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    • 1. 发明授权
    • Method of fabricating semiconductor device
    • 制造半导体器件的方法
    • US07846801B2
    • 2010-12-07
    • US11833050
    • 2007-08-02
    • Sung-jun KimSeong-kyu YunChang-ki HongBo-un YoonJong-won LeeHo-young Kim
    • Sung-jun KimSeong-kyu YunChang-ki HongBo-un YoonJong-won LeeHo-young Kim
    • H01L21/336
    • H01L29/66795H01L29/7851
    • Disclosed is a method of fabricating a semiconductor device including a multi-gate transistor. The method of fabricating a semiconductor device includes providing a semiconductor device having a number of active patterns which extend in a first direction, are separated by an isolation layer, and covered with a first insulating layer; forming a first groove by etching the isolation layer located between the active patterns adjacent to each other in the first direction; burying the first groove with a passivation layer; forming a second groove exposing at least a portion of both sides of the active patterns by etching the isolation layer located between the active patterns in a second direction intersecting the first direction; removing the passivation layer in the first groove; and forming a gate line filling at least a portion of the second groove and extending in the second direction.
    • 公开了一种制造包括多栅极晶体管的半导体器件的方法。 制造半导体器件的方法包括提供具有多个沿第一方向延伸的活性图案的半导体器件,被隔离层隔开并被第一绝缘层覆盖; 通过在第一方向上蚀刻位于彼此相邻的有源图案之间的隔离层来形成第一凹槽; 用钝化层掩埋第一槽; 通过在与所述第一方向相交的第二方向上蚀刻位于所述有源图案之间的所述隔离层来形成暴露所述有源图案的两侧的至少一部分的第二凹槽; 去除第一凹槽中的钝化层; 以及形成填充所述第二凹槽的至少一部分并沿所述第二方向延伸的栅极线。
    • 2. 发明申请
    • Method of Fabricating Semiconductor Device
    • 制造半导体器件的方法
    • US20080045019A1
    • 2008-02-21
    • US11833050
    • 2007-08-02
    • Sung-jun KimSeong-kyu YunChang-ki HongBo-un YoonJong-won LeeHo-young Kim
    • Sung-jun KimSeong-kyu YunChang-ki HongBo-un YoonJong-won LeeHo-young Kim
    • H01L21/302
    • H01L29/66795H01L29/7851
    • Disclosed is a method of fabricating a semiconductor device including a multi-gate transistor. The method of fabricating a semiconductor device includes providing a semiconductor device having a number of active patterns which extend in a first direction, are separated by an isolation layer, and covered with a first insulating layer; forming a first groove by etching the isolation layer located between the active patterns adjacent to each other in the first direction; burying the first groove with a passivation layer; forming a second groove exposing at least a portion of both sides of the active patterns by etching the isolation layer located between the active patterns in a second direction intersecting the first direction; removing the passivation layer in the first groove; and forming a gate line filling at least a portion of the second groove and extending in the second direction.
    • 公开了一种制造包括多栅极晶体管的半导体器件的方法。 制造半导体器件的方法包括提供具有多个沿第一方向延伸的活性图案的半导体器件,被隔离层隔开并被第一绝缘层覆盖; 通过在第一方向上蚀刻位于彼此相邻的有源图案之间的隔离层来形成第一凹槽; 用钝化层掩埋第一槽; 通过在与所述第一方向相交的第二方向上蚀刻位于所述有源图案之间的所述隔离层来形成暴露所述有源图案的两侧的至少一部分的第二凹槽; 去除第一凹槽中的钝化层; 以及形成填充所述第二凹槽的至少一部分并沿所述第二方向延伸的栅极线。
    • 7. 发明授权
    • Method for manufacturing multi-level transistor comprising forming selective epitaxial growth layer
    • 制造多级晶体管的方法,包括形成选择性外延生长层
    • US07524757B2
    • 2009-04-28
    • US11485485
    • 2006-07-13
    • Sung-jun KimChang-ki HongBo-un YoonJae-kwang Choi
    • Sung-jun KimChang-ki HongBo-un YoonJae-kwang Choi
    • H01L21/4763
    • H01L21/8221H01L27/0688H01L27/12
    • A method for manufacturing a multi-level transistor on a substrate. The method includes forming a first transistor on a first active region, forming a first selective epitaxial growth (SEG) layer on the substrate, and forming a preliminary second SEG layer and a dummy layer, wherein the preliminary second SEG layer is formed directly on only the first SEG layer and a portion of the first insulating layer formed on the cell region of the substrate, and wherein the dummy layer is formed on the peripheral region of the substrate. The method further includes planarizing the preliminary second SEG layer using the dummy layer as a stop layer to form a second SEG layer, forming a second active region from the second SEG layer formed on a first insulating layer, and forming a second transistor on the second active region.
    • 一种在衬底上制造多电平晶体管的方法。 该方法包括在第一有源区上形成第一晶体管,在衬底上形成第一选择性外延生长(SEG)层,形成初步的第二SEG层和虚设层,其中初步的第二SEG层直接形成 所述第一SEG层和形成在所述基板的单元区域上的所述第一绝缘层的一部分,并且所述虚设层形成在所述基板的周边区域上。 该方法还包括使用虚设层作为停止层平坦化初步的第二SEG层以形成第二SEG层,从形成在第一绝缘层上的第二SEG层形成第二有源区,并在第二绝缘层上形成第二晶体管 活跃区域。
    • 8. 发明授权
    • Method of fabricating non-volatile memory integrated circuit device and non-volatile memory integrated circuit device fabricated using the same
    • 制造非易失性存储器集成电路器件的方法和使用其制造的非易失性存储器集成电路器件
    • US08030150B2
    • 2011-10-04
    • US12397543
    • 2009-03-04
    • Byoung-ho KwonChang-ki HongBo-un YoonJun-yong Kim
    • Byoung-ho KwonChang-ki HongBo-un YoonJun-yong Kim
    • H01L21/8238
    • H01L27/11568H01L27/105H01L27/11526H01L27/11529
    • A method of fabricating a non-volatile memory integrated circuit device and a non-volatile memory integrated circuit device fabricated by using the method are provided. A device isolation region is formed in a substrate to define a cell array region and a peripheral circuit region. A plurality of first and second pre-stacked gate structures is formed in the cell array region, and each has a structure in which a lower structure, a conductive pattern and a first sacrificial layer pattern are stacked. Junction regions are formed in the cell array region. Spacers are formed on side walls of the first and second pre-stacked gate structures. A second sacrificial layer pattern filling each space between the second pre-stacked gate structures is formed. The first sacrificial layer pattern is removed from each of the first and second pre-stacked gate structures. A damascene metal layer pattern is formed in each of spaces of the first and second pre-stacked gate structures from which the first sacrificial layer pattern is removed, thus completing first and second stacked gate structures. The second sacrificial layer pattern is removed. A stop layer is formed on top surfaces of the first stacked gate structures, top surfaces and side walls of the second stacked gate structures, and a top surface of the substrate.
    • 提供了一种制造使用该方法制造的非易失性存储器集成电路器件和非易失性存储器集成电路器件的方法。 器件隔离区域形成在衬底中以限定电池阵列区域和外围电路区域。 在单元阵列区域中形成多个第一和第二预叠层栅极结构,并且每个都具有堆叠下部结构,导电图案和第一牺牲层图案的结构。 结区域形成在单元阵列区域中。 间隔件形成在第一和第二预堆叠栅极结构的侧壁上。 形成填充第二预堆叠栅极结构之间的每个空间的第二牺牲层图案。 第一牺牲层图案从第一和第二预堆叠栅极结构中的每一个去除。 在第一和第二预堆叠栅极结构的每个空间中形成镶嵌金属层图案,从中去除第一牺牲层图案,从而完成第一和第二堆叠栅极结构。 去除第二牺牲层图案。 在第一层叠栅极结构的顶表面,第二堆叠栅结构的顶表面和侧壁以及衬底的顶表面上形成停止层。
    • 10. 发明申请
    • Method of Fabricating Non-Volatile Memory Integrated Circuit Device and Non-Volatile Memory Integrated Circuit Device Fabricated Using the Same
    • 制造非易失性存储器集成电路器件和使用其的非易失性存储器集成电路器件的方法
    • US20080017915A1
    • 2008-01-24
    • US11763137
    • 2007-06-14
    • Byoung-ho KWONChang-ki HongBo-un YoonJun-yong Kim
    • Byoung-ho KWONChang-ki HongBo-un YoonJun-yong Kim
    • H01L27/105H01L21/8229
    • H01L27/11568H01L27/105H01L27/11526H01L27/11529
    • A method of fabricating a non-volatile memory integrated circuit device and a non-volatile memory integrated circuit device fabricated by using the method are provided. A device isolation region is formed in a substrate to define a cell array region and a peripheral circuit region. A plurality of first and second pre-stacked gate structures is formed in the cell array region, and each has a structure in which a lower structure, a conductive pattern and a first sacrificial layer pattern are stacked. Junction regions are formed in the cell array region. Spacers are formed on side walls of the first and second pre-stacked gate structures. A second sacrificial layer pattern filling each space between the second pre-stacked gate structures is formed. The first sacrificial layer pattern is removed from each of the first and second pre-stacked gate structures. A damascene metal layer pattern is formed in each of spaces of the first and second pre-stacked gate structures from which the first sacrificial layer pattern is removed, thus completing first and second stacked gate structures. The second sacrificial layer pattern is removed. A stop layer is formed on top surfaces of the first stacked gate structures, top surfaces and side walls of the second stacked gate structures, and a top surface of the substrate.
    • 提供了一种制造使用该方法制造的非易失性存储器集成电路器件和非易失性存储器集成电路器件的方法。 器件隔离区域形成在衬底中以限定电池阵列区域和外围电路区域。 在单元阵列区域中形成多个第一和第二预叠层栅极结构,并且每个都具有堆叠下部结构,导电图案和第一牺牲层图案的结构。 结区域形成在单元阵列区域中。 间隔件形成在第一和第二预堆叠栅极结构的侧壁上。 形成填充第二预堆叠栅极结构之间的每个空间的第二牺牲层图案。 第一牺牲层图案从第一和第二预堆叠栅极结构中的每一个去除。 在第一和第二预堆叠栅极结构的每个空间中形成镶嵌金属层图案,从中去除第一牺牲层图案,从而完成第一和第二堆叠栅极结构。 去除第二牺牲层图案。 在第一层叠栅极结构的顶表面,第二堆叠栅结构的顶表面和侧壁以及衬底的顶表面上形成停止层。