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1. 发明公开

KR20100109351A Thermosetting resin composition and cured product thereof 有权
标题翻译：热固性树脂组合物及其固化产品
公开(公告)号：KR20100109351A
公开(公告)日：2010-10-08
申请号：KR20090128698
申请日：2009-12-22
申请人： TAIYO INK MFG CO LTD
发明人： OGAWA YUTA , FUKUDA SHINICHIRO , MURATA KATSUTO
IPC分类号： C08L63/00 , C08K3/36 , C08K7/26 , C08L81/06
CPC分类号： H05K1/0373 , C08G59/226 , C08G59/38 , C08G75/08 , C08K3/36 , C08K5/3445 , C08L63/00 , C08L81/02 , H05K2201/0116 , H05K2201/0209 , C08L2666/14
摘要： PURPOSE: A thermosetting resin composition and a cured product thereof are provided to reduce the linear expansion coefficient by connecting a linear thermosetting resin to a through-hole of an amorphous silica corpuscle. CONSTITUTION: A thermosetting resin composition contains a linear thermosetting resin, and an amorphous silica corpuscle with a hole unit. The linear thermosetting resin selected form the group consisting of a linear epoxy resin, and a linear episulfide resin. The amorphous silica corpuscle has a honeycomb structure and the pore diameter of 1~10 nanometers.
摘要翻译：目的：提供一种热固性树脂组合物及其固化产物，通过将线性热固性树脂连接到无定形二氧化硅微粒的通孔来降低线性膨胀系数。构成：热固性树脂组合物含有线性热固性树脂和具有孔单元的无定形二氧化硅微粒。线性热固性树脂选自由直链环氧树脂和线性环硫树脂组成的组。无定形二氧化硅微球具有蜂窝结构，孔径为1〜10纳米。

2. 发明专利

JP2001085840A METHOD FOR MANUFACTURE OF MULTILAYER PRINTED WIRING BOARD 失效
公开(公告)号：JP2001085840A
公开(公告)日：2001-03-30
申请号：JP25978399
申请日：1999-09-14
申请人： TAIYO INK MFG CO LTD
发明人： YONEDA NAOKI , MURATA KATSUTO
IPC分类号： H05K3/38 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To improve adhesion between conductor circuit layers and an insulating resin layer having openings formed as via holes and to thereby ensure stable peel strength, by irradiating the surface of the insulating resin layer with short-wavelength UV rays. SOLUTION: Firstly, an insulating resin layer is formed on an insulating substrate having a first circuit layer formed thereon. Next, an opening is formed in the insulating resin layer as a via hole for electrical interconnection of the first circuit layer with a second circuit layer. Subsequently, the surface of the resultant insulating resin layer is roughened using a roughening agent after or before being irradiated with short-wavelength UV rays. Then, the insulating resin layer is plated, and the second circuit layer and the via hole is formed, for interlayer connection of the first and second circuit layers through the via hole. The steps, the formation of the insulating resin layer and the opening, irradiation of the insulating resin layer with the UV rays and its roughening, and the formation of the circuit layers are repeated as required.

3. 发明专利

JPH10269848A ALKALINE DEVELOPMENT TYPE PHOTO HARDENING CONDUCTIVE PASTE COMPOSITION AND PLASMA DISPLAY PANEL WHOSE ELECTRODE IS FORMED OF THE COMPOSITION 失效
公开(公告)号：JPH10269848A
公开(公告)日：1998-10-09
申请号：JP8994597
申请日：1997-03-26
申请人： TAIYO INK MFG CO LTD
发明人： KAWANA OSAMU , MURATA KATSUTO
IPC分类号： H01J9/02 , G03F7/00 , G03F7/004 , H01B1/22 , H05K1/09 , H05K3/02
摘要： PROBLEM TO BE SOLVED: To provide an alkaline development type photo hardening conductive paste composition for a plasma display panel, which can be formed into a highly precise electrode circuit in a large area with ease by a photolithography technique, and furthermore, enables a baking process to be performed at the temperature less than 600 deg.C. SOLUTION: This composition contains (A) copolymer resin made by the addition of the copolymer of methylmethacrylate and methacrylic acid and/or acrylic acid, with glycidylacrylate and/or glycidylmethacrylate, (B) photo polymerization starting agent, (C) photo polymerizing monomer, (D) at least one kind of metallic powder selected out of a group composed of Au, Ag, Ni and Al, (E) glass frit and (F) phosphoric compounds. After the glass substrate of a plasma display panel has been coated with the aforesaid conductive paste composition, it is exposure as specified by a pattern, and a highly precised electrode circuit can be obtained by baking the aforesaid substrate after it has been developed with alkaline water solution.

4. 发明专利

JPH08171863A COMPOSITION FOR FORMING PARTITION WALL OF PLASMA DISPLAY PANEL AND METHOD FOR FORMING PARTITION WALL USING IT 失效
公开(公告)号：JPH08171863A
公开(公告)日：1996-07-02
申请号：JP20189395
申请日：1995-07-17
申请人： TAIYO INK MFG CO LTD
发明人： KAKINUMA MASAHISA , KAWANA OSAMU , MURATA KATSUTO
IPC分类号： C01G23/04 , C03C3/102 , C08K3/34 , C08K3/40 , H01J9/02 , H01J9/24 , H01J11/22 , H01J11/34 , H01J11/36 , H01J17/16
摘要： PURPOSE: To enable a partition wall having the high precision and the high strength to be formed by making the partition wall contain a low-melting point glass having the specified work point, a polymer having two or more hydroxyl groups, an inorganic filler, a diluent and the specified organosilicic compound, and smoothly performing separation of a photosensitive film from a base plate by means of separation materials. CONSTITUTION: A partition wall forming composition contains a low-melting point glass having the work point of 560 deg.C or less, a hydroxyl group containing polymer having at least two or more hydroxyl groups in one molecule, an inorganic filler, a diluent, and an organosilicic compound having an alkoxy silane group wherein at least two or more alkoxyl groups are connected on one end and an amine end-group on the other end. After a photosensitive film 10 is stuck on the base plate 1, a photomask 13 provided with the specified pattern holes 14 is formed, the exposure and the development are performed, and grooves 12 are formed. Glass paste 11 is applied to the grooves 12 and dried. After the glass paste front surface is polished until the film 10 is exposed, the film 10 is separated by using NaOH aqueous solution, and a PDP partition wall 2 is obtained.

5. 发明专利

JPH11317112A ALKALI DEVELOPMENT PHOTO-CURING CONDUCTIVE PASTE COMPOSITION AND PLASMA DISPLAY PANEL HAVING IT USED FOR ELECTRODE 失效
公开(公告)号：JPH11317112A
公开(公告)日：1999-11-16
申请号：JP13589598
申请日：1998-05-01
申请人： TAIYO INK MFG CO LTD
发明人： FUKUSHIMA KAZUNOBU , TOKAI HIROYUKI , TAKAGI KOICHI , MURATA KATSUTO
IPC分类号： G03F7/004 , H01B1/20 , H01J9/02 , H01J11/22 , H01J11/24 , H01J11/34 , H01J11/02
摘要： PROBLEM TO BE SOLVED: To improve adhesion to a substrate after baking and between layers, suppress the occurrence of curl, and easily form conductive circuit patterns over a large area and in high fineness by a photolithography technology, and particularly, the lower layer electrode circuit of a bus electrode formed to the front face substrate of a plasma display panel. SOLUTION: The composition contains a resin having carboxyl group, photo- polymerized monomer, a photo-polymerization initiator, synthesized amorphous silica fine powder, conductive powder having a silanol group, and if necessary, heat resistance black pigment, glass frit, and a stabilizer. The photo-curing conductive paste composition is exposed according to desired patterns after coating on the glass substrate of a plasma display panel, and is baked after developing by alkali aqueous solution, thereby a highly fine electrode circuit can be formed.

6. 发明专利

JPH07301918A RESIST INK COMPOSITION AND FORMING METHOD OF SOLDER RESIST FILM 失效
公开(公告)号：JPH07301918A
公开(公告)日：1995-11-14
申请号：JP1815392
申请日：1992-01-06
申请人： TAIYO INK MFG CO LTD
发明人： INAGAKI HITOSHI , MURATA KATSUTO , HIDAKA ISAMU , SAWAZAKI KENJI
IPC分类号： G03F7/027 , C08G59/00 , C08G59/18 , C08G59/40 , C09D11/00 , C09D11/033 , C09D11/10 , C09D11/101 , C09D11/102 , C09D11/106 , G03F7/028 , H05K3/06 , H05K3/28
摘要： PURPOSE:To provide a resist ink compsn. and a film forming method to form a solder resist film having excellent adhesion property and heat resistance without causing resolution defect, bleeding, or problems concerning to embedding property in circuits and precision for printing position due to stretching or shrinkage of a screen. CONSTITUTION:This compsn. consists of (A) UV-curing resin having 30-150 acidity obtd. by the reaction of satd. or unsatd. polybasic acid anhydride and the reaction product of epoxy compd. and unsatd. monocarboxylic acid, (B) UV-curing monomer having 100-300 acidity obtd. by the reaction of methacrylate having hydroxyl groups and satd. or unsatd. polybasic acid anhydride, (C) unifunctional UV-curing monomer, (D) epoxy resin, (E) hardening agent for epoxy resin, and (F) photopolymn. initiator. The compsn. is applied on a substrate on which a conductive circuit is formed, precured with UV rays to form a resist film, then selectively peeled from the conductive circuit, and hardened with UV rays or/and by heating, or without curing to form the solder resist coating film.

7. 发明专利

JP2001226669A PASTE COMPOSITION OF FLUORESCENT SUBSTANCE 失效
公开(公告)号：JP2001226669A
公开(公告)日：2001-08-21
申请号：JP2000037880
申请日：2000-02-16
申请人： TAIYO INK MFG CO LTD
发明人： FURUHASHI TADASHI , ITOKAWA GEN , MURATA KATSUTO
IPC分类号： C09K11/00 , C09K11/02 , C09K11/08 , C09K11/64
摘要： PROBLEM TO BE SOLVED: To provide a paste composition of fluorescent substance excellent in dispersibility of the fluorescent substance, printability of the paste and low temperature burning property. SOLUTION: This paste composition of fluorescent substance is obtained by dispersing the fluorescent substance in a resin solution obtained by dissolving a polyalkylene carbonate in an organic solvent having no aromatic ring and having a solubility parameter (Sp value) of 8.0-10.0 and surface tension of 25-40 mN/m.

8. 发明专利

JPH09295830A COMPOSITION FOR FORMING SEPARATOR OF A PLASMA DISPLAY PANEL AND THE METHOD FORMING IT 失效
公开(公告)号：JPH09295830A
公开(公告)日：1997-11-18
申请号：JP12923196
申请日：1996-04-26
申请人： TAIYO INK MFG CO LTD
发明人： KAKINUMA MASAHISA , KAWANA OSAMU , MURATA KATSUTO , KOJIMA HIDEAKI
IPC分类号： C03C8/14 , H01J9/14 , H01J17/49
摘要： PROBLEM TO BE SOLVED: To obtain a composition capable of smoothly peeling only a photo sensitive film from a substrate by a releasing agent in a separator forming process for a plasma display panel and forming a high-precision, high strength separator having an enough aspect ratio and to provide a forming method of the separator. SOLUTION: The composition 11 comprising (A) a low melting glass having processing temperature between 560 deg.C to 700 deg.C, (B) a hydroxyl containing polymer having at least 2 hydroxyls in a molecule, (C) an inorganic filler, (D) a diluting agent, (E) an organic silicone compound having an alkoxysilane group having two or more bonded alkoxyls at one end and an amine based terminal group on the other end, or additional (F) block isocyanate compound having an isocyanate group blocked with an amine, is cast on the photo sensitive film 10 on the substrate 1 so as to fill in the groove 12 of the given pattern, dried, heat cured, and the photo sensitive film is peeled off by applying the releasing agent and then baked.

9. 发明专利

JPH09185167A PHOTOSETTING AND THERMOSETTING SOLDERING RESIST INK COMPOSITION 失效
公开(公告)号：JPH09185167A
公开(公告)日：1997-07-15
申请号：JP35240995
申请日：1995-12-28
申请人： TAIYO INK MFG CO LTD
发明人： FUKUSHIMA KAZUNOBU , MURATA KATSUTO , YABE MAYUMI , SAITO TERUO
IPC分类号： G03F7/004 , C09D11/00 , C09D163/06 , G03F7/027 , G03F7/028 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To obtain an alkali-developable photosetting and thermosetting soldering resist ink compsn. excellent in set to touch after temporary drying and development life and giving a cured coating film excellent in adhesion, electric insulating property, electric corrosion resistance, heat resistance to soldering, solvent, alkali and acid resistances, plating resistance, etc., required by a soldering resist. SOLUTION: This compsn. contains a photosensitive prepolymer having a carboxyl group and at least two ethylenically unsatd. bonds in one molecule and having 50-150mgKOH/g acid value of the solid component, a photopolymn. initiator, an org. solvent and a crystalline multifunctional epoxy compd. having 130-160C deg.C m.p. preferably 135-160 deg.C m.p. and slightly soluble in the org. solvent. α-Triglycidyl isocyanurate having epoxy groups bonded in the same direction to the skeleton face of an s-triazine ring is especially suitable for use as the epoxy compd.

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