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    • 9. 发明申请
    • Vertical interconnection structure including carbon nanotubes and method of fabricating the same
    • 包括碳纳米管的垂直互连结构及其制造方法
    • US20070096616A1
    • 2007-05-03
    • US11544918
    • 2006-10-10
    • In-Taek HanHa-Jin KimSun-Woo Lee
    • In-Taek HanHa-Jin KimSun-Woo Lee
    • H01J1/02
    • H01L21/76879H01L21/76852H01L21/76855H01L23/485H01L23/53276H01L2221/1094H01L2924/0002H01L2924/00
    • Provided are a vertical interconnection structure including carbon nanotubes and a method of fabricating the same. The vertical interconnection structure includes a substrate; a lower electrode formed on the substrate; a catalyst layer formed on the lower electrode; an inactivated catalyst layer covering the lower electrode and having a first hole exposing the catalyst layer; an insulating layer which is formed on the inert catalyst layer and has a second hole connected to the first hole; a plurality of carbon nanotubes grown from an exposed area of the catalyst layer by the first hole; an upper electrode on the insulating layer being electrically connected to the carbon nanotubes, the inactivated catalyst layer is formed through a thermal reaction between the catalyst layer covering the lower electrode except for the catalyst layer in the first hole and a passivation layer having a third hole corresponding to the second hole.
    • 提供了包括碳纳米管的垂直互连结构及其制造方法。 垂直互连结构包括基板; 形成在所述基板上的下电极; 形成在下电极上的催化剂层; 钝化催化剂层,其覆盖所述下电极并具有暴露所述催化剂层的第一孔; 绝缘层,其形成在所述惰性催化剂层上并且具有连接到所述第一孔的第二孔; 由所述第一孔从所述催化剂层的暴露区域生长的多个碳纳米管; 绝缘层上的上电极与碳纳米管电连接,除了第一孔中的催化剂层之外的覆盖下电极的催化剂层和具有第三孔的钝化层之间的热反应形成失活的催化剂层 对应于第二个孔。