专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP0888038A1 Surface mounted electronic parts and manufacturing method therefor 失效
标题翻译： Verfahren zur Herstellungoberflächenmontierteelektronische Bauteile und dessen Produkt
公开(公告)号：EP0888038A1
公开(公告)日：1998-12-30
申请号：EP98111618.9
申请日：1998-06-24
申请人： TDK Corporation
发明人： Gotoh, Masashi , Kanazawa, Jitsuo , Yamamoto, Syuichiro , Honda, Kenji
IPC分类号： H05K3/40
CPC分类号： H05K3/403 , H05K3/0052 , H05K3/3442 , H05K3/42 , H05K2201/09181 , Y10T29/49155 , Y10T29/49165 , Y10T29/49789 , Y10T29/49792
摘要： A through hole 5 formed in a substrate and having an electrode film on an inner surface thereof is cut and divided into two through holes or blind holes each of substantially semicircular arc shape through dicing processing using a rotating blade, and one of the-divided through holes 5 of substantially semicircular arc shape is used as an external connection terminal 3 of substantially semicircular concave arc shape thereby to form a surface mounted electronic parts having a plurality of the external connection terminals 3. The height H of the substantially semicircular arc formed at an inner surface of each of the external connection terminals is set to be equal to or smaller than a value obtained by subtracting twice a thickness t of the electrode film from a radius R of a curvature of the arc.
摘要翻译：形成在基板中并且在其内表面上具有电极膜的通孔5通过使用旋转叶片的切割处理被切割并分成基本上为半圆弧形状的两个通孔或盲孔，并且其中一个分割通孔使用大致半圆弧状的孔5作为大致半圆形的凹弧形状的外部连接端子3，从而形成具有多个外部连接端子3的表面安装的电子部件。大致半圆弧的高度H形成在每个外部连接端子的内表面被设定为等于或小于从电弧曲率的半径R减去电极膜的厚度t的两倍所获得的值。

2. 发明公开

EP0928025A3 Wiring board and process for the production thereof 审中-公开
标题翻译： Leiterplatte und ihre Herstellung
公开(公告)号：EP0928025A3
公开(公告)日：2000-04-12
申请号：EP98310764.0
申请日：1998-12-29
申请人： TDK Corporation
发明人： Gotoh, Masashi , Kanazawa, Jitsuo , Yamamoto, Syuichiro
IPC分类号： H01L23/10 , H01L23/13
CPC分类号： H01L23/10 , H01L23/5383 , H01L23/5385 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/16152 , H01L2924/16315 , H05K1/111 , H05K3/062 , H05K3/243 , H05K3/28 , H05K3/383 , H05K2201/0989 , H05K2203/0307 , Y10T29/49155 , Y10T428/24917
摘要： A wiring board having a conductor layer (2) formed on a substrate (1) and a connecting pad (4) disposed in a connecting pad disposition portion (2) provided in part of the conductor layer surface (2), the conductor layer (2) having a resin inflow prevention portion (26) which is provided adjacently to the said connecting pad disposition portion (2a) and which has a surface roughness greater than the surface roughness of the said connecting pad disposition portion (2a), the resin inflow prevention portion (2b) being capable of overcoming the problem of prior art that an adhesive resin (resin layer) (20) of a prepreg or an adhesive flows out onto the upper surface of the pad (4), due to its softening under heat and its being pressurized for bonding when a structure member such as a cover layer (30) is bonded to the wiring board, and forms a cured resin which extremely inhibits the bonding property of a chip element (10) onto the pad (4).
摘要翻译：一种布线板，其具有形成在基板（1）上的导体层（2）和布置在设置在导体层表面（2）的一部分中的连接焊盘布置部分（2）中的连接焊盘（4），导体层 2）具有与所述连接焊盘布置部分（2a）相邻设置并且具有大于所述连接焊盘布置部分（2a）的表面粗糙度的表面粗糙度的树脂流入防止部分（26），树脂流入预防部分（2b）能够克服现有技术的问题，即预浸料或粘合剂的粘合树脂（树脂层）（20）由于其在加热下的软化而流出到垫（4）的上表面并且当诸如覆盖层（30）的结构构件接合到布线板上时，其被加压以进行接合，并且形成极其抑制芯片元件（10）与焊盘（4）的接合性能的固化树脂。

3. 发明公开

EP0959491A3 Production method of electronic parts and water treatment apparatus 审中-公开
标题翻译：一种用于生产电子组件的装置和用于处理水的过程
公开(公告)号：EP0959491A3
公开(公告)日：2005-05-11
申请号：EP99303881.9
申请日：1999-05-19
申请人： TDK Corporation
发明人： Gotoh, Masashi , Kanazawa, Jitsuo , Yamamoto, Syuichiro
IPC分类号： H01L21/00
CPC分类号： C01B5/00 , C02F1/20 , C02F2103/12 , Y10S134/902
摘要： A production method of an electronic part comprising a step of working a substrate having formed thereon a metal thin-film conductor using water, wherein said water satisfies the relations 3.5 ≤ pH ≤ 6.5 and DO ≤ 0.5pH 2 - 6.5pH + 22 [wherein DO represents a dissolved oxygen amount (unit ppm)]. By using the water in the case of working substrates in the production steps of electronic parts, the generations of the static electricity and the oxidation caused by water used for working are restrained. The present invention is particularly effective in working of an electronic part wherein a metal thin-film conductor containing at least two kinds of metals including Al on a substrate having a pyroelectric property.

4. 发明公开

EP0928022A3 Resin package fabrication process 审中-公开
标题翻译： Kunststoffgehäuse-Herstellung
公开(公告)号：EP0928022A3
公开(公告)日：1999-12-15
申请号：EP98310400.1
申请日：1998-12-17
申请人： TDK Corporation
发明人： Gotoh, Masashi , Kanazawa, Jitsuo , Yamamoto, Syuichiro
IPC分类号： H01L21/48
CPC分类号： H01L21/50 , H01L21/4803 , H01L23/10 , H01L24/97 , H01L2224/16 , H01L2224/16225 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01065 , H01L2924/01073 , H01L2924/16195 , H01L2924/3511 , Y10T29/4913 , Y10T29/49146 , Y10T29/49147 , Y10T29/49158 , Y10T29/53174 , H01L2224/81
摘要： A resin package fabrication processes comprises three steps. At the first step, a thermosetting resin-containing resin substrate is machined. At the second step carried out after the first step, the resin substrate is heated to an original glass transition temperature that the resin substrate has or a temperature that is higher than the glass transition temperature so that the glass transition temperature that the resin substrate has is elevated to a new glass transition temperature. At the third step, a resin layer is placed on at least a portion of the resin substrate to which the new glass transition temperature is imparted, and the resin substrate with the resin layer placed on that portion is then heated to the original glass transition temperature or a temperature between the original glass transition temperature and the new glass transition temperature, thereby fixing the resin layer to the resin substrate.
摘要翻译：树脂封装制造工艺包括三个步骤。在第一步骤中，加热含热固性树脂的树脂基板。在第一步骤后的第二步骤中，将树脂基板加热到树脂基板具有的原始玻璃化转变温度或高于玻璃化转变温度的温度，使得树脂基板具有的玻璃化转变温度为升高到新的玻璃化转变温度。在第三步骤中，将树脂层放置在赋予新玻璃化转变温度的树脂基板的至少一部分上，然后将树脂层放置在该部分上的树脂基板被加热至初始玻璃化转变温度或原玻璃化转变温度与新玻璃化转变温度之间的温度，从而将树脂层固定在树脂基板上。

5. 发明授权

EP0893946B1 Circuit board having bonding areas to be joined with bumps by ultrasonic bonding 失效
标题翻译：印刷电路板具有用于通过超声波焊接与凸块的连接端子
公开(公告)号：EP0893946B1
公开(公告)日：2006-06-07
申请号：EP98113678.1
申请日：1998-07-22
申请人： TDK Corporation
发明人： Gotoh, Masashi , Kanazawa, Jitsuo , Yamamoto, Syuichiro , Hondo, Kenji
IPC分类号： H05K1/11 , H05K3/32 , H01L21/60 , H01L23/498
CPC分类号： H05K3/328 , H01L24/81 , H01L2224/81205 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01074 , H01L2924/01079 , H01L2924/12042 , H01L2924/3025 , H05K1/0243 , H05K1/111 , H05K2201/0969 , H05K2201/10083 , H05K2203/0285 , H05K2203/049 , Y02P70/611 , H01L2924/00

6. 发明授权

EP0888038B1 Manufacturing method for surface mounted electronic parts and product of that method 失效
标题翻译：一种用于制造表面安装的电子元件和的产物的方法
公开(公告)号：EP0888038B1
公开(公告)日：2006-05-31
申请号：EP98111618.9
申请日：1998-06-24
申请人： TDK Corporation
发明人： Gotoh, Masashi , Kanazawa, Jitsuo , Yamamoto, Syuichiro , Honda, Kenji
IPC分类号： H05K3/40
CPC分类号： H05K3/403 , H05K3/0052 , H05K3/3442 , H05K3/42 , H05K2201/09181 , Y10T29/49155 , Y10T29/49165 , Y10T29/49789 , Y10T29/49792

7. 发明公开

EP0893946A3 Circuit board having bonding areas to be joined with bumps by ultrasonic bonding 失效
标题翻译： Leiterplatte mit Anschlusstellen zur Verbindung mitHöckerndurch Ultraschallschweissen
公开(公告)号：EP0893946A3
公开(公告)日：2000-11-15
申请号：EP98113678.1
申请日：1998-07-22
申请人： TDK Corporation
发明人： Gotoh, Masashi , Kanazawa, Jitsuo , Yamamoto, Syuichiro , Hondo, Kenji
IPC分类号： H05K1/11 , H05K3/32 , H01L21/60 , H01L23/498
CPC分类号： H05K3/328 , H01L24/81 , H01L2224/81205 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01074 , H01L2924/01079 , H01L2924/12042 , H01L2924/3025 , H05K1/0243 , H05K1/111 , H05K2201/0969 , H05K2201/10083 , H05K2203/0285 , H05K2203/049 , Y02P70/611 , H01L2924/00
摘要： A circuit board which comprises a conductive pattern section 4 with a pattern formed on a conductive layer 3 provided on a board main body 2, wherein two or more bonding positions 6a, 6b, 6c that bumps of a part mounted by ultrasonic bonding strike are set in the conductive pattern section 4, characterized in that a notch part 8a or a recess extending from the margin of the conductive pattern section 4 to the inside thereof and reaching the proximity of the bonding position or an isolated notch part 8b or recess is formed in the conductive layer in the proximity of at least one bonding position.
摘要翻译：一种电路板，其包括具有形成在设置在板主体2上的导电层3上的图案的导电图案部分4，其中设置通过超声波接合冲击安装的部分的凸起的两个或更多个接合位置6a，6b，6c 在导电图案部分4中，其特征在于，从导电图案部分4的边缘延伸到其内部并到达接合位置附近的凹口部分8a或凹部或者隔离凹口部分8b或凹部形成在所述导电层在至少一个结合位置附近。

8. 发明公开

EP0959491A2 Production method of electronic parts and water treatment apparatus 审中-公开
标题翻译：一种用于生产电子组件的装置和用于处理水的过程
公开(公告)号：EP0959491A2
公开(公告)日：1999-11-24
申请号：EP99303881.9
申请日：1999-05-19
申请人： TDK Corporation
发明人： Gotoh, Masashi , Kanazawa, Jitsuo , Yamamoto, Syuichiro
IPC分类号： H01L21/00
CPC分类号： C01B5/00 , C02F1/20 , C02F2103/12 , Y10S134/902
摘要： A production method of an electronic part comprising a step of working a substrate having formed thereon a metal thin-film conductor using water, wherein said water satisfies the relations 3.5 ≤ pH ≤ 6.5 and DO ≤ 0.5pH 2 - 6.5pH + 22 [wherein DO represents a dissolved oxygen amount (unit ppm)].
By using the water in the case of working substrates in the production steps of electronic parts, the generations of the static electricity and the oxidation caused by water used for working are restrained. The present invention is particularly effective in working of an electronic part wherein a metal thin-film conductor containing at least two kinds of metals including Al on a substrate having a pyroelectric property.
摘要翻译：一种电子部件，包括一工作衬底的步骤的制造方法，具有在其上使用水的金属薄膜导体制成，worin所述水SATIS外资企业关系3.5≤pH值≤6.5和DO≤0.5pH <2> - 6.5pH + 22 a其中DO darstellt溶解氧量（单位：ppm）Ü。通过在电子部件的制造工序的工作基材的情况下，使用水，用于工作被约束到的静电通过水引发的世代和氧化。本发明是在电子部件worin含有至少两种金属包含Al上具有热电特性的基片的金属薄膜导体的工作特别有效。

9. 发明公开

EP0928022A2 Resin package fabrication process 审中-公开
标题翻译：树脂封装制造工艺
公开(公告)号：EP0928022A2
公开(公告)日：1999-07-07
申请号：EP98310400.1
申请日：1998-12-17
申请人： TDK Corporation
发明人： Gotoh, Masashi , Kanazawa, Jitsuo , Yamamoto, Syuichiro
IPC分类号： H01L21/48
CPC分类号： H01L21/50 , H01L21/4803 , H01L23/10 , H01L24/97 , H01L2224/16 , H01L2224/16225 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01065 , H01L2924/01073 , H01L2924/16195 , H01L2924/3511 , Y10T29/4913 , Y10T29/49146 , Y10T29/49147 , Y10T29/49158 , Y10T29/53174 , H01L2224/81
摘要： A resin package fabrication processes comprises three steps. At the first step, a thermosetting resin-containing resin substrate is machined. At the second step carried out after the first step, the resin substrate is heated to an original glass transition temperature that the resin substrate has or a temperature that is higher than the glass transition temperature so that the glass transition temperature that the resin substrate has is elevated to a new glass transition temperature. At the third step, a resin layer is placed on at least a portion of the resin substrate to which the new glass transition temperature is imparted, and the resin substrate with the resin layer placed on that portion is then heated to the original glass transition temperature or a temperature between the original glass transition temperature and the new glass transition temperature, thereby fixing the resin layer to the resin substrate.
摘要翻译：树脂封装制造工艺包括三个步骤。在第一步中，加工含热固性树脂的树脂基材。在第一步骤之后进行的第二步骤中，将树脂基板加热至树脂基板具有的原始玻璃化转变温度或高于玻璃化转变温度的温度，使得树脂基板具有的玻璃化转变温度为升高到新的玻璃化转变温度。在第三步骤中，将树脂层放置在赋予了新玻璃化转变温度的树脂基材的至少一部分上，然后将树脂层放置在该部分上的树脂基材加热至原始玻璃化转变温度或原始玻璃化转变温度与新玻璃化转变温度之间的温度，由此将树脂层固定到树脂基材上。

10. 发明公开

EP0893946A2 Circuit board having bonding areas to be joined with bumps by ultrasonic bonding 失效
标题翻译： Leiterplatte mit Anschlussstellen zur Verbindung mitHöckerndurchUltraschallschweißen
公开(公告)号：EP0893946A2
公开(公告)日：1999-01-27
申请号：EP98113678.1
申请日：1998-07-22
申请人： TDK Corporation
发明人： Gotoh, Masashi , Kanazawa, Jitsuo , Yamamoto, Syuichiro , Hondo, Kenji
IPC分类号： H05K1/11 , H05K3/32 , H01L21/60
CPC分类号： H05K3/328 , H01L24/81 , H01L2224/81205 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01074 , H01L2924/01079 , H01L2924/12042 , H01L2924/3025 , H05K1/0243 , H05K1/111 , H05K2201/0969 , H05K2201/10083 , H05K2203/0285 , H05K2203/049 , Y02P70/611 , H01L2924/00
摘要： A circuit board which comprises a conductive pattern section 4 with a pattern formed on a conductive layer 3 provided on a board main body 2, wherein two or more bonding positions 6a, 6b, 6c that bumps of a part mounted by ultrasonic bonding strike are set in the conductive pattern section 4, characterized in that a notch part 8a or a recess extending from the margin of the conductive pattern section 4 to the inside thereof and reaching the proximity of the bonding position or an isolated notch part 8b or recess is formed in the conductive layer in the proximity of at least one bonding position.
摘要翻译：一种电路板，其包括导电图案部分4，其具有形成在设置在板主体2上的导电层3上的图案，其中设置通过超声波接合冲击安装的部分的凸起的两个或更多个接合位置6a，6b，6c 在导电图案部分4中，其特征在于，从导电图案部分4的边缘延伸到其内部并到达接合位置附近的凹口部分8a或凹部或者隔离凹口部分8b或凹部形成在所述导电层在至少一个结合位置附近。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式