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1. 发明专利

JPH11158252A THERMOSETTING RESIN COMPOSITION, PROTECTIVE FILM COMPRISING THE SAME AND ITS FORMING 失效
公开(公告)号：JPH11158252A
公开(公告)日：1999-06-15
申请号：JP24772498
申请日：1998-08-19
申请人： TAIYO INK MFG CO LTD
发明人： MORINO HIROMITSU , KAKINUMA KEIKO , SASAKI MASAKI
IPC分类号： C08G59/42 , C08F220/04 , C08F220/18 , C09D163/00 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition suitable for forming a flexible film which produces no warpage after thermosetting and shows excellence in flex resistance, bending resistance, flexibility, plating resistance, thermal resistance, PCT resistance, resistance to soldering heat, electric insulation and adhesion to a substrate, required for a solder resist used in manufacturing a flexible printed wiring board and a tape carrier package or a protective film used in manufacturing an electroluminescent panel or the like, a protective film comprising the hardened resin and its formation. SOLUTION: A thermosetting resin contains (A) a polycarboxylic acid having not less than 2 carboxylic acid groups, an acid number of 20-120 mgKOH/g, a glass transition temperature of -60 to 40 deg.C and weight average molecular weight of 5,000-100,000, (B) a resin having not less than 2 epoxy groups in a molecule, (C) an organic solvent and, in a preferable embodiment, (D) a mercapto compound.

2. 发明专利

JP2002030105A VISIBLE LIGHT-CURABLE RESIN COMPOSITION 失效
公开(公告)号：JP2002030105A
公开(公告)日：2002-01-31
申请号：JP2000217088
申请日：2000-07-18
申请人： TAIYO INK MFG CO LTD
发明人： KAKINUMA KEIKO , ONODERA SEIYA , YOKOYAMA YUTAKA
IPC分类号： C08F2/50 , C08F2/44 , C08F20/30 , C08F283/02 , C08F283/10 , C09D4/02 , C09D4/06 , C09D5/00 , C09D11/033 , C09D11/037 , C09D11/10 , C09D11/101 , C09D11/104 , C09D11/106
摘要： PROBLEM TO BE SOLVED: To provide a visible light-curable resin composition capable of giving a composition that has a fully curable characteristics even by a visible light, not only by an ultraviolet-ray, and excellent in the cure shrinkage resistance, and also capable of giving a cured substance excellent flexibility, adhesiveness, electrical insulation properties and chemical, thermal, water and PCT resistances. SOLUTION: The visible light-curable resin composition, as the first basic embodiment, contains (A) a photosensitive resin component which contains a vinyl compound having in the molecule one or more of hydroxy groups and aromatic rings and (B) photopolymerization- or polymerization-promoting components comprising a photopolymerization initiator, a sensitizing dye having an absorption in the wavelength range of 400-600 nm and a tertiary thiophosphite; and as the second embodiment it furthermore comprises, in the addition to the above components, (C) an epoxy resin and/or (D) a saturated polyester resin; and as the third embodiment, it furthermore contains, in the addition to the above components, (E) a silane coupling agent.

3. 发明专利

JP2001240609A ACTIVE ENERGY RAY CURABLE RESIN COMPOSITION 失效
公开(公告)号：JP2001240609A
公开(公告)日：2001-09-04
申请号：JP2000054077
申请日：2000-02-29
申请人： TAIYO INK MFG CO LTD
发明人： KAKINUMA KEIKO , ARIMA MASAO
IPC分类号： C08L63/00 , C08F2/44 , C08F2/46 , C08F20/30 , C08F283/00 , C08F283/10 , C08K5/54 , C08K5/541 , C08L67/00 , C09D4/00 , C09D5/00 , C09D163/00 , C09D167/00 , H01B3/44
摘要： PROBLEM TO BE SOLVED: To obtain an active energy ray curable resin composition excellent in water resistance and adhesion to a substrate while having advantages possessed by a resin composition of an ultraviolet curing system and capable of withstanding short-circuiting across electrodes by migration. SOLUTION: This active energy ray curable resin composition is a resin composition characterized in that the composition comprises (A) an active energy ray curable resin and (B) a photoradical polymerization initiator and >=50 mass % of the component (A) is (A') an active energy ray curable resin having one radically polymerizable ethylenically unsaturated double bond and one or more hydroxy groups and aromatic rings in the molecule according to a first fundamental mode thereof and the composition comprises (C) an epoxy resin in addition to the above components according to a second mode, further (D) an unsaturated polyester resin in addition to the above components according to a third mode and (E) a silane coupling agent in addition to the above components according to a fourth mode.

4. 发明专利

JP2001172364A PHOTOCURABLE RESIN COMPOSITION 失效
公开(公告)号：JP2001172364A
公开(公告)日：2001-06-26
申请号：JP36427799
申请日：1999-12-22
申请人： TAIYO INK MFG CO LTD
发明人： KAKINUMA KEIKO , ARIMA MASAO
IPC分类号： C08L63/00 , C08F226/06 , C08G59/40 , C09D4/00 , C09D5/25
摘要： PROBLEM TO BE SOLVED: To obtain a photocurable resin composition which is excellent in water resistance, adhesion to a substrate, and migration resistance while retaining advantages inherent in an ultraviolet-curable resin composition. SOLUTION: This composition essentially comprises (A) an active energy ray-curable resin having an ethylenical double bond, (B) an epoxy resin, and (C) a photopolymerization initiator. In the second embodiment, (D) a vinyltriazine derivative is incorporated into the composition in addition to the above ingredients. In the third embodiment, (E) a saturated polyester resin is further incorporated.

5. 发明专利

JP2000154208A PHOTO-CURING COMPOSITION 失效
公开(公告)号：JP2000154208A
公开(公告)日：2000-06-06
申请号：JP32825198
申请日：1998-11-18
申请人： TAIYO INK MFG CO LTD
发明人： KAKINUMA KEIKO , ARIMA MASAO
IPC分类号： C08F2/50 , C08F2/48 , G03F7/029
摘要： PROBLEM TO BE SOLVED: To provide a photo-curing composition excellent in photo-curing properties with not only UV ray but also especially with visible light irradiation which cures sufficiently with relatively small amount of light and which has a short gelation time and a deep photo-curing depth. SOLUTION: A photo-curing composition contains (A) an ethylenically unsaturated compound, (B) a radical polymerization initiator which can initiate radical polymerization of compound (A) in response to active energy rays and (C) a tertiary thiophosphite. Aspects of component (B) includes (B-1) a photoradical polymerization initiator having an absorption wavelength of 400 nm or more, (B-2) a photoradical polymerization initiator having an absorption wavelength less than 400 nm and (B-3) a mixture of (B-1) and (B-2).

6. 发明专利

JPH11322818A PHOTO-SETTING COMPOSITION 失效
公开(公告)号：JPH11322818A
公开(公告)日：1999-11-26
申请号：JP14826698
申请日：1998-05-14
申请人： TAIYO INK MFG CO LTD
发明人： KAKINUMA KEIKO , ARIMA MASAO
IPC分类号： G03F7/004 , C08F2/50 , C09D4/00 , G03F7/027
摘要： PROBLEM TO BE SOLVED: To obtain the subject composition excellent in photo-setting characteristics by irradiation of visible radiations and having a great photo- setting depth by including an ethylenically unsaturated compound, a bisacylphosphine oxide compound and an organic phosphine compound. SOLUTION: This composition is obtained by including (A) an ethylenically unsaturated compound, (B) a bisacylphosphine oxide compound represented by the formula (R1 is a 1-18C alkyl, phenyl or the like; R2 and R3 are each a 1-18C alkyl, O, S or the like) [e.g. bis(2,4,6-trimethylbenzoyl)methylphosphine oxide] and (C) an organic phosphine compound (e.g. phenylphosphine). In the composition, the amounts of the contained components based on 100 pts.wt. of the component A are preferably 0.1-10 pts.wt. of the component B and 0.01-10 pts.wt. of the component C. Furthermore, (D) a photopolymerization initiator (e.g. 2-hydroxy-2-methyl-1-phenylpropan-1-one) is preferably contained in an amount of 0.01-10 pts.wt. based on 100 pts.wt. of the component A.

7. 发明专利

JPH09235355A PHOTOCURABLE-THERMOSETTING RESIN COMPOSITION AND PRODUCTION OF MULTILAYER PRINTED WIRING BOARD USING THE SAME 失效
公开(公告)号：JPH09235355A
公开(公告)日：1997-09-09
申请号：JP6515696
申请日：1996-02-28
申请人： TAIYO INK MFG CO LTD
发明人： FUKUSHIMA KAZUNOBU , KAKINUMA KEIKO , SAITO TERUO
IPC分类号： G03F7/027 , C08G59/40 , C09D4/00 , C09D163/00 , C09J4/00 , C09J163/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To obtain a photocurable/thermosetting resin composition, and to provide a method for producing interlaminarly firmly bonded high-quality and high-density multilayer printed wiring boards in good mass-productiveness using the resin composition capable of executing via hole formation in good workability and high accuracy by selective etching of copper foils and resin adhesive layers. SOLUTION: This resin composition comprises (A) a polycarboxylic acid resin bearing two or more carboxylic acids in one molecule 30-110 deg.C in softening point and 80-250mgKOH/g in acid value, (B) a compound having one ethylenic unsaturated bond, (C) a compound having each one ethylenic unsaturated bond and carbccxyl group, (D) an epoxy compound bearing two or more epoxy groups, and (E) a photopolymerization initiator. A printed wiring board 1 provided with conductor circuits 2a, 2b is coated with this composition, which is then exposed to light to form resin adhesive layers 3a, 3b. Thereafter, copper foils 4a, 4b are subjected to hot press bonding to the resin adhesive layers 3a, 3b, respectively, and the copper foils are then selectively etched to bore fine holes, the resin adhesive layer portions under the fine holes are melted by an aqueous weakly alkaline solution to make via holes 11a, 11b, and the copper foils and conductor circuits are made electrically conductive by an electroconductive material through the via holes followed by providing the copper foils with a circuit pattern.

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