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1. 发明专利

DE602005001976D1 未知
公开(公告)号：DE602005001976D1
公开(公告)日：2007-09-27
申请号：DE602005001976
申请日：2005-06-08
申请人： TAIHO KOGYO CO LTD , KABUSHIKI KAISYA DENSO KARIYA
发明人： YOKOTA HIROMI , YOSHITOME DAISUKE , HAYAKAWA HIROAKI , INAYOSHI NARUHIKO , MURAKAMI YOUICHI , SUZUKI MASASHI , NOZU TAKAHIRO
IPC分类号： C22C9/00 , B22F5/00 , C22C1/04 , C22C9/02 , C22C9/06 , C22C32/00 , F16C33/12 , F16C33/14

2. 发明专利

DE602005001976T2 未知
公开(公告)号：DE602005001976T2
公开(公告)日：2008-05-08
申请号：DE602005001976
申请日：2005-06-08
申请人： TAIHO KOGYO CO LTD , KABUSHIKI KAISYA DENSO KARIYA
发明人： YOKOTA HIROMI , YOSHITOME DAISUKE , HAYAKAWA HIROAKI , INAYOSHI NARUHIKO , MURAKAMI YOUICHI , SUZUKI MASASHI , NOZU TAKAHIRO
IPC分类号： C22C9/00 , B22F5/00 , C22C1/04 , C22C9/02 , C22C9/06 , C22C32/00 , F16C33/12 , F16C33/14

3. 发明申请

WO2008018348A9 LEAD-FREE COPPER ALLOY SLIDING MATERIAL 审中-公开
标题翻译：无铅铜合金滑动材料
公开(公告)号：WO2008018348A9
公开(公告)日：2008-06-12
申请号：PCT/JP2007065125
申请日：2007-08-02
申请人： TAIHO KOGYO CO LTD , YOKOTA HIROMI , YOSHITOME DAISUKE
发明人： YOKOTA HIROMI , YOSHITOME DAISUKE
IPC分类号： C22C32/00 , B22F5/00 , C22C1/05 , C22C9/00 , C22C9/02 , F16C33/12
CPC分类号： C22C9/00 , C22C9/02 , C22C32/0089 , F16C2204/12
摘要： Cu-Sn-Bi/hard-particle type sliding materials have a drawback that the copper of the copper matrix flows during sliding to coat the bismuth phase therewith, resulting in a decrease in seizing resistance with time. A lead-free sliding material is provided which has a structure preventing such problem. The sliding material has a composition containing 1-15% Sn, 1-15% Bi, and 1-10% hard particles having an average particle diameter of 5-70 µm, the remainder being copper and incidental impurities. (2) It has a structure comprising a copper matrix and, dispersed therein, a bismuth phase and the hard particles, all the hard particles having been bonded to the copper matrix.
摘要翻译： Cu-Sn-Bi /硬质颗粒型滑动材料具有铜基体的铜在滑动过程中流动以涂覆铋相的缺点，导致耐烧蚀性随时间降低。提供具有防止这种问题的结构的无铅滑动材料。滑动材料具有包含1-15％Sn，1-15％Bi和1-10％平均粒径为5-70μm的硬颗粒的组合物，其余为铜和不可避免的杂质。（2）具有包含铜基质和分散在其中的铋相和硬质粒子的结构，所有硬质粒子都与铜基质结合。

4. 发明专利

DE602005015496D1 未知
公开(公告)号：DE602005015496D1
公开(公告)日：2009-08-27
申请号：DE602005015496
申请日：2005-01-13
申请人： TAIHO KOGYO CO LTD
发明人： YOKOTA HIROMI , YOSHITOME DAISUKE , KOBAYASI HIROAKI , KAWAGUTI HIROYUKI
IPC分类号： C22C1/05 , C22C9/00 , C22C1/04 , C22C32/00 , F16C33/12
摘要： [Task] Bi and hard matters of the Cu-Bi-hard matter based sintered alloy should fully exhibit the respective properties. [Means for Solution] In a Pb-free copper-based sintered alloy containing from 1 to 30 % of Bi and from 0.1 to 10 % of hard matter particles having from 10 to 50 ¼m of average particle diameter, (1) the Bi phase has smaller average particle diameter than that of the hard matter particles and is dispersed in the Cu matrix.

5. 发明公开

EP1717325A4 Pb FREE COPPER ALLOY SLIDING MATERIAL 有权
标题翻译：滑动材料无铅铜合金
公开(公告)号：EP1717325A4
公开(公告)日：2007-12-19
申请号：EP05703541
申请日：2005-01-13
申请人： TAIHO KOGYO CO LTD
发明人： YOKOTA HIROMI , YOSHITOME DAISUKE , KOBAYASI HIROAKI , KAWAGUTI HIROYUKI
IPC分类号： C22C1/05 , C22C9/00 , C22C1/04 , C22C32/00 , F16C33/12
CPC分类号： C22C32/0073 , B22F2998/10 , B22F2999/00 , C22C9/00 , C22C32/0089 , F16C33/121 , C22C1/05 , B22F3/10 , B22F3/18 , B22F2201/013
摘要： [PROBLEMS] To provide a Cu-Bi-hard substance base sintered alloy in which the respective properties of Bi and hard substance can be satisfactorily exerted. [MEANS FOR SOLVING PROBLEMS] There is provided a Pb free copper base sintered alloy, comprising 1 to 30% of Bi and 0.1 to 10% of hard substance particles of 10 to 50 μm average diameter, (1) wherein a Bi phase having an average particle diameter smaller than that of the hard substance particles is dispersed in a matrix of Cu, or wherein with respect to a Bi phase in contact with the hard substance particles, the ratio of presence of hard substance particles exhibiting a ratio of hard substance particle contact length to entire circumference of Bi phase of 50% or less is 70% or greater based on the total number of hard substance particles.

6. 发明公开

EP2048253A4 LEAD-FREE COPPER ALLOY SLIDING MATERIAL 失效
标题翻译：无铅铜合金夹头材料
公开(公告)号：EP2048253A4
公开(公告)日：2012-04-11
申请号：EP07791805
申请日：2007-08-02
申请人： TAIHO KOGYO CO LTD
发明人： YOKOTA HIROMI , YOSHITOME DAISUKE
IPC分类号： C22C32/00 , B22F5/00 , C22C1/05 , C22C9/00 , C22C9/02 , F16C33/12
CPC分类号： C22C9/00 , C22C9/02 , C22C32/0089 , F16C2204/12
摘要： When a Cu-Sn-Bi had-particle based sliding material is used for sliding, Cu of Cu matrix flows and covers up Bi phase. Seizure resistance lowers as time passes. A Pb-free sliding material preventing the reduction of seizure resistance is provided. (1) Composition: from 1 to 15% of Sn, from 1 to 15% of Bi, from 0.02 to 0.2% of P, and from 1 to 10% of hard particles having an average diameter of from 50 to 70 µm, with the balance being Cu and unavoidable impurities. (2) Structure: Bi phase and the hard particles are dispersed in the copper matrix, and all of said hard particles are bonded to the copper matrix.

7. 发明公开

EP2239345A4 PROCESS FOR PRODUCTION OF SINTERED COPPER ALLOY SLIDING MATERIAL AND SINTERED COPPER ALLOY SLIDING MATERIAL 有权
标题翻译：工艺用于从铜烧结合金及铜合金烧结滑动材料的滑动材料
公开(公告)号：EP2239345A4
公开(公告)日：2013-06-19
申请号：EP09704259
申请日：2009-01-22
申请人： TAIHO KOGYO CO LTD
发明人： WADA HITOSHI , TOMIKAWA TAKASHI , YOSHITOME DAISUKE , YOKOTA HIROMI
IPC分类号： C22C1/04 , B22F3/10 , C22C9/00 , C22C9/02 , F16C33/12 , F16C33/14
CPC分类号： B22F3/10 , B22F1/0003 , B22F3/1017 , C22C1/0425 , C22C9/00 , C22C9/02 , F16C2204/12 , F16C2204/18 , F16C2360/42

8. 发明公开

EP2116620A4 LEAD-FREE COPPER-BASED SINTER SLIDING MATERIAL 有权
标题翻译：铜基无铅烧结滑动材料
公开(公告)号：EP2116620A4
公开(公告)日：2012-01-04
申请号：EP08711178
申请日：2008-02-13
申请人： TAIHO KOGYO CO LTD
发明人： YOSHITOME DAISUKE , TOMIKAWA TAKASHI , WADA HITOSHI
IPC分类号： C22C9/00 , B22F5/00 , C22C1/04 , C22C9/02 , C22C9/06 , F16C33/10 , F16C33/12
CPC分类号： C22C9/02 , B22F2998/10 , C22C1/0425 , C22C9/00 , C22C9/06 , C22C32/0089 , F16C33/121 , F16C2204/18 , B22F3/1007 , B22F2201/013 , B22F3/115 , B22F3/18

9. 发明专利

JP2006037179A Pb-FREE COPPER-ALLOY-BASED COMPOSITE SLIDING MATERIAL SUPERIOR IN SEIZURE RESISTANCE 审中-公开
标题翻译：基于无铅铜合金的复合材料滑动材料超高分子电阻
公开(公告)号：JP2006037179A
公开(公告)日：2006-02-09
申请号：JP2004220238
申请日：2004-07-28
申请人： Taiho Kogyo Co Ltd , 大豊工業株式会社
发明人： YOKOTA HIROMI , YOSHITOME DAISUKE , TSUZUKI TSUNEYA
IPC分类号： C22C1/05 , B22F7/04 , C22C9/02 , C22C32/00 , F16C33/12 , F16C33/14
CPC分类号： F16C2204/10
摘要： PROBLEM TO BE SOLVED: To solve a problem that MoS
2 is oxidized in a process of manufacturing a copper-alloy-based composite sliding material having MoS
2 particles dispersed in a matrix consisting of copper alloy particles through sintering it, and accordingly does not show performance commensurate with an added quantity.
SOLUTION: A plated metallic phase exists in a boundary between the alloy particle and the MoS
2 particle, is sinter-bonded to the copper alloy particle, and is previously bonded to the MoS
2 particle before being sintered. Oxidized regions in MoS
2 are controlled to ten parts or less with respect to 100 parts of MoS
2 .
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题为了解决在制造具有分散有MoS 2 粒子的铜合金系复合滑动材料的工序中，MoS 2 的氧化问题在通过烧结由铜合金颗粒组成的基体中，因此不显示与添加量相称的性能。
解决方案：在合金粒子和MoS 2 粒子之间的边界中存在镀金属相，与铜合金粒子烧结接合，并预先与MoS 2 颗粒。 MoS 2 中的氧化区相对于100份MoS SB 2控制在10份以下。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2006037178A SLIDING MATERIAL SUPERIOR IN SEIZURE RESISTANCE MADE OF Pb-FREE COPPER ALLOY 有权
标题翻译：无铅铜合金耐磨性滑动材料超级
公开(公告)号：JP2006037178A
公开(公告)日：2006-02-09
申请号：JP2004220237
申请日：2004-07-28
申请人： Taiho Kogyo Co Ltd , 大豊工業株式会社
发明人： YOKOTA HIROMI , YOSHITOME DAISUKE
IPC分类号： C22C9/02 , B22F5/00 , B22F7/04 , C22C1/04 , C22C1/05 , C22C9/04 , C22C32/00
摘要： PROBLEM TO BE SOLVED: To solve a problem that MoS
2 and WS
2 used in a sliding material made of a Cu sintered alloy containing a solid lubricant are partially oxidized while being sintered, and graphite used in it is inferior in wettability with the Cu alloy when being sintered.
SOLUTION: The sliding material has a composition comprising a MoS
2 particle of 0.1 to 10%, each 10 to 50% molybdenum oxide and 0.1 to 10% copper sulfide when considering the MoS
2 particle as 100%, and the balance Cu with unavoidable impurities. The molybdenum oxide improves seizure resistance of the material and the copper sulfide lowers the hardness of the material, both of which make the sliding performance adequate.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题为了解决由含有固体润滑剂的Cu烧结合金制成的滑动材料中使用的MoS 2 和WS 2 的问题，其部分氧化同时被烧结，并且其中使用的石墨在烧结时与Cu合金的润湿性差。解决方案：当考虑到MoS 时，滑动材料具有包含0.1至10％的MoS 2 颗粒，每个10至50％的氧化钼和0.1至10％的硫化铜的组合物， 2 颗粒为100％，余量为Cu，不可避免的杂质。氧化钼提高了材料的抗咬合性，硫化铜降低了材料的硬度，这两者都使滑动性能充分。版权所有（C）2006，JPO＆NCIPI

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