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1. 发明申请

US20120175759A1 WIRING DEVICE FOR SEMICONDUCTOR DEVICE, COMPOSITE WIRING DEVICE FOR SEMICONDUCTOR DEVICE, AND RESIN-SEALED SEMICONDUCTOR DEVICE 有权
标题翻译：用于半导体器件的接线装置，用于半导体器件的复合布线器件和树脂密封半导体器件
公开(公告)号：US20120175759A1
公开(公告)日：2012-07-12
申请号：US13403616
申请日：2012-02-23
申请人： Susumu Baba , Masachika Masuda , Hiromichi Suzuki
发明人： Susumu Baba , Masachika Masuda , Hiromichi Suzuki
IPC分类号： H01L23/495
CPC分类号： H01L23/485 , H01L23/36 , H01L23/4827 , H01L23/49503 , H01L23/49531 , H01L23/49816 , H01L23/49833 , H01L23/49838 , H01L23/49883 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/16 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10162 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device connects an electrode on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.
摘要翻译：本发明提供一种半导体装置用布线装置，半导体装置用复合布线装置以及树脂密封型半导体装置，其能够搭载比常规芯片小的半导体芯片，并以低成本制造。布线装置将半导体芯片上的电极与外部布线装置连接，并且具有绝缘层，金属基板和铜布线层。布线装置具有相对于绝缘层设置在铜布线层一侧的半导体芯片支撑部。铜布线层包括第一端子，第二端子和布线部分。第一端子与电极连接。第二端子与外部接线装置连接。布线部将第一端子与第二端子连接。

2. 发明申请

US20090189263A1 Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device 有权
标题翻译：半导体装置用配线装置，半导体装置用复合布线装置以及树脂密封型半导体装置
公开(公告)号：US20090189263A1
公开(公告)日：2009-07-30
申请号：US12318955
申请日：2009-01-13
申请人： Susumu Baba , Masachika Masuda , Hiromichi Suzuki
发明人： Susumu Baba , Masachika Masuda , Hiromichi Suzuki
IPC分类号： H01L23/52 , H01L23/498
CPC分类号： H01L23/485 , H01L23/36 , H01L23/4827 , H01L23/49503 , H01L23/49531 , H01L23/49816 , H01L23/49833 , H01L23/49838 , H01L23/49883 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/16 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10162 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device electrically connects an electrode provided on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The metal substrate is provided on one side of the insulating layer. The copper wiring layer is provided on another side of the insulating layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode provided on the semiconductor chip. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.
摘要翻译：本发明提供一种半导体装置用布线装置，半导体装置用复合布线装置以及树脂密封型半导体装置，其能够搭载比常规芯片小的半导体芯片，并以低成本制造。布线装置将设置在半导体芯片上的电极与外部布线装置电连接，并且具有绝缘层，金属基板和铜布线层。金属基板设置在绝缘层的一侧。铜布线层设置在绝缘层的另一侧。布线装置具有相对于绝缘层设置在铜布线层一侧的半导体芯片支撑部。铜布线层包括第一端子，第二端子和布线部分。第一端子与设置在半导体芯片上的电极连接。第二端子与外部接线装置连接。布线部将第一端子与第二端子连接。

3. 发明授权

US08796832B2 Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device 有权
标题翻译：半导体装置用配线装置，半导体装置用复合布线装置以及树脂密封型半导体装置
公开(公告)号：US08796832B2
公开(公告)日：2014-08-05
申请号：US13403616
申请日：2012-02-23
申请人： Susumu Baba , Masachika Masuda , Hiromichi Suzuki
发明人： Susumu Baba , Masachika Masuda , Hiromichi Suzuki
IPC分类号： H01L23/52 , H01L23/498 , H01L23/495
CPC分类号： H01L23/485 , H01L23/36 , H01L23/4827 , H01L23/49503 , H01L23/49531 , H01L23/49816 , H01L23/49833 , H01L23/49838 , H01L23/49883 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/16 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10162 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device connects an electrode on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.
摘要翻译：本发明提供一种半导体装置用布线装置，半导体装置用复合布线装置以及树脂密封型半导体装置，其能够搭载比常规芯片小的半导体芯片，并以低成本制造。布线装置将半导体芯片上的电极与外部布线装置连接，并且具有绝缘层，金属基板和铜布线层。布线装置具有相对于绝缘层设置在铜布线层一侧的半导体芯片支撑部。铜布线层包括第一端子，第二端子和布线部分。第一端子与电极连接。第二端子与外部接线装置连接。布线部将第一端子与第二端子连接。

4. 发明授权

US08148804B2 Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device 有权
标题翻译：半导体装置用配线装置，半导体装置用复合布线装置以及树脂密封型半导体装置
公开(公告)号：US08148804B2
公开(公告)日：2012-04-03
申请号：US12318955
申请日：2009-01-13
申请人： Susumu Baba , Masachika Masuda , Hiromichi Suzuki
发明人： Susumu Baba , Masachika Masuda , Hiromichi Suzuki
IPC分类号： H01L23/52 , H01L23/498
CPC分类号： H01L23/485 , H01L23/36 , H01L23/4827 , H01L23/49503 , H01L23/49531 , H01L23/49816 , H01L23/49833 , H01L23/49838 , H01L23/49883 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/16 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10162 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device electrically connects an electrode provided on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The metal substrate is provided on one side of the insulating layer. The copper wiring layer is provided on another side of the insulating layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode provided on the semiconductor chip. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.
摘要翻译：本发明提供一种半导体装置用布线装置，半导体装置用复合布线装置以及树脂密封型半导体装置，其能够搭载比常规芯片小的半导体芯片，并以低成本制造。布线装置将设置在半导体芯片上的电极与外部布线装置电连接，并且具有绝缘层，金属基板和铜布线层。金属基板设置在绝缘层的一侧。铜布线层设置在绝缘层的另一侧。布线装置具有相对于绝缘层设置在铜布线层一侧的半导体芯片支撑部。铜布线层包括第一端子，第二端子和布线部分。第一端子与设置在半导体芯片上的电极连接。第二端子与外部接线装置连接。布线部将第一端子与第二端子连接。

5. 发明申请

US20110006410A1 Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device 有权
标题翻译：半导体布线组件，半导体复合布线组件和树脂密封半导体器件
公开(公告)号：US20110006410A1
公开(公告)日：2011-01-13
申请号：US12701053
申请日：2010-02-05
申请人： Susumu Baba , Masachika Masuda , Hiromichi Suzuki
发明人： Susumu Baba , Masachika Masuda , Hiromichi Suzuki
IPC分类号： H01L23/495
CPC分类号： H01L24/49 , H01L23/3107 , H01L23/49503 , H01L23/4952 , H01L23/49531 , H01L23/49541 , H01L23/49548 , H01L23/49568 , H01L24/16 , H01L24/28 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/743 , H01L2224/05554 , H01L2224/16 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48233 , H01L2224/484 , H01L2224/48599 , H01L2224/48647 , H01L2224/48847 , H01L2224/49171 , H01L2224/73265 , H01L2224/743 , H01L2224/85447 , H01L2224/92 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/10162 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15173 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： A semiconductor composite wiring assembly includes a wiring assembly and a lead frame. A copper wiring layer of the wiring assembly includes first terminals, second terminals, and wiring sections connecting the terminals. The second terminals and the lead frame are electrically connected by connecting members. The lead frame includes a die pad for mounting the wiring assembly, and lead sections located at outer positions. The die pad includes a central area in which a semiconductor chip is mounted via the wiring assembly, and a peripheral area connected to the central area with spaces formed therebetween that serve as resin-seal inflow spaces. The wiring assembly is positioned over the central area and the peripheral area so as to cover the central area completely and the peripheral area partially, and at least the central area and the peripheral area of the die pad are glued to the wiring assembly by resin paste.
摘要翻译：半导体复合布线组件包括布线组件和引线框架。布线组件的铜布线层包括第一端子，第二端子和连接端子的布线部分。第二端子和引线框架通过连接构件电连接。引线框架包括用于安装布线组件的管芯焊盘和位于外部位置的引线部分。芯片焊盘包括通过布线组件安装半导体芯片的中心区域和连接到中心区域的周边区域，其间形成有用作树脂密封流入空间的空间。布线组件位于中心区域和外围区域之上，以完全覆盖中心区域和周边区域，并且至少芯片垫的中心区域和周边区域通过树脂浆料粘合到布线组件。

6. 发明授权

US08471371B2 Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device 有权
标题翻译：半导体布线组件，半导体复合布线组件和树脂密封半导体器件
公开(公告)号：US08471371B2
公开(公告)日：2013-06-25
申请号：US12701053
申请日：2010-02-05
申请人： Susumu Baba , Masachika Masuda , Hiromichi Suzuki
发明人： Susumu Baba , Masachika Masuda , Hiromichi Suzuki
IPC分类号： H01L23/495
CPC分类号： H01L24/49 , H01L23/3107 , H01L23/49503 , H01L23/4952 , H01L23/49531 , H01L23/49541 , H01L23/49548 , H01L23/49568 , H01L24/16 , H01L24/28 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/743 , H01L2224/05554 , H01L2224/16 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48233 , H01L2224/484 , H01L2224/48599 , H01L2224/48647 , H01L2224/48847 , H01L2224/49171 , H01L2224/73265 , H01L2224/743 , H01L2224/85447 , H01L2224/92 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/10162 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15173 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： A semiconductor composite wiring assembly includes a wiring assembly and a lead frame. A copper wiring layer of the wiring assembly includes first terminals, second terminals, and wiring sections connecting the terminals. The second terminals and the lead frame are electrically connected by connecting members. The lead frame includes a die pad for mounting the wiring assembly, and lead sections located at outer positions. The die pad includes a central area in which a semiconductor chip is mounted via the wiring assembly, and a peripheral area connected to the central area with spaces formed therebetween that serve as resin-seal inflow spaces. The wiring assembly is positioned over the central area and the peripheral area so as to cover the central area completely and the peripheral area partially, and at least the central area and the peripheral area of the die pad are glued to the wiring assembly by resin paste.
摘要翻译：半导体复合布线组件包括布线组件和引线框架。布线组件的铜布线层包括第一端子，第二端子和连接端子的布线部分。第二端子和引线框架通过连接构件电连接。引线框架包括用于安装布线组件的管芯焊盘和位于外部位置的引线部分。芯片焊盘包括通过布线组件安装半导体芯片的中心区域和连接到中心区域的周边区域，其间形成有用作树脂密封流入空间的空间。布线组件位于中心区域和外围区域之上，以完全覆盖中心区域和周边区域，并且至少芯片垫的中心区域和周边区域通过树脂浆料粘合到布线组件。

7. 发明授权

US4994411A Process of producing semiconductor device 失效
标题翻译：半导体器件制造工艺
公开(公告)号：US4994411A
公开(公告)日：1991-02-19
申请号：US321385
申请日：1989-03-10
申请人： Takahiro Naito , Gen Murakami , Hiromichi Suzuki , Hajime Sato , Wahei Kitamura , Masachika Masuda
发明人： Takahiro Naito , Gen Murakami , Hiromichi Suzuki , Hajime Sato , Wahei Kitamura , Masachika Masuda
IPC分类号： H01L23/495
CPC分类号： H01L24/27 , H01L23/4951 , H01L23/49548 , H01L23/49558 , H01L24/32 , H01L2224/32014 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2224/92147 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/12044 , H01L2924/181 , Y10T29/49121
摘要： A process of producing a semiconductor device involving the steps of providing a lead frame having inner leads spaced from each other and connected together by a connecting portion; bonding a layer of an insulating material to the connecting portion and to surrounding portions of the inner leads; removing the connecting portion and a portion of the layer of insulating material to form end portions of the inner leads which are separated from each other and retained in a spaced arrangement by a remaning portion of the layer of insulating material; joining a semiconductor chip having bonding pads to the end portions of the inner leads; connecting the bonding pads on the semiconductor chip and the inner leads by wires; and encapsulating the semiconductor chip, the remaining portion of the layer of insulating material, the inner leads and the wires within a resin material; a peripheral portion of one face of the semiconductor chip partially overlapping faces of the end portions.
摘要翻译：一种制造半导体器件的方法，包括以下步骤：提供具有彼此间隔开并通过连接部连接在一起的内部引线的引线框架; 将绝缘材料层粘合到连接部分和内引线的周围部分; 去除所述连接部分和所述绝缘材料层的一部分以形成所述内部引线的端部，所述端部彼此分离并且通过所述绝缘材料层的剩余部分以间隔布置保持; 将具有接合焊盘的半导体芯片接合到所述内引线的端部; 通过电线连接半导体芯片上的接合焊盘和内部引线; 将半导体芯片，绝缘材料层的剩余部分，内部引线和电线封装在树脂材料内; 半导体芯片的一个面的周边部分与端部的部分重叠面。

8. 发明授权

US09263374B2 Semiconductor device and manufacturing method therefor 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US09263374B2
公开(公告)日：2016-02-16
申请号：US13230128
申请日：2011-09-12
申请人： Masachika Masuda , Koji Tomita , Tadashi Okamoto , Yasunori Tanaka , Hiroshi Ohsawa , Kazuyuki Miyano , Atsushi Kurahashi , Hiromichi Suzuki
发明人： Masachika Masuda , Koji Tomita , Tadashi Okamoto , Yasunori Tanaka , Hiroshi Ohsawa , Kazuyuki Miyano , Atsushi Kurahashi , Hiromichi Suzuki
IPC分类号： H01L29/72 , H01L23/495 , H01L21/48 , H01L21/56 , H01L21/683 , H01L23/31 , H01L23/36 , H01L25/10 , H01L23/00
CPC分类号： H01L23/49548 , H01L21/4832 , H01L21/568 , H01L21/6836 , H01L23/3107 , H01L23/3121 , H01L23/3128 , H01L23/36 , H01L23/49503 , H01L23/49517 , H01L23/49541 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L25/105 , H01L2221/68327 , H01L2221/68331 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48247 , H01L2224/48257 , H01L2224/48639 , H01L2224/48664 , H01L2224/4912 , H01L2224/49171 , H01L2224/49173 , H01L2224/49433 , H01L2224/73265 , H01L2224/83005 , H01L2224/834 , H01L2224/85005 , H01L2224/85439 , H01L2224/85464 , H01L2224/92247 , H01L2225/1023 , H01L2225/1029 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/1301 , H01L2924/14 , H01L2924/15311 , H01L2924/15313 , H01L2924/15331 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/1815 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01026
摘要： A semiconductor device includes, a lead frame having a die pad and a plurality of leads each disposed around the die pad, a semiconductor element rested on the die pad of the lead frame, and bonding wires for electrically interconnecting the lead of the lead frame and the semiconductor element. The lead frame, the semiconductor element, and the bonding wires are sealed with a sealing resin section. The sealing resin section includes a central region provided over and around the semiconductor device, and a marginal region provided in the periphery of the central region. Thickness of the central region is greater than that of the marginal region.
摘要翻译：一种半导体器件包括：具有管芯焊盘的引线框架和设置在管芯焊盘周围的多个引线;保持在引线框架的管芯焊盘上的半导体元件和用于将引线框架的引线电连接的接合线和半导体元件。引线框架，半导体元件和接合线用密封树脂部分密封。密封树脂部分包括设置在半导体器件上方和周围的中心区域和设置在中心区域周边的边缘区域。中部地区的厚度大于边缘地区的厚度。

9. 发明申请

US20120318231A1 Engine Stopping And Restarting System 有权
标题翻译：发动机停止和重新启动系统
公开(公告)号：US20120318231A1
公开(公告)日：2012-12-20
申请号：US13162301
申请日：2011-06-16
申请人： Hiromichi Suzuki
发明人： Hiromichi Suzuki
IPC分类号： F02B67/04 , F16H57/08
CPC分类号： F16H55/36 , B60K6/00
摘要： A system that automatically stops an engine when the vehicle is stopped and restarts the engine in response to a predetermined condition is disclosed. The system may generally include an engine and a motor for restarting the engine and driving an auxiliary machine when the engine is stopped, and an electrical power source for supplying electrical power to the motor. The motor may be disposed within a crank pulley housing and configured to be connected to a crankshaft. The motor may restart the engine in response to a predetermined condition. The system may include a gear reduction system for amplifying the torque provided by the motor. The motor may drive an auxiliary machine when the engine is stopped. The engine may drive the auxiliary machine when the engine is operating in drive.
摘要翻译：公开了一种在车辆停止时自动停止发动机并且响应于预定条件重新启动发动机的系统。该系统通常可以包括用于在发动机停止时重新启动发动机和驱动辅助机器的发动机和马达，以及用于向马达供电的电源。电动机可以设置在曲柄皮带轮壳体内并且被配置为连接到曲轴。电机可以响应于预定条件重新启动发动机。该系统可以包括用于放大由电动机提供的扭矩的齿轮减速系统。发动机停止时，电机可能会驱动辅机。当发动机在驱动器中运行时，发动机可以驱动辅助机器。

10. 发明申请

US20120283532A1 BIOLOGICAL OPTICAL MEASUREMENT INSTRUMENT AND METHOD FOR DISPLAYING INFORMATION RELATING TO NECESSITY/UNNECESSITY OF REPLACEMENT OF LIGHT-EMITTING UNIT 审中-公开
标题翻译：生物光学测量仪器和显示与发光单元更换的必要性/不可靠性有关的信息的方法
公开(公告)号：US20120283532A1
公开(公告)日：2012-11-08
申请号：US13509698
申请日：2010-11-11
申请人： Hiromichi Suzuki
发明人： Hiromichi Suzuki
IPC分类号： A61B5/1455 , G08B21/18
CPC分类号： A61B5/1455 , A61B2560/0276
摘要： Disclosed is a biological optical measurement instrument provided with: a light source unit which has a light-emitting unit that emits light and irradiates the light to an object; a light measurement unit configured to measure passing light at a measurement point of the object: a signal processing unit configured to process hemoglobin information outputted from the light measurement unit and create a light measurement image; and a display unit configured to display the light measurement image, further provided with a measurement/determination unit configured to measure the deterioration state of the light-emitting unit from the light output of the light-emitting unit and an electric current injected into the light-emitting unit and determine the necessity/unnecessity of replacement of the light-emitting unit, wherein the display unit displays information relating to the necessity/unnecessity of replacing the light-emitting unit determined by the measurement/determination unit.
摘要翻译：本发明公开了一种生物光学测量仪器，其具备：光源单元，其具有发光并将光照射到物体的发光单元; 光测量单元，被配置为测量物体的测量点处的通过光;信号处理单元，被配置为处理从所述光测量单元输出的血红蛋白信息并创建光测量图像; 以及显示单元，被配置为显示所述光测量图像，还具有测量/确定单元，所述测量/确定单元被配置为从所述发光单元的光输出测量所述发光单元的劣化状态和注入到所述光中的电流确定更换发光单元的必要性/不必要性，其中显示单元显示与由测量/确定单元确定的发光单元的更换的必要性/不必要性有关的信息。

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