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    • 7. 发明专利
    • Electrochemical device and circuit board
    • 电化学设备和电路板
    • JP2011222911A
    • 2011-11-04
    • JP2010093461
    • 2010-04-14
    • Tdk CorpTdk株式会社
    • ITO HIDETAKAHASEGAWA HIROAKIOHASHI YOSHIHIKOKATAI KAZUOMIYAKI YOSUKE
    • H01G11/66H01G11/74H01M2/10H01M2/30
    • Y02E60/12
    • PROBLEM TO BE SOLVED: To provide an electrochemical device enabling improvement in fixing strength between an electrode pad and a lead, and also to provide a circuit board.SOLUTION: A lead 3 of an electrochemical device includes a lead body 3A including Al, and first and second metal thin films 3a which are provided at the tip of the lead body 3A and protrudes from this tip position. These metal thin films 3a include thin film bodies containing Ni and plated layers which cover at least external surfaces of the thin film bodies and contain Sn. Specific regions on inner surfaces of the thin film bodies, and a surface of the lead body 3A directly come into contact with and welded to each other in a predetermined region without the intermediary of the plated layers.
    • 要解决的问题:提供能够改善电极焊盘和引线之间的固定强度的电化学装置,并且还提供电路板。 解决方案:电化学装置的引线3包括包括Al的引线主体3A和设置在引线本体3A的尖端处并从该尖端位置突出的第一和第二金属薄膜3a。 这些金属薄膜3a包括含有Ni和镀层的薄膜体,其至少覆盖薄膜体的外表面并含有Sn。 薄膜体的内表面上的特定区域,并且引线体3A的表面在预定区域内直接接触并彼此焊接,而不需要镀层的介质。 版权所有(C)2012,JPO&INPIT
    • 10. 发明专利
    • Electrochemical device and circuit board
    • 电化学设备和电路板
    • JP2011222917A
    • 2011-11-04
    • JP2010093472
    • 2010-04-14
    • Tdk CorpTdk株式会社
    • ITO HIDETAKAHASEGAWA HIROAKIOHASHI YOSHIHIKOKATAI KAZUOMIYAKI YOSUKE
    • H01G2/06H01G9/004H01G9/008H01G11/00H01G11/66H01G11/74H01M2/10H01M2/30
    • Y02E60/13
    • PROBLEM TO BE SOLVED: To provide an electrochemical device capable of improving fixing strength between an electrode pad and a lead, and also to provide a circuit board.SOLUTION: A lead 3 of an electrochemical device includes a lead body 3A including Al and a metal thin film 3a which is provided and folded at the tip of the lead body 3A. This metal thin film 3a includes a thin film body 3a1 containing Ni and a plated layer 3a2 covering at least an external surface of the folded thin film body 3a1 and containing Sn. A specific region on an inner surface of the folded thin film body 3a1 and an upper face of the lead body 3A come into direct contact with and welded to each other in a predetermined region R3U without the intermediary of the plated layer 3a2.
    • 要解决的问题:提供能够提高电极焊盘和引线之间的固定强度的电化学装置,并且还提供电路板。 解决方案:电化学装置的引线3包括包括Al的引线主体3A和在引线主体3A的尖端处设置和折叠的金属薄膜3a。 该金属薄膜3a包括含有Ni的薄膜体3a1和覆盖折叠薄膜体3a1的至少外表面并含有Sn的镀层3a2。 折叠薄膜体3a1的内表面上的特定区域和引线本体3A的上表面在预定区域R3U中彼此直接接触并彼此焊接,而不需要镀层3a2。 版权所有(C)2012,JPO&INPIT