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1. 发明专利

DE69840379D1 未知
公开(公告)号：DE69840379D1
公开(公告)日：2009-02-05
申请号：DE69840379
申请日：1998-08-25
申请人： TDK CORP , NOF CORP
发明人： YAMADA TOSHIAKI , TAKAHASHI TAKESHI , YASUKAWA YOSHIYUKI , ENDOU KENJI , ASAMI SHIGERU , YAMADA MICHIHISA , MORIYA YASUO
IPC分类号： C08J3/24 , C08L101/00 , B32B27/00 , C08F212/08 , C08F255/00 , C08F255/02 , C08J5/18 , C08K5/00 , C08L23/00 , C08L23/08 , C08L23/20 , C08L51/06 , C08L53/00 , C08L101/02 , H01B3/44 , H05K1/03
摘要： The invention provides a heat-resistant, low-dielectric polymeric material that is preferably a copolymer in which a non-polar alpha -olefin base polymer segment and a vinyl aromatic copolymer segment are chemically combined with each other, and that is a thermoplastic resin showing a multi-phase structure in which a dispersion phase formed by one segment is finely dispersed in a continuous phase formed by another segment. It is thus possible to achieve a polymeric material that is excellent in heat resistance, has high strength, and has a low dielectric constant and a reduced dielectric loss, and so is suitable for an electrical insulating material for high-frequency purposes.

2. 发明专利

DE69942966D1 DIELEKTRISCHE VERBUNDWERKSTOFFZUSAMMENSETZUNG, UND FILM, SUBSTRAT, ELEKTRONISCHE TEILE UND FORMTEILE DAVON 未知
公开(公告)号：DE69942966D1
公开(公告)日：2011-01-05
申请号：DE69942966
申请日：1999-04-16
申请人： TDK CORP , NOF CORP
发明人： YAMADA TOSHIAKI , HASEGAWA HIROAKI , YASUKAWA YOSHIYUKI , ENDOU KENJI , YAMADA MICHIHISA , MORIYA YASUO , YAMADA TOMIHO , ITO TETSUYA
IPC分类号： H01B3/12 , C08K3/00 , H01B3/44 , H05K1/02 , H05K1/03

3. 发明公开

EP0991082A4 COMPOSITE DIELECTRIC MATERIAL COMPOSITION, AND FILM, SUBSTRATE, ELECTRONIC PARTS AND MOLDINGS THEREFROM 有权
标题翻译：电介质复合材料组成，薄膜，基材，电子部件和表单的一部分
公开(公告)号：EP0991082A4
公开(公告)日：2007-05-02
申请号：EP99913681
申请日：1999-04-16
申请人： TDK CORP , NOF CORP
发明人： YAMADA TOSHIAKI , HASEGAWA HIROAKI , YASUKAWA YOSHIYUKI , ENDOU KENJI , YAMADA MICHIHISA , MORIYA YASUO , YAMADA TOMIHO , ITO TETSUYA
IPC分类号： H01B3/18 , C08K3/00 , H01B3/44 , H05K1/02 , H05K1/03
CPC分类号： H01B3/442 , H05K1/024 , H05K1/032 , H05K1/0373 , H05K2201/0209
摘要： Intended to provide a composite dielectric material composition which, in the high frequency band, is capable of having an arbitrary dielectric constant over a relatively wide range thereof and has a low dielectric loss tangent, and a film, a substrate, electronic parts and moldings produced using the composition. A composite dielectric material composition comprising a filler and a heat-resistant polymer material of low dielectric property which comprises a resin composition composed of at least one resin having a weight average absolute molecular weight of 1,000 or more, wherein the sum of the number of carbon atoms and hydrogen atoms accounts for 99 % or more of the number of the total atoms of the resin composition and some or all of the molecules constituting the resin are chemically bonded to one another, and a film, a substrate, electronic parts and moldings produced using the composite dielectric material composition are provided.

4. 发明公开

EP0953608A4 HEAT-RESISTANT, LOWLY DIELECTRIC HIGH-MOLECULAR MATERIAL, AND FILMS, SUBSTRATES, ELECTRIC COMPONENTS AND HEAT-RESISTANT RESIN MOLDINGS PRODUCED THEREFROM 有权
标题翻译：耐热NIEDRIGDIELEKTRISCHES高分子材料和薄膜，基材，电器元件及制品生产的耐热树脂TRIMS
公开(公告)号：EP0953608A4
公开(公告)日：2005-07-13
申请号：EP98938977
申请日：1998-08-25
申请人： TDK CORP , NOF CORP
发明人： YAMADA TOSHIAKI , TAKAHASHI TAKESHI , YASUKAWA YOSHIYUKI , ENDOU KENJI , ASAMI SHIGERU , YAMADA MICHIHISA , MORIYA YASUO
IPC分类号： C08J3/24 , B32B27/00 , C08F212/08 , C08F255/00 , C08F255/02 , C08J5/18 , C08L23/00 , C08L23/08 , C08L23/20 , C08L51/06 , C08L53/00 , C08L101/02 , H01B3/44 , H05K1/03 , C08L101/00 , C08K5/00
CPC分类号： C08J5/18 , B32B27/00 , C08F255/00 , C08L23/08 , C08L23/0838 , C08L51/06 , C08L53/00 , C08L2203/202 , H01B3/442 , H05K1/032 , Y10T428/254 , Y10T428/31913 , Y10T428/31917 , Y10T428/31924 , C08L2666/04
摘要： A heat-resistant, lowly dielectric high-molecular material comprising a thermoplastic resin having a multi-layer structure composed of prefereably a non-polar α-olefinic polymer segment chemically bonded to a vinyl aromatic copolymer segment, wherein a dispersed phase formed by one segment is finely dispersed in a continuous phase formed by another segment. It has an excellent heat resistance, a high strength, a low permittivity suitable for high-frequency electric insulating materials, and a low dielectric loss.

5. 发明专利

DE602006011671D1 未知
公开(公告)号：DE602006011671D1
公开(公告)日：2010-03-04
申请号：DE602006011671
申请日：2006-04-19
申请人： TDK CORP
发明人： ENDOU KENJI , HATANAKA KIYOSHI , HIRAKAWA MASAHARU , NISHINO HARUO , FUJIOKA HIDEAKI
IPC分类号： H01L21/48 , H01L23/13 , H01L23/15 , H05K3/46
摘要： A multilayer ceramic substrate having a cavity is formed by the steps of laminating a plurality of ceramic green sheets (61-69) including ceramic green sheets (63-69) having through holes corresponding to the cavity (11) to form a multilayer body, pressing the multilayer body and firing the pressed body. At this time, shrinkage suppression green sheets (72,73) are laminated on the surfaces of the ceramic green sheets constituting the outermost layers of the multilayer body, and a shrinkage suppression green sheet piece (70a) is disposed on the ceramic green sheet exposed to the bottom of the cavity in accordance with the shape of the cavity A burnable sheet piece (71a) is further disposed on the shrinkage suppression green sheet piece. Before the pressing step, an embedded green sheet (74) separate from the ceramic green sheets (portion separated by inserting a cut) is disposed on the shrinkage suppression green sheet piece or the burnable sheet piece so that it is filled in the cavity. After the firing step, the embedded green sheet fired (75) is removed.

6. 发明专利

DE60217022D1 未知
公开(公告)号：DE60217022D1
公开(公告)日：2007-02-08
申请号：DE60217022
申请日：2002-07-09
申请人： TDK CORP
发明人： TASHIRO KOUJI , TAKUBO OSAMU , ENDOU KENJI
IPC分类号： H01P1/20 , H01P1/205 , H01P1/213 , H01P7/04
摘要： The invention is directed to a dielectric device that comprises a dielectric substrate (1) and at least one resonator unit (Q1). The dielectric substrate (1) comprises an outer surface covered with an external conductor film (3), excluding at least one end surface (21). The resonator unit (Q1) comprises a first hole (41) and a second hole (51). The first hole (41) is provided in said dielectric substrate (1), extending from said end surface (21) to an opposite surface (22) thereto, being open at said end surface (21) and said opposite surface (22), and having a first internal conductor (61) inside thereof. The second hole (51) is provided in said dielectric substrate (1) at a distance from said first hole (41), extending from said end surface (21) toward said opposite surface (22), being open at said end surface (21), closed at a bottom, and having a second internal conductor (81) inside thereof. The second internal conductor (81) is connected to said first internal conductor (61) at said end surface (21). The dielectric device includes at least one portion of external conductor film (301; 302; 303; 304) on said end surface (21) adjacent to said resonator unit (Q1), whereby said resonator unit (Q1) is inductively couplable to a further resonator unit.

7. 发明专利

DE60215749D1 未知
公开(公告)号：DE60215749D1
公开(公告)日：2006-12-14
申请号：DE60215749
申请日：2002-09-19
申请人： TDK CORP
发明人： TASHIRO KOUJI , ENDOU KENJI , TAKUBO OSAMU
IPC分类号： H01P1/205 , H01P1/213 , H01P7/04
摘要： The present invention relates to a dielectric device that is suitable for miniaturization and height reduction and is surface-mountable. In a resonator unit (Q1), a first hole (41) is provided to a dielectric substarate (1), extends from a surface (21) toward a surface (22) opposite thereto, opens in the surface (21), and has a first internal conductor (61) in the interior. A second hole (51) is provided to the dielectric substarate (1), opens in a surface 23 adjacent to the surface (21), extends from the surface (23) toward a surface (24) opposite thereto, and is connected with the first hole (41) in the interior of the dielectric substarate (1). The second hole (51) has a second internal conductor (81) in the interior, and the second internal conductor (81) is connected to the first internal conductor (61) in the interior of the dielectric substarate (1).

8. 发明专利

DE60217022T2 未知
公开(公告)号：DE60217022T2
公开(公告)日：2007-07-05
申请号：DE60217022
申请日：2002-07-09
申请人： TDK CORP
发明人： TASHIRO KOUJI , TAKUBO OSAMU , ENDOU KENJI
IPC分类号： H01P1/20 , H01P1/205 , H01P1/213 , H01P7/04
摘要： The invention is directed to a dielectric device that comprises a dielectric substrate (1) and at least one resonator unit (Q1). The dielectric substrate (1) comprises an outer surface covered with an external conductor film (3), excluding at least one end surface (21). The resonator unit (Q1) comprises a first hole (41) and a second hole (51). The first hole (41) is provided in said dielectric substrate (1), extending from said end surface (21) to an opposite surface (22) thereto, being open at said end surface (21) and said opposite surface (22), and having a first internal conductor (61) inside thereof. The second hole (51) is provided in said dielectric substrate (1) at a distance from said first hole (41), extending from said end surface (21) toward said opposite surface (22), being open at said end surface (21), closed at a bottom, and having a second internal conductor (81) inside thereof. The second internal conductor (81) is connected to said first internal conductor (61) at said end surface (21). The dielectric device includes at least one portion of external conductor film (301; 302; 303; 304) on said end surface (21) adjacent to said resonator unit (Q1), whereby said resonator unit (Q1) is inductively couplable to a further resonator unit.

9. 发明专利

DE60215749T2 未知
公开(公告)号：DE60215749T2
公开(公告)日：2007-02-08
申请号：DE60215749
申请日：2002-09-19
申请人： TDK CORP
发明人： TASHIRO KOUJI , ENDOU KENJI , TAKUBO OSAMU
IPC分类号： H01P1/205 , H01P1/213 , H01P7/04
摘要： The present invention relates to a dielectric device that is suitable for miniaturization and height reduction and is surface-mountable. In a resonator unit (Q1), a first hole (41) is provided to a dielectric substarate (1), extends from a surface (21) toward a surface (22) opposite thereto, opens in the surface (21), and has a first internal conductor (61) in the interior. A second hole (51) is provided to the dielectric substarate (1), opens in a surface 23 adjacent to the surface (21), extends from the surface (23) toward a surface (24) opposite thereto, and is connected with the first hole (41) in the interior of the dielectric substarate (1). The second hole (51) has a second internal conductor (81) in the interior, and the second internal conductor (81) is connected to the first internal conductor (61) in the interior of the dielectric substarate (1).

10. 发明专利

HK1085056A1 CIRCULATOR ELEMENT 未知
公开(公告)号：HK1085056A1
公开(公告)日：2006-08-11
申请号：HK06105001
申请日：2006-04-26
申请人： TDK CORP
发明人： ENDOU KENJI , KURAHASHI TAKAHIDE , HENMI SAKAE , OHATA HIDENORI
IPC分类号： H01F20100101 , H01P20100101
摘要： A technique for improving a circulator element for its temperature characteristic is provided. A circulator element including a garnet type ferrite material, and a permanent magnet for applying a direct-current magnetic field to the garnet type ferrite material, wherein S 11 represents the saturation magnetization of said garnet type ferrite material at a temperature T 1, S 12 represents one at a temperature T 2, and S 13 represents one at a temperature T 3; and S 21 represents the saturation magnetization of said permanent magnet at a temperature T 1, S 22 represents one at a temperature T 2, and S 23 represents one at a temperature T 3, where T 1 |(S 12- S 11 )/(T 2- T 1 )| |(S 13- S 12 )/(T 3- T 2 )|>|(S 23- S 22 )/(T 3- T 2 )| are satisfied.

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