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1. 发明授权

US08553390B2 Ceramic electronic component 有权
标题翻译：陶瓷电子元件
公开(公告)号：US08553390B2
公开(公告)日：2013-10-08
申请号：US13177878
申请日：2011-07-07
申请人： Susumu Taniguchi , Miyuki Yanagida , Hisayuki Abe , Yukari Inoue , Masataka Kitagami
发明人： Susumu Taniguchi , Miyuki Yanagida , Hisayuki Abe , Yukari Inoue , Masataka Kitagami
IPC分类号： H01G4/06 , H01G4/228 , H01G4/005
CPC分类号： H01G4/12 , H01F17/0013 , H01F27/292 , H01G4/005 , H01G4/232
摘要： A ceramic electronic component 100 includes a ceramic body 1 in which internal electrodes containing a metal component is buried, and a pair of terminal electrodes 3 provided to cover both end surfaces 11 of the ceramic body to which the internal electrodes are exposed. Each of the terminal electrodes 3 has a first electrode layer and a second electrode layer formed by baking a conductive green sheet from a side close to the ceramic body 1. The second electrode layer contains the metal component diffused from the internal electrodes.
摘要翻译：陶瓷电子部件100包括陶瓷体1，其中埋设有包含金属成分的内部电极和设置成覆盖内部电极暴露于陶瓷体的两个端面11的一对端子电极3。端子电极3中的每一个具有第一电极层和通过从靠近陶瓷体1的一侧烘烤导电性生片而形成的第二电极层。第二电极层包含从内部电极扩散的金属成分。

2. 发明申请

US20120007709A1 CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：陶瓷电子元件
公开(公告)号：US20120007709A1
公开(公告)日：2012-01-12
申请号：US13177878
申请日：2011-07-07
申请人： Susumu Taniguchi , Miyuki Yanagida , Hisayuki Abe , Yukari Inoue , Masataka Kitagami
发明人： Susumu Taniguchi , Miyuki Yanagida , Hisayuki Abe , Yukari Inoue , Masataka Kitagami
IPC分类号： H01F5/00 , H01G4/12
CPC分类号： H01G4/12 , H01F17/0013 , H01F27/292 , H01G4/005 , H01G4/232
摘要： A ceramic electronic component 100 includes a ceramic body 1 in which internal electrodes containing a metal component is buried, and a pair of terminal electrodes 3 provided to cover both end surfaces 11 of the ceramic body to which the internal electrodes are exposed. Each of the terminal electrodes 3 has a first electrode layer and a second electrode layer formed by baking a conductive green sheet from a side close to the ceramic body 1. The second electrode layer contains the metal component diffused from the internal electrodes.
摘要翻译：陶瓷电子部件100包括陶瓷体1，其中埋设有包含金属成分的内部电极和设置成覆盖内部电极暴露于陶瓷体的两个端面11的一对端子电极3。端子电极3中的每一个具有第一电极层和通过从靠近陶瓷体1的一侧烘烤导电性生片所形成的第二电极层。第二电极层包含从内部电极扩散的金属成分。

3. 发明授权

US08749076B2 Resin paste composition 失效
标题翻译：树脂糊组合物
公开(公告)号：US08749076B2
公开(公告)日：2014-06-10
申请号：US13704639
申请日：2011-06-10
申请人： Chiaki Okada , Kazuhiko Yamada , Yukari Inoue
发明人： Chiaki Okada , Kazuhiko Yamada , Yukari Inoue
IPC分类号： H01L23/29 , B44C1/17 , H05K1/03
CPC分类号： H01L23/295 , C08K3/08 , C09D5/24 , C09D7/61 , H01L24/29 , H01L2224/2929 , H01L2224/29324 , H01L2224/29339 , H01L2224/83805 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/15747 , H01L2924/00 , H01L2924/01014 , H01L2924/00014 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The present invention relates to a resin paste composition including an organic compound, and a granular aluminum powder having an average particle diameter of from 2 to 10 μm and a flake-shaped silver powder having an average particle diameter of from 1 to 5 μm which are uniformly dispersed in the organic compound, and a semiconductor device manufactured by bonding a semiconductor element onto a supporting member through the resin paste composition and then encapsulating the resulting bonded product. According to the present invention, it is possible to provide a resin paste composition used for bonding an element such as semiconductor chips onto a lead frame which is excellent in not only electrical conductivity and bonding property but also working efficiency without using a large amount of rare and expensive silver, and a semiconductor device having a high productivity and a high reliability.
摘要翻译：本发明涉及包含有机化合物的树脂糊剂组合物和平均粒径为2〜10μm的粒状铝粉末和平均粒径为1〜5μm的片状银粉末均匀分散在有机化合物中，以及半导体器件，其通过树脂糊剂组合物将半导体元件粘合到支撑构件上，然后封装所得到的粘合产物。根据本发明，可以提供一种用于将诸如半导体芯片的元件接合到引线框架上的树脂浆料组合物，其不仅导电性和接合性能优异，而且在不使用大量稀有金属的情况下也具有工作效率和昂贵的银，以及具有高生产率和高可靠性的半导体器件。

4. 发明申请

US20090223695A1 STORAGE CASE 有权
标题翻译：存储盒
公开(公告)号：US20090223695A1
公开(公告)日：2009-09-10
申请号：US12296491
申请日：2007-04-18
申请人： Yukari Inoue , Hitoshi Imura
发明人： Yukari Inoue , Hitoshi Imura
IPC分类号： H05K5/06
CPC分类号： H05K5/061 , B60R16/0239 , H02G3/088 , H05K7/1432
摘要： A storage case (300) includes a case body (320) formed by joining a plurality of members (301, 302) with a joint structure (303a, 303b, 304) an opening (16) formed in the case body (320), a closure member (14) capable of closing the opening (16), a seal structure (17) provided between the case body (320) and the closure member (14), and a foreign-matter guide portion (10) provided on an outer surface of the case body (320), aside from the joint structure (303a, 303b, 304), such that the foreign-matter guide portion is located above the seal structure in the vertical direction of the storage case.
摘要翻译：存储箱（300）包括通过将形成在壳体（320）中的开口（16）的多个构件（301,302）与接头结构（303a，303b，304）接合而形成的壳体（320）能够关闭开口（16）的封闭构件（14），设置在壳体（320）和封闭构件（14）之间的密封结构（17）和设置在壳体（320）上的异物引导部分除了接合结构（303a，303b，304）之外，壳体（320）的外表面，使得异物引导部分位于密封结构的上方在储存盒的垂直方向上。

5. 发明申请

US20090120661A1 PROTECTIVE STRUCTURE FOR HIGH VOLTAGE CABLE 审中-公开
标题翻译：高压电缆保护结构
公开(公告)号：US20090120661A1
公开(公告)日：2009-05-14
申请号：US12091140
申请日：2006-11-08
申请人： Yukari Inoue , Hitoshi Imura
发明人： Yukari Inoue , Hitoshi Imura
IPC分类号： H01B3/30
CPC分类号： B60R16/0215 , B60K6/52 , Y02T10/6265
摘要： A protective structure for a high voltage cable includes a boost converter and a rear inverter installed in a hybrid vehicle and disposed to be separated from each other; a cable extending between the boost converter and the rear inverter; a protector provided in at least a section of a route along which the cable extends; and a flexible tube surrounding a circumference of the cable inside the protector and freely curved along a direction in which the cable extends. When external force is applied to the cable, the external force is reduced by the protector and the flexible tube. With such a configuration, a protective structure for a high voltage cable that prevents an excessive impact from being exerted on the cable in the event of a vehicle crash is provided.
摘要翻译：用于高压电缆的保护结构包括升压转换器和安装在混合动力车辆中并被布置为彼此分离的后逆变器; 在升压转换器和后逆变器之间延伸的电缆; 保护器设置在电缆延伸的路线的至少一部分中; 以及围绕保护器内部的电缆的周边的柔性管，并沿着电缆延伸的方向自由地弯曲。当外力施加到电缆时，外力通过保护器和柔性管减小。通过这样的结构，可以提供防止车辆碰撞时对电缆施加过大冲击的高压电缆用保护结构。

6. 发明授权

US08258400B2 Storage case 有权
标题翻译：储存箱
公开(公告)号：US08258400B2
公开(公告)日：2012-09-04
申请号：US12296491
申请日：2007-04-18
申请人： Yukari Inoue , Hitoshi Imura
发明人： Yukari Inoue , Hitoshi Imura
IPC分类号： H05K5/06
CPC分类号： H05K5/061 , B60R16/0239 , H02G3/088 , H05K7/1432
摘要： A storage case (300) includes a case body (320) formed by joining a plurality of members (301, 302) with a joint structure (303a, 303b, 304), an opening (16) formed in the case body (320), a closure member (14) capable of closing the opening (16), a seal structure (17) provided between the case body (320) and the closure member (14), and a foreign-matter guide portion (10) provided on an outer surface of the case body (320), aside from the joint structure (303a, 303b, 304), such that the foreign-matter guide portion is located above the seal structure in the vertical direction of the storage case.
摘要翻译：存储盒（300）包括通过将多个构件（301,302）与接头结构（303a，303b，304）接合形成的壳体（320），形成在壳体（320）中的开口（16），能够关闭开口（16）的封闭构件（14），设置在壳体（320）和封闭构件（14）之间的密封结构（17）和设置在壳体（320）上的异物引导部分除了接合结构（303a，303b，304）之外，壳体（320）的外表面，使得异物引导部位于密封结构的上方在储存箱的垂直方向上。

7. 发明申请

US20110114402A1 COOLING CONDUIT ARRANGEMENT FOR HYBRID VEHICLE WITH TWO RADIATORS 有权
标题翻译：具有两个散热器的混合车辆的冷却排水装置
公开(公告)号：US20110114402A1
公开(公告)日：2011-05-19
申请号：US13003093
申请日：2009-06-30
申请人： Yukari Inoue , Sachio Kiduka
发明人： Yukari Inoue , Sachio Kiduka
IPC分类号： B60K11/04 , B60K6/22 , B62D21/15
CPC分类号： B60K11/04 , B60K6/40 , B60K6/48 , B60K2001/003 , Y02T10/6221
摘要： An inflow conduit through which coolant flows into a hybrid radiator that is arranged in front of an engine radiator is arranged on an upper portion of a bumper reinforcement and attached to the front of the hybrid radiator. As a result, damage to the inflow conduit can be inhibited and the coolant can be cooled by running air before it is cooled in the hybrid radiator.
摘要翻译：冷却剂流入配置在发动机散热器前面的混合式散热器的流入管道布置在保险杠加强件的上部并且附接到混合式散热器的前部。结果，可以抑制流入管道的损坏，并且在混合式散热器中冷却之前，可以通过运行空气来冷却冷却剂。

8. 发明申请

US20130113121A1 RESIN PASTE COMPOSITION 失效
标题翻译：树脂组合物
公开(公告)号：US20130113121A1
公开(公告)日：2013-05-09
申请号：US13704639
申请日：2011-06-10
申请人： Chiaki Okada , Kazuhiko Yamada , Yukari Inoue
发明人： Chiaki Okada , Kazuhiko Yamada , Yukari Inoue
IPC分类号： C09J11/04 , H01L23/28
CPC分类号： H01L23/295 , C08K3/08 , C09D5/24 , C09D7/61 , H01L24/29 , H01L2224/2929 , H01L2224/29324 , H01L2224/29339 , H01L2224/83805 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/15747 , H01L2924/00 , H01L2924/01014 , H01L2924/00014 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The present invention relates to a resin paste composition including an organic compound, and a granular aluminum powder having an average particle diameter of from 2 to 10 μm and a flake-shaped silver powder having an average particle diameter of from 1 to 5 μm which are uniformly dispersed in the organic compound, and a semiconductor device manufactured by bonding a semiconductor element onto a supporting member through the resin paste composition and then encapsulating the resulting bonded product. According to the present invention, it is possible to provide a resin paste composition used for bonding an element such as semiconductor chips onto a lead frame which is excellent in not only electrical conductivity and bonding property but also working efficiency without using a large amount of rare and expensive silver, and a semiconductor device having a high productivity and a high reliability.
摘要翻译：本发明涉及一种包含有机化合物的树脂糊组合物和平均粒径为2〜10μm的平均粒径为1〜5μm的片状银粉，其为均匀分散在有机化合物中，以及半导体器件，其通过树脂糊剂组合物将半导体元件粘合到支撑构件上，然后封装所得到的粘合产物。根据本发明，可以提供一种用于将诸如半导体芯片的元件接合到引线框架上的树脂浆料组合物，其不仅导电性和接合性能优异，而且在不使用大量稀有金属的情况下也具有工作效率和昂贵的银，以及具有高生产率和高可靠性的半导体器件。

9. 发明授权

US08020656B2 Cooling conduit arrangement for hybrid vehicle with two radiators 有权
标题翻译：具有两个散热器的混合动力车辆的冷却导管装置
公开(公告)号：US08020656B2
公开(公告)日：2011-09-20
申请号：US13003093
申请日：2009-06-30
申请人： Yukari Inoue , Sachio Kiduka
发明人： Yukari Inoue , Sachio Kiduka
IPC分类号： B60K11/04
CPC分类号： B60K11/04 , B60K6/40 , B60K6/48 , B60K2001/003 , Y02T10/6221
摘要： An inflow conduit through which coolant flows into a hybrid radiator that is arranged in front of an engine radiator is arranged on an upper portion of a bumper reinforcement and attached to the front of the hybrid radiator. As a result, damage to the inflow conduit can be inhibited and the coolant can be cooled by running air before it is cooled in the hybrid radiator.
摘要翻译：冷却剂流入配置在发动机散热器前面的混合式散热器的流入管道布置在保险杠加强件的上部并且附接到混合式散热器的前部。结果，可以抑制流入管道的损坏，并且在混合式散热器中冷却之前，可以通过运行空气来冷却冷却剂。

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