： DEOKSAN BORING INDUSTRY CO., LTD. , LEE, Sang II , KIM, Jae Woo
发明人： LEE, Sang II , KIM, Jae Woo
IPC分类号： F02F1/00
CPC分类号： F02F1/24
摘要： A method for alternating a cylinder head of an engine is disclosed, which comprises a step in which an injector adapted to inject a fuel of a diesel engine cylinder head is removed, and a groove having the injector and a fuel injection space formed in front of the injector are filled with the same material as the cylinder head; a step in which a semispherical spread space is formed in a position of the filled fuel injection space, and an ignition plug insertion groove is formed from an upper side of the cylinder head to the spark spread space; and a step in which the ignition plug is inserted into the ignition plug insertion groove and is engaged nearest the upper side of the combustion chamber of the cylinder block through the spark spread space.
摘要翻译：公开了一种用于交替发动机气缸盖的方法，该方法包括一个步骤，其中适用于喷射柴油发动机气缸盖的燃料的喷射器被去除，并且具有喷射器和在前面形成的燃料喷射空间的凹槽注射器用与气缸盖相同的材料填充; 在填充燃料喷射空间的位置上形成半球形扩展空间的步骤，并且从气缸盖的上侧到火花展开空间形成火花塞插入槽; 以及其中火花塞插入到火花塞插入槽中并通过火花放置空间接近最靠近气缸体的燃烧室的上侧的步骤。

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