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    • 5. 发明授权
    • Fan
    • 风扇
    • US07828510B2
    • 2010-11-09
    • US11262850
    • 2005-11-01
    • Shun-Chen ChangWen-Shi Huang
    • Shun-Chen ChangWen-Shi Huang
    • F04D29/44F04D29/54
    • F04D17/164F04D25/0613F04D29/582
    • This is related to a fan including a casing, a first impeller structure, a second impeller structure, and at least one driving device. The casing has an outlet and an air-containing portion having an entrance and an exit provided inside the casing. The first impeller structure and the second impeller structure are installed inside the casing, and include a first blade set and a second blade set, respectively. The first blade set is located corresponding to the entrance of the air-containing portion. The second blade set is located corresponding to the exit of the air-containing portion. The driving device drives the first and second impeller structures.
    • 这涉及包括壳体,第一叶轮结构,第二叶轮结构和至少一个驱动装置的风扇。 壳体具有出口和空气容纳部分,其具有设置在壳体内部的入口和出口。 第一叶轮结构和第二叶轮结构分别安装在壳体内,并包括第一叶片组和第二叶片组。 第一叶片组对应于空气容纳部分的入口。 第二刀片组对应于空气容纳部分的出口。 驱动装置驱动第一和第二叶轮结构。
    • 10. 发明申请
    • Passive heat-dissipating fan system and electronic system containing the same
    • 被动散热风扇系统及其电子系统
    • US20070056293A1
    • 2007-03-15
    • US11370911
    • 2006-03-09
    • Shun-Chen ChangChia-Ming HsuWen-Shi Huang
    • Shun-Chen ChangChia-Ming HsuWen-Shi Huang
    • F25B21/02F25B9/00F25D17/06
    • F25B21/02F25B47/006F25B2321/0251H01L23/467H01L2924/0002H01L2924/00
    • A passive heat-dissipating fan system comprises an air-providing device, a cold-end passive heat-dissipating assembly, a hot-end passive heat-dissipating assembly, a separation device capable of guiding airflow to the cold-end and hot-end passive heat-dissipating assemblies, and a cooling device which is disposed in the separation device and has cold and hot ends. When the airflow from the air-providing device passes through the separation device and cooling device, airflow from the air-providing device is separated and then partially directed to the cold-end passive heat-dissipating assembly and partially directed to the hot-end passive heat-dissipating assembly respectively, expelling the heated airflow to an exterior of an electronic system. Because the temperature of the airflow passing through the cold-end passive heat-dissipating assembly is higher than that of dew point of air, the airflow passing through the cold-end passive heat-dissipating assembly can dissipate the heat generated by an electronic element without producing dew.
    • 被动散热风扇系统包括空气供应装置,冷端被动散热组件,热端无源散热组件,能够将气流引导到冷端和热端的分离装置 被动散热组件和设置在分离装置中并具有冷热端的冷却装置。 当来自空气提供装置的气流通过分离装置和冷却装置时,来自空气供应装置的气流被分离,然后部分地被引导到冷端被动散热组件,并且部分地被引导到热端被动 散热组件,将加热的气流排出到电子系统的外部。 由于通过冷端被动散热组件的空气的温度高于空气露点的气流,所以通过冷端被动散热组件的气流可以消散电子元件产生的热量而无需 产生露水。