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1. 发明专利

DE69034095T2 未知
公开(公告)号：DE69034095T2
公开(公告)日：2004-03-25
申请号：DE69034095
申请日：1990-01-12
申请人： TDK CORP
发明人： TAKAYA MINORU , MOCHIZUKI YOSHINORI
IPC分类号： H01L25/00 , H01L21/48 , H01L21/98 , H01L23/28 , H01L23/31 , H01L23/495 , H01L23/498 , H01L25/16 , H03H3/00 , H03H7/06 , H05K1/03 , H05K1/09 , H05K1/14 , H05K1/16 , H05K3/40 , H05K3/46
摘要： A method for producing a multi-layer hybrid circuit comprising the steps of : providing a laminated body having a plurality of passive elements including at least one selected from a capacitor (5) and an inductor (16), and also including a resistor (9), laminating an inner wiring portion (17) on said laminated body by laminating a plurality of insulation layers and flat conductive layers, attaching a plurality of side terminals (11) on sides of said laminated body for external connection, and sintering said laminated body at about 800 DEG C, all of the steps prior to the last step being performed without baking of the circuit being produced.

2. 发明专利

DE69033993T2 未知
公开(公告)号：DE69033993T2
公开(公告)日：2003-04-30
申请号：DE69033993
申请日：1990-12-13
申请人： TDK CORP
发明人： TAKAYA MINORU , MOCHIZUKI YOSHINORI , YASUDA KATSUHARU
IPC分类号： H01L27/01 , H03H7/09 , H05K1/16 , H01L49/00
摘要： A multilayer hybrid circuit having a laminated body having at least one of a plurality of dielectric layers, dielectric magnetic layers, and conductive patterns on said dielectric layers and said magnetic layers, is produced through printing process and sintering process, and composes capacitors, inductors, and resistors. An external connection is effected by side terminals positioned on side walls of the laminated body. A coupling conductor which is perpendicular to a dielectric plane is provided for coupling elements on different planes. Said coupling conductor is a succession of essentially S-shaped conductor chips or lines with the ends connected to adjacent conductor chips on different planes. That coupling conductor functions via a through hole conductor in a prior printed circuit board, and has high operational reliability in a component which is produced through sintering process. In one embodiment, an inductor is produced by a pair of coils connected in series with each other to reduce the thickness of the laminated body while providing high inductance.

3. 发明专利

DE69034095D1 未知
公开(公告)号：DE69034095D1
公开(公告)日：2003-09-18
申请号：DE69034095
申请日：1990-01-12
申请人： TDK CORP
发明人： TAKAYA MINORU , MOCHIZUKI YOSHINORI
IPC分类号： H01L25/00 , H01L21/48 , H01L21/98 , H01L23/28 , H01L23/31 , H01L23/495 , H01L23/498 , H01L25/16 , H03H3/00 , H03H7/06 , H05K1/03 , H05K1/09 , H05K1/14 , H05K1/16 , H05K3/40 , H05K3/46
摘要： A method for producing a multi-layer hybrid circuit comprising the steps of : providing a laminated body having a plurality of passive elements including at least one selected from a capacitor (5) and an inductor (16), and also including a resistor (9), laminating an inner wiring portion (17) on said laminated body by laminating a plurality of insulation layers and flat conductive layers, attaching a plurality of side terminals (11) on sides of said laminated body for external connection, and sintering said laminated body at about 800 DEG C, all of the steps prior to the last step being performed without baking of the circuit being produced.

4. 发明专利

DE69033993D1 未知
公开(公告)号：DE69033993D1
公开(公告)日：2002-09-19
申请号：DE69033993
申请日：1990-12-13
申请人： TDK CORP
发明人： TAKAYA MINORU , MOCHIZUKI YOSHINORI , YASUDA KATSUHARU
IPC分类号： H01L27/01 , H03H7/09 , H05K1/16 , H01L49/00
摘要： A multilayer hybrid circuit having a laminated body having at least one of a plurality of dielectric layers, dielectric magnetic layers, and conductive patterns on said dielectric layers and said magnetic layers, is produced through printing process and sintering process, and composes capacitors, inductors, and resistors. An external connection is effected by side terminals positioned on side walls of the laminated body. A coupling conductor which is perpendicular to a dielectric plane is provided for coupling elements on different planes. Said coupling conductor is a succession of essentially S-shaped conductor chips or lines with the ends connected to adjacent conductor chips on different planes. That coupling conductor functions via a through hole conductor in a prior printed circuit board, and has high operational reliability in a component which is produced through sintering process. In one embodiment, an inductor is produced by a pair of coils connected in series with each other to reduce the thickness of the laminated body while providing high inductance.

5. 发明专利

JPS62279622A LAMINATED LC FILTER PARTS 失效
公开(公告)号：JPS62279622A
公开(公告)日：1987-12-04
申请号：JP12130286
申请日：1986-05-28
申请人： TDK CORP
发明人： TAKATANI MINORU , MOCHIZUKI YOSHINORI
IPC分类号： H01G4/30 , H01G4/40

6. 发明专利

JPH02230810A LAMINATED HYBRID CIRCUIT INTEGRATION TYPE TRANSMISSION FILTER 失效
公开(公告)号：JPH02230810A
公开(公告)日：1990-09-13
申请号：JP5106889
申请日：1989-03-03
申请人： TDK CORP
发明人： TAKATANI MINORU , MOCHIZUKI YOSHINORI
IPC分类号： H03H11/10
摘要： PURPOSE:To obtain a steep attenuation characteristic and to save the power consumption by constituting a main body of a filter of an active filter, and constituting an equalizer of a passive filter. CONSTITUTION:An active filter 18 consists of an operational amplifier 20 in an IC chip 15, a resistor 21 included in a resistance network 9, a capacitor 22 being a component in a capacitor network 2 through the interconnection via a wire pattern including a pad 14 and a terminal 6 to form a filter main body to obtain a steep attenuation characteristic. A passive filter 19 consists of a remaining capacitor 22 in the capacitor network 2 in a laminator 1 and an inductor 23 in an inductor network 3 and acts like an equalizer to make a group attenuation constant. Thus, a steep attenuation characteristic is obtained by the active filter 18 and the passive filter 19 enough to have a low Q acts like an equalizer function thereby reducing the power consumption.

7. 发明专利

JPH02229462A STRUCTURE OF LAMINATED HYBRID INTEGRATED CIRCUIT COMPONENT 失效
公开(公告)号：JPH02229462A
公开(公告)日：1990-09-12
申请号：JP5077389
申请日：1989-03-02
申请人： TDK CORP
发明人： TAKATANI MINORU , MOCHIZUKI YOSHINORI
IPC分类号： H01F27/00 , H01G4/40 , H01L27/01
摘要： PURPOSE:To reduce the number of wiring patterns on an electronic-component mounting face by a method wherein an internal wiring part is formed inside a laminated body so as to be piled up on a network and said internal wiring part is formed of the following: one or more layers of insulating layers; plane conductor layers formed along the insulating layers; a through hole part used to connect electrically the plane conductor layers in different layers by piercing the insulating layers. CONSTITUTION:An internal wiring part 17 which has been formed collectively on a capacitor network 5 is formed of the following: one or more layers, e.g. three layers, of insulating layers 18; plane conductor layers 19 formed respectively along the individual insulating layers 18; through hole parts 20 which are composed of a conductor and which mutually connect the plane conductor layers 19, 19 in different layers by piercing the insulating layers 18 by using a previously designed pattern. Ag, Ag-Pd, Pd or the like is used for the conductor for the through hole parts 20 and the plane conductor layers 19. A ceramic, a ferrite or glass is used for the insulating layers 18; the layers are formed by a thick-film printing operation in the same manner as a laminated-body IC.

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