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1. 发明专利

HK1034531A1 Electronic material composition, electronic articles and use of electronic material composition. 未知
公开(公告)号：HK1034531A1
公开(公告)日：2001-10-26
申请号：HK01105027
申请日：2001-07-18
申请人： TAIYO YUDEN KK
发明人： OGAWA HIDEKI , IRI KINYA , ITO MITSUYOSHI
IPC分类号： H01B1/22 , H01C7/00 , C08L81/04 , H05K1/09 , H05K3/28 , H05K3/32 , H05K9/00 , C08L , H01B
摘要： Provided is an electronic material composition which is capable of forming a cured film exhibiting a desired glass transition temperature, a desired stiffness modulus in a rubbery state and a desired extensibility at low temperatures. Also provided is an electronic component comprising a molded body, a packed body, a covering body, an electrode or a joining body, all being formed of the aforementioned electronic material composition. Also provided is a method of using the aforementioned electronic material composition, which is featured in that the electronic material composition is applied in a semi-cured state, and after the application thereof, completely cured.

2. 发明专利

JP2001011325A ELECTRONIC MATERIAL COMPOSITION, ARTICLE FOR ELECTRONIC USE AND USAGE OF ELECTRONIC MATERIAL COMPOSITION 失效
公开(公告)号：JP2001011325A
公开(公告)日：2001-01-16
申请号：JP18466999
申请日：1999-06-30
申请人： TAIYO YUDEN KK
发明人： OGAWA HIDEKI , IRI KINYA , ITO MITSUYOSHI
IPC分类号： H05K9/00 , C08K3/04 , C08K3/08 , C08K3/20 , C08L81/04 , C08L101/00 , C08L101/16
摘要： PROBLEM TO BE SOLVED: To obtain the subject composition, capable of exhibiting specific physical properties after curing, having a strength and capable of improving the yield even by miniaturization and further providing molded products having resistance to a sudden temperature change by including a curable polymer. SOLUTION: This composition for an electronic material comprises at least a curable polymer and has at least (A) temperature characteristics of rigidity in which the glass transition temperature in a process for transfer from a glassy state into a rubbery state is -50 to +50 deg.C in a change of the rigidity for temperature and (B) 105 to 107 Pa rigidity in the rubbery state as physical properties after curing. Furthermore, the composition preferably has (C) an extensibility without breaking with 5% shear strain at -50 deg.C as the physical properties. The curable polymer used is preferably a curable polymer containing a polysulfide-based polymer. A powder of the electronic material can further be added to the composition to provide a composition having the above physical properties.

3. 发明专利

JP2000059003A HYBRID MODULE 失效
公开(公告)号：JP2000059003A
公开(公告)日：2000-02-25
申请号：JP22789298
申请日：1998-08-12
申请人： TAIYO YUDEN KK
发明人： NARITA NAOTO , IGUCHI KOICHI , ITO MITSUYOSHI , SHIMAMURA MASAYA , YAGI KAZUKI , INABA KAZUO , NAKAJIMA KUNIHIKO , SUZUKI YOSHIKI , MURAIDA MICHIO , KITAZAKI KENZO , ISHIYAMA MASAYUKI
IPC分类号： H05K1/18 , H01L25/00 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a compact, satisfactorily radiating and highly reliable hybrid module. SOLUTION: A hybrid module, wherein radiating inner electrodes 17A connecting to a ground terminal of a heat generating circuit components 13 packaged in recess part 14 formed on a circuit substrate 11 are formed, while the inner electrodes 17A are connected to radiating outer electrodes 17C is composed. Through these procedures, the heat generated by the circuit components 13 transferred to the radiating inner electrodes 17A through the intermediary of insulating resins 16 is radiated to outer space from the exposed part of the radiating inner conductor electrodes 17A and the radiating outer electrodes 17C.

4. 发明专利

JPH09289407A DIELECTRIC RESONATOR 失效
公开(公告)号：JPH09289407A
公开(公告)日：1997-11-04
申请号：JP12238096
申请日：1996-04-20
申请人： TAIYO YUDEN KK
发明人： AIKAWA YUTAKA , ITO MITSUYOSHI , UEHARA TAKAYUKI
IPC分类号： H01P7/04 , H01P11/00
摘要： PROBLEM TO BE SOLVED: To provide the dielectric resonator which can obtain an excellent Q value and contributes to the size reduction and weight reduction of an equipment. SOLUTION: A dielectric element body is cleaned and its outer peripheral surface is masked with resist. The dielectric element body after being masked is dipped in silver dip liquid, and lifted and dried in a heat-treatment furnace. Consequently, an internal electrode and a short-circuit electrode are formed. Then the resist is removed with a solvent, etc., the inner peripheral surface side of the dielectric element body is closed with a plug, and an external electrode is formed by the said dipping method. The plug is removed and one end surface is ground to remove the electrodes. Consequently, the internal and external electrodes have specific different film thicknesses. The relation between the internal and external film thicknesses and Q values is as shown in the graph, and an excellent Q value is obtained on condition that ra

5. 发明专利

JPH08186050A ELECTRONIC DEVICE AND PRODUCTION THEREOF 失效
公开(公告)号：JPH08186050A
公开(公告)日：1996-07-16
申请号：JP33762594
申请日：1994-12-28
申请人： TAIYO YUDEN KK
发明人： KANAI HIDEYUKI , ITO MITSUYOSHI , HONDA TOSHIMITSU
IPC分类号： H01G4/12 , H01G4/30 , H05K3/34
摘要： PURPOSE: To ensure a practical soldering strength while enhancing the wettability of molten solder regardless of surface oxide by employing an outer electrode comprising a plurality of conductive layers including a surface plating layer containing tin and at least one layer containing hydrogen being desorbed thermally. CONSTITUTION: A ceramic element 3 comprising inner electrodes 1 and ceramic dielectrics 2 laminated alternately is provided, at the opposite ends thereof, with outer electrodes 7, 7 each comprising a baked conductive film 4, a nickel plating layer 5 and a solder plating layer 6 thus producing a multilayer ceramic chip capacitor. When plating is carried out under a state of undue current density, the plating can be carried out while generating hydrogen and a predetermined quantity of hydrogen can be contained efficiently in the plating film. The hydrogen is desorbed at the melting point of solder, and when the plating film is employed in the outer electrodes 7, 7, hydrogen is desorbed through melting of solder at the time of soldering an electronic device to a printed board.

6. 发明专利

JPH06260806A HIGH FREQUENCY FILTER 失效
公开(公告)号：JPH06260806A
公开(公告)日：1994-09-16
申请号：JP7293593
申请日：1993-03-08
申请人： TAIYO YUDEN KK
发明人： IMAIZUMI TATSUYA , ITO MITSUYOSHI , YOSHIMORI KENJI , IGARASHI MASAO , KAZAMA SATOSHI , INOUE MAKOTO
IPC分类号： H01P1/205 , H01P1/212 , H01P7/04
摘要： PURPOSE:To easily suppress spurious resonance in a band-pass filter containing a TEM mode dielectric resonator. CONSTITUTION:First and second capacitors C1, C2 are added between one terminals of first and second dielectric resonators 1, 2 and the ground in the band-pass filter constituted by coupling the first and second dielectric resonators 1, 2 with a capacitor Cc. The capacitance of the second capacitor C2 is set larger than that of the first capacitor C1. The difference of capacitance between the first and second capacitors C1, C2 is adjusted by the thickness of a dielectric layer. The capacitors C1, C2 contribute to the suppression of the spurious resonance.

7. 发明专利

JP2000068705A DIELECTRIC RESONATOR AND FILTER USING THIS 失效
公开(公告)号：JP2000068705A
公开(公告)日：2000-03-03
申请号：JP24912598
申请日：1998-08-19
申请人： TAIYO YUDEN KK
发明人： SATO KAZUHISA , MIYAZAKI MASAKAZU , ITO MITSUYOSHI , IGUCHI KOICHI , ISHII SHIGETOSHI , YASUDA TOSHIHIRO
IPC分类号： H01P1/205
摘要： PROBLEM TO BE SOLVED: To easily reduce the attenuation of the low frequency side of the pass band of a dielectric filter. SOLUTION: First, second and third dielectric resonators 1a, 2a and 3a are arranged in parallel. First and second input/output terminal conductors 8a and 8b, first and second resonator capacity connecting conductors 9a' and 9b' and an intermediate resonator capacity connecting conductor 10' are arranged on the lower surface sides of first, second and third dielectric blocks 4a, 4b and 4c. A prescribed capacity is obtained between the conductors 8a, 8b and the conductors 9a', 9b'. The resonator 2a is for trapping.

8. 发明专利

JP2000049515A ELECTRIC CIRCUIT PART CONTAINING PORCELAIN SUBSTRATE AND ITS MANUFACTURE 失效
公开(公告)号：JP2000049515A
公开(公告)日：2000-02-18
申请号：JP23022998
申请日：1998-07-31
申请人： TAIYO YUDEN KK
发明人： ITO MITSUYOSHI , IGUCHI KOICHI , NAKAJIMA KUNIHIKO
IPC分类号： C23C28/00 , C23C28/04 , H01P1/205 , H01P9/04 , H01P11/00
摘要： PROBLEM TO BE SOLVED: To provide an electric circuit part having a conductor layer satisfying both an electric characteristic and a mechanical characteristic on a porcelain substrate by constituting the conductor layer of a first conductor layer, an intermediate layer formed on the surface of the first conductor layer and a second conductor layer formed on the intermediate layer in the electric circuit part containing the porcelain substrate and the conductor layer formed on the surface of the porcelain substrate. SOLUTION: Respective conductors are constituted of stacked conductors 23 formed of first and second layers 21 and 22. Conductive paste is applied to the first and second layers 21 and 22 and they are formed of baked layers. When the surface part 21b of the first layer 21 is arranged between an inner part 21a and the second layer 22, the mutual diffusion of solder and conductive particles in the inner part 21a of the first layer 21 is suppressed on the surface part 21b with much glass components, which functions as an intermediate layer, at the time of soldering, and a solder consumed phenomenon can be prevented, Then, the first layer 2 can mechanically be protected by the second layer 22.

9. 发明专利

JPH08264372A MANUFACTURE OF ELECTRONIC COMPONENT WITH ELECTROLESS PLATED FILM 失效
公开(公告)号：JPH08264372A
公开(公告)日：1996-10-11
申请号：JP8462695
申请日：1995-03-17
申请人： TAIYO YUDEN KK
发明人： KANAI HIDEYUKI , ITO MITSUYOSHI , HONDA TOSHIMITSU
IPC分类号： C23C18/16 , C23C18/52 , H01C7/02 , H01C7/04 , H01C17/28 , H01F27/29 , H01F41/02 , H01G4/12
摘要： PURPOSE: To reduce the variation in thickness and also lower film hardness by forming an electroless plated film using an electroless plating liquid having more oxygen than a normal oxygen concentration or having the electroless plated film obtained using an electroless plating liquid having normal oxygen concentration subjected to additional thermal treatment. CONSTITUTION: A baked conductive film 4 is formed by applying nickel conductive paste to both ends of a ceramic material 3 comprising internal electrodes 1 and ceramic inductors 2 alternately laminated and baking them. Then the material 3 is soaked in an electroless copper plating liquid and stirred in the air to form an electroless copper plated film 5 on the conductive film 4. Then after the material is rinsed in water, electrolytic nickel barrel plating is applied in nickel plating bath to form a nickel plated film 6. This material is further subjected to electrolytic solder barrel plating in solder plating bath to form a solder plated film 7, thereby forming external electrodes 8, 8.

10. 发明专利

JP2001335689A CURABLE POLYSULFIDE-BASED RESIN COMPOSITION FOR ELECTRONIC MATERIALS, ELECTRONIC DEVICE, AND METHOD OF USING CURABLE POLYSULFIDE-BASED RESIN COMPOSITION FOR ELECTRONIC MATERIALS 失效
公开(公告)号：JP2001335689A
公开(公告)日：2001-12-04
申请号：JP2000157511
申请日：2000-05-29
申请人： TAIYO YUDEN KK
发明人： OGAWA HIDEKI , IRI KINYA , ITO MITSUYOSHI
IPC分类号： C08J5/00 , C08G59/00 , C08G59/20 , C08K3/00 , C08L63/00 , C08L81/04 , C09D163/00 , C09D181/04 , H01F17/04 , H01F27/00 , H01F27/32
摘要： PROBLEM TO BE SOLVED: To provide a curable polysulfide-based resin composition having endurance against a stress generated at a thermal load such as re-flow soldering or heat cycling test, to provide an electronic device using the composition, and to provide a method of using the composition for electronic material. SOLUTION: This curable polysulfide resin composition contains as a principal component a polysulfide-based polymer having a polysulfide rubber structural frame in the polymer molecule. To an electronic device having a molded article, a filled body, a coated body, an outer electrode or a bonded body obtained by using the composition, this composition is applied in a semi-cured state, and then completely cured.

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