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    • 1. 发明授权
    • Atmosphere furnace
    • 大气炉
    • US5017131A
    • 1991-05-21
    • US545891
    • 1990-06-29
    • Syoji SatoYutaka MakinoKazumi IshimotoYasuo Izumi
    • Syoji SatoYutaka MakinoKazumi IshimotoYasuo Izumi
    • B23K1/008C23C2/28F27B9/02F27B9/04F27B9/24F27D3/00F27D7/04F27D19/00H05K3/34
    • F27B9/24F27B9/028F27B9/04F27D2003/0061F27D2003/0087F27D2007/045F27D2019/0018
    • An atmosphere furnace including a plurality of divided furnace units, work transfer devices connecting the adjacent divided furnace units and those for the divided furnace units at both ends of the furnace. Each transfer device includes a tubular connecting frame and a work transfer member housed therein and the work transfer member has a work housing space in it. The work transfer member is rotatable, receives at a first position the work from outside or from an adjacent divided furnace unit into its work housing space, and send it out of the furnace or pass it to the adjacent divided furnace unit at a second position. When the work transfer member is at a middle position between the first and the second positions, the work housing space thereof faces an inner surface of the connecting frame so as to be sealed against the both end openings of the frame. Furthermore, it is provided with a channel for receiving the atmosphere from any divided furnace unit or outside space when the transfer member is at the middle position so as to have the work in the work housing space gradually heated or cooled through introduction of the atmosphere.
    • 包括多个分割炉单元的气氛炉,连接相邻的分割炉单元的工件传送装置和炉两端的分割炉单元。 每个传送装置包括容纳在其中的管状连接框架和工件传送构件,并且工件传送构件在其中具有工作容纳空间。 工件传送构件是可旋转的,在第一位置将工件从外部或从相邻的分割炉单元接收到其工作容纳空间中,并将其从炉中送出或在第二位置将其传递到相邻的分割炉单元。 当工件传送构件处于第一位置和第二位置之间的中间位置时,其工作容纳空间面向连接框架的内表面,以便与框架的两端开口密封。 此外,当传送构件处于中间位置时,设置有用于从任何分开的炉单元或外部空间接收气氛的通道,以便通过引入气氛而使作业容纳空间中的工作逐渐加热或冷却。
    • 5. 发明授权
    • Electric component mounting method
    • 电气元件安装方法
    • US5003692A
    • 1991-04-02
    • US524055
    • 1990-05-16
    • Yasuo IzumiKazumi IshimotoYutaka Makino
    • Yasuo IzumiKazumi IshimotoYutaka Makino
    • B23P21/00G06T1/00H05K13/04H05K13/08
    • H05K13/0413H05K13/08Y10T29/49131Y10T29/49133Y10T29/53178Y10T29/53261
    • A component mounting method for successively mounting electric components on a printed circuit board, which method comprises the steps of recognizing the position of an electric component retained by a suction nozzle by the effect of a suction force; recognizing the predetermined mounting position on a printed circuit board or any other suitable substrate, at a location spaced a predetermined distance from the printed circuit board; mounting the electric component after the latter has been aligned with the predetermined mounting position on the printed circuit board; and recognizing, through the suction nozzle, the electric component to determine if the electric component has been mounted properly after the suction nozzle has been elevated to a position spaced a predetermined distance upwardly from the printed circuit board. In the event that the latter has been mounted incorrectly, information indicative of an incorrect mounting of the electric component is recorded in a control data.
    • 一种用于在印刷电路板上连续安装电气部件的部件安装方法,该方法包括以下步骤:通过吸力来识别由吸嘴保持的电气部件的位置; 在与印刷电路板隔开预定距离的位置处识别印刷电路板或任何其它合适的基板上的预定安装位置; 在电气部件已经与印刷电路板上的预定安装位置对准之后安装电气部件; 并且通过吸嘴识别电气部件,以确定在吸嘴已经被升高到与印刷电路板之间向上隔开预定距离的位置之后电气部件是否已正确安装。 在后者安装不正确的情况下,表示电气部件安装不正确的信息被记录在控制数据中。
    • 10. 发明授权
    • Reflow apparatus
    • 回流装置
    • US5579981A
    • 1996-12-03
    • US371776
    • 1995-01-12
    • Nobuya MatsumuraKazumi IshimotoYoichi NakamuraKurayasu HamasakiKimihito KuwabaraMasahiro Taniguchi
    • Nobuya MatsumuraKazumi IshimotoYoichi NakamuraKurayasu HamasakiKimihito KuwabaraMasahiro Taniguchi
    • H05K3/34B23K1/008B23K1/012
    • B23K1/008B23K2201/42
    • A reflow apparatus includes a reflow furnace. A transfer device holds and transfers printed circuit boards with to-be-reflowed electronic components thereon from an inlet to an outlet of the furnace within the furnace. A plurality of adjusting/circulating sections separate an ambient gas for heating the printed circuit boards into predetermined temperature regions in the furnace in which the ambient gas is circulated in a heated state. A feed port is formed in the furnace to feed the ambient gas into the furnace under pressure. Residence parts each provided between adjacent adjusting/circulating sections regulate the amount of the ambient gas when the ambient gas, after having been sent to and heated in the adjusting/circulating section adjacent to the feed port, is circulated and sequentially moved to the adjusting/circulating sections at the inlet or the outlet and finally flows out through the inlet or outlet into atmosphere. Suction ports are open to the furnace to suck the ambient gas from the inside of the furnace. A flux removing unit is separate from the furnace and removes components of a flux from the ambient gas sucked through the suction ports from the inside of the furnace.
    • 回流装置包括回流炉。 转移装置在炉内从炉内的入口到出口保持并转移其上具有待回流电子部件的印刷电路板。 多个调节/循环部分将用于将印刷电路板加热的环境气体分离成炉中的环境气体在加热状态下循环的预定温度区域。 在炉中形成进料口,以在压力下将环境气体进料到炉中。 每个设置在相邻的调节/循环部分之间的居间部分调节环境气体的量,当环境气体在已经被送​​入并在与进料口邻近的调节/循环部分中被加热并循环并顺序地移动到调节/ 在入口或出口处循环切片,最后通过入口或出口流入大气。 吸入口向炉内开放以从炉内吸入环境气体。 助熔剂去除单元与炉分离,并从炉内部从吸入口吸入的环境气体中除去助熔剂的组分。