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1. 发明申请

US20090042494A1 PAD CONDITIONER OF SEMICONDUCTOR WAFER POLISHING APPARATUS AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：半导体波形抛光装置的PAD调节器及其制造方法
公开(公告)号：US20090042494A1
公开(公告)日：2009-02-12
申请号：US12187007
申请日：2008-08-06
申请人： Sung-Taek Moon , Kyoung-Moon Kang , Bong-Su Ahn , Nam-Soo Kim , Gi-Sik Hong
发明人： Sung-Taek Moon , Kyoung-Moon Kang , Bong-Su Ahn , Nam-Soo Kim , Gi-Sik Hong
IPC分类号： B24B53/02 , B24D18/00 , C25D9/04 , B24B53/00
CPC分类号： C25D7/00 , B24B53/017 , B24B53/02 , B24D18/0018 , C23C26/00 , C25D13/02
摘要： A pad conditioner of semiconductor wafer polishing apparatus and a pad conditioner manufacturing method thereof are provided with a uniform conditioning for a polishing pad of a polishing apparatus, the polishing apparatus being for evenly planarizing a metal layer formed on the surface of wafer in a semiconductor device manufacturing processor. The pad conditioner may include a substrate constructed of a flat plate of disk shape, a coating part formed with a given thickness on the substrate, and a plurality of protrusion parts formed on the coating part, the plurality of protrusion parts having a plurality of polishing members based on the same size in a predetermined grouping or pattern.
摘要翻译：半导体晶片抛光装置的垫调节器及其垫调节器的制造方法为研磨装置的抛光垫设置均匀的调理装置，该抛光装置用于在半导体装置中均匀地平坦化形成在晶片表面上的金属层制造处理器。垫调节器可以包括由盘形平板，在基板上形成给定厚度的涂层部分和形成在涂层部分上的多个突起部分构成的基板，所述多个突出部分具有多个抛光基于相同尺寸的成员以预定的分组或模式。

2. 发明申请

US20060060568A1 Slurry compositions, methods of preparing slurry compositions, and methods of polishing an object using slurry compositions 失效
标题翻译：浆料组合物，制备浆料组合物的方法，以及使用浆料组合物抛光物体的方法
公开(公告)号：US20060060568A1
公开(公告)日：2006-03-23
申请号：US11205029
申请日：2005-08-17
申请人： Jae-Hyun So , Sung-Taek Moon , Dong-Jun Lee , Nam-Soo Kim , Bong-Su Ahn , Kyoung-Moon Kang
发明人： Jae-Hyun So , Sung-Taek Moon , Dong-Jun Lee , Nam-Soo Kim , Bong-Su Ahn , Kyoung-Moon Kang
IPC分类号： C09K13/00 , C03C15/00 , B44C1/22 , H01L21/461
CPC分类号： H01L21/7684 , C09G1/02 , C09K3/1463 , H01L21/3212
摘要： A slurry composition includes an acidic aqueous solution and one or both of, an amphoteric surfactant and a glycol compound. Examples of the amphoteric surfactant include a betaine compound and an amino acid compound, and examples of the amino acid compound include lysine, proline and arginine. Examples of the glycol compound include diethylene glycol, ethylene glycol and polyethylene glycol.
摘要翻译：浆料组合物包括酸性水溶液和两性表面活性剂和二醇化合物中的一种或两种。两性表面活性剂的实例包括甜菜碱化合物和氨基酸化合物，氨基酸化合物的实例包括赖氨酸，脯氨酸和精氨酸。二醇化合物的实例包括二甘醇，乙二醇和聚乙二醇。

3. 发明授权

US08007676B2 Slurry compositions, methods of preparing slurry compositions, and methods of polishing an object using slurry compositions 有权
标题翻译：浆料组合物，制备浆料组合物的方法，以及使用浆料组合物抛光物体的方法
公开(公告)号：US08007676B2
公开(公告)日：2011-08-30
申请号：US12128675
申请日：2008-05-29
申请人： Jae-Hyun So , Sung-Taek Moon , Dong-Jun Lee , Nam-Soo Kim , Bong-Su Ahn , Kyoung-Moon Kang
发明人： Jae-Hyun So , Sung-Taek Moon , Dong-Jun Lee , Nam-Soo Kim , Bong-Su Ahn , Kyoung-Moon Kang
IPC分类号： C03C15/00
CPC分类号： H01L21/7684 , C09G1/02 , C09K3/1463 , H01L21/3212
摘要： A slurry composition includes an acidic aqueous solution and one or both of, an amphoteric surfactant and a glycol compound. Examples of the amphoteric surfactant include a betaine compound and an amino acid compound, and examples of the amino acid compound include lysine, proline and arginine. Examples of the glycol compound include diethylene glycol, ethylene glycol and polyethylene glycol.
摘要翻译：浆料组合物包括酸性水溶液和两性表面活性剂和二醇化合物中的一种或两种。两性表面活性剂的实例包括甜菜碱化合物和氨基酸化合物，氨基酸化合物的实例包括赖氨酸，脯氨酸和精氨酸。二醇化合物的实例包括二甘醇，乙二醇和聚乙二醇。

4. 发明授权

US07402261B2 Slurry compositions, methods of preparing slurry compositions, and methods of polishing an object using slurry compositions 失效
标题翻译：浆料组合物，制备浆料组合物的方法，以及使用浆料组合物抛光物体的方法
公开(公告)号：US07402261B2
公开(公告)日：2008-07-22
申请号：US11205029
申请日：2005-08-17
申请人： Jae-Hyun So , Sung-Taek Moon , Dong-Jun Lee , Nam-Soo Kim , Bong-Su Ahn , Kyoung-Moon Kang
发明人： Jae-Hyun So , Sung-Taek Moon , Dong-Jun Lee , Nam-Soo Kim , Bong-Su Ahn , Kyoung-Moon Kang
IPC分类号： C09K13/00
CPC分类号： H01L21/7684 , C09G1/02 , C09K3/1463 , H01L21/3212
摘要： A slurry composition includes an acidic aqueous solution and one or both of, an amphoteric surfactant and a glycol compound. Examples of the amphoteric surfactant include a betaine compound and an amino acid compound, and examples of the amino acid compound include lysine, proline and arginine. Examples of the glycol compound include diethylene glycol, ethylene glycol and polyethylene glycol.
摘要翻译：浆料组合物包括酸性水溶液和两性表面活性剂和二醇化合物中的一种或两种。两性表面活性剂的实例包括甜菜碱化合物和氨基酸化合物，氨基酸化合物的实例包括赖氨酸，脯氨酸和精氨酸。二醇化合物的实例包括二甘醇，乙二醇和聚乙二醇。

5. 发明授权

US07578727B2 Conditioner device for conditioning polishing pad and chemical mechanical polishing apparatus including the same 有权
标题翻译：用于调理抛光垫的调节装置和包括其的化学机械抛光装置
公开(公告)号：US07578727B2
公开(公告)日：2009-08-25
申请号：US11466425
申请日：2006-08-22
申请人： Sung-Tae Moon , Dong-Jun Lee , Kyoung-Moon Kang , Nam-Soo Kim , Bong-Su Ahn
发明人： Sung-Tae Moon , Dong-Jun Lee , Kyoung-Moon Kang , Nam-Soo Kim , Bong-Su Ahn
IPC分类号： B24B53/00
CPC分类号： B24B53/017 , B24B53/14
摘要： The present invention relates to a conditioner device for polishing pad and a chemical mechanical polishing (CMP) apparatus having the same. The conditioner device of the present invention comprises a rotable support plate including a support plate surface comprising a center area located about the rotational axis of the support plate, a mid area surrounding the center area, and a peripheral area surrounding the mid area, a plurality of conditioning zones located within a portion of the mid area of the support plate surface. A plurality of hard particles which are densely arranged within the conditioning zones and are attached to the support plate surface. A plurality of passages defined by the conditioning zones within which a slurry flows, the passages occupying a portion of the mid area which is not occupied by the conditioning zones, the center area and the peripheral area.
摘要翻译：本发明涉及一种用于抛光垫的调节装置和具有该抛光垫的化学机械抛光（CMP）装置。本发明的调节装置包括可旋转的支撑板，其包括支撑板表面，该支撑板表面包括围绕支撑板的旋转轴线的中心区域，围绕中心区域的中间区域和围绕中间区域的周边区域，多个位于支撑板表面的中部区域的一部分内的调理区。多个坚硬颗粒密集地布置在调理区内并附着在支撑板表面上。由浆料流过的调节区限定的多个通道，通道占据中部区域的未被调节区域，中心区域和周边区域占据的部分。

6. 发明申请

US20070037486A1 Polishing pad, method of manufacturing the polishing pad, and chemical mechanical polishing apparatus comprising the polishing pad 审中-公开
标题翻译：研磨垫，抛光垫的制造方法以及包含该抛光垫的化学机械抛光装置
公开(公告)号：US20070037486A1
公开(公告)日：2007-02-15
申请号：US11500512
申请日：2006-08-08
申请人： Kyoung-Moon Kang , Bong-Su Ahn , Dong-Jun Lee , Nam-Soo Kim , Jae-Hyun So
发明人： Kyoung-Moon Kang , Bong-Su Ahn , Dong-Jun Lee , Nam-Soo Kim , Jae-Hyun So
IPC分类号： B24B51/00 , B24B7/30 , B24B29/00
CPC分类号： B24B37/26 , B24D7/14
摘要： A polishing pad of a CMP apparatus has a plurality of pores. A characteristic associated with the pores, such as average size or pore density, varies substantially from region to region of the pad across the pad in a diametral direction of the pad. The polishing pad can be designed and manufactured using sample pads whose pore characteristics differ from each other. CMP test processes are performed in which the sample pads are used to polish test wafers, and the rates at which the test wafers are polished are measured and stored in a database. The polishing pad is fabricated using data from the database so that a chemical mechanical polishing apparatus employing the pad will polish wafers with a high degree of uniformity. The database can be used to select sample pads from a stockpile. Sections of the sample pads are cut out, respectively, and fastened to one another.
摘要翻译： CMP设备的抛光垫具有多个孔。与孔相关的特征，例如平均尺寸或孔密度，在焊盘的沿直径方向穿过焊盘的区域与区域之间显着变化。可以使用其孔特性彼此不同的样品垫来设计和制造抛光垫。进行CMP测试过程，其中使用样品垫来抛光测试晶片，并测量抛光测试晶片的速率并将其存储在数据库中。使用来自数据库的数据制造抛光垫，使得使用该垫的化学机械抛光装置将以高度均匀度抛光晶片。数据库可用于从库存中选择样品垫。样品垫的切片分别切割并彼此紧固。

7. 发明授权

US07442111B2 Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting 失效
标题翻译：抛光垫，压板，监测方法，制造方法和检测方法
公开(公告)号：US07442111B2
公开(公告)日：2008-10-28
申请号：US11797713
申请日：2007-05-07
申请人： Young-Sam Lim , Dong-Jun Lee , Nam-Soo Kim , Sung-Taek Moon , Kyoung-Moon Kang , Jae-Hyun So
发明人： Young-Sam Lim , Dong-Jun Lee , Nam-Soo Kim , Sung-Taek Moon , Kyoung-Moon Kang , Jae-Hyun So
IPC分类号： B24B19/00
CPC分类号： B24B37/205 , B24B37/013
摘要： A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero.
摘要翻译：抛光垫，压板，监控方法，制造方法以及使用伪窗口区域进行检测的方法，其中伪窗口区域的厚度小于抛光层的厚度，厚度大于零。

8. 发明授权

US07229337B2 Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting 失效
标题翻译：抛光垫，压板，监测方法，制造方法和检测方法
公开(公告)号：US07229337B2
公开(公告)日：2007-06-12
申请号：US10726637
申请日：2003-12-04
申请人： Young-Sam Lim , Dong-Jun Lee , Nam-Soo Kim , Sung-Taek Moon , Kyoung-Moon Kang , Jae-Hyun So
发明人： Young-Sam Lim , Dong-Jun Lee , Nam-Soo Kim , Sung-Taek Moon , Kyoung-Moon Kang , Jae-Hyun So
IPC分类号： B24B19/00
CPC分类号： B24B37/205 , B24B37/013
摘要： A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero.
摘要翻译：抛光垫，压板，监控方法，制造方法以及使用伪窗口区域进行检测的方法，其中伪窗口区域的厚度小于抛光层的厚度，厚度大于零。

9. 发明授权

US07662022B2 Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting 失效
标题翻译：抛光垫，压板，监测方法，制造方法和检测方法
公开(公告)号：US07662022B2
公开(公告)日：2010-02-16
申请号：US12232521
申请日：2008-09-18
申请人： Young-Sam Lim , Dong-Jun Lee , Nam-Soo Kim , Sung-Taek Moon , Kyoung-Moon Kang , Jae-Hyun So
发明人： Young-Sam Lim , Dong-Jun Lee , Nam-Soo Kim , Sung-Taek Moon , Kyoung-Moon Kang , Jae-Hyun So
IPC分类号： B24B19/00
CPC分类号： B24B37/205 , B24B37/013
摘要： A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero.
摘要翻译：抛光垫，压板，监测方法，制造方法以及使用伪窗口区域进行检测的方法，其中伪窗口区域的厚度小于抛光层的厚度，厚度大于零。

10. 发明申请

US20070212980A1 Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting 失效
公开(公告)号：US20070212980A1
公开(公告)日：2007-09-13
申请号：US11797713
申请日：2007-05-07
申请人： Young-Sam Lim , Dong-Jun Lee , Nam-Soo Kim , Sung-Taek Moon , Kyoung-Moon Kang , Jae-Hyun So
发明人： Young-Sam Lim , Dong-Jun Lee , Nam-Soo Kim , Sung-Taek Moon , Kyoung-Moon Kang , Jae-Hyun So
IPC分类号： B24B49/00 , B24B7/30 , B24B29/00 , B24D11/00
CPC分类号： B24B37/205 , B24B37/013
摘要： A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero.

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