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    • 1. 发明授权
    • Semiconductor device having a recess channel transistor
    • 具有凹槽通道晶体管的半导体器件
    • US07615449B2
    • 2009-11-10
    • US11529420
    • 2006-09-29
    • Sung Woong ChungSang Don Lee
    • Sung Woong ChungSang Don Lee
    • H01L29/94H01L29/78
    • H01L29/66621H01L27/10876
    • The semiconductor device having a recess channel transistor includes a device isolation structure formed in a semiconductor substrate to define an active region having a recess region at a lower part of sidewalls thereof and a recess channel region formed in the semiconductor substrate under the active region. A method for fabricating the semiconductor device includes forming a device isolation structure in a semiconductor substrate to form an active region having a recess region at a lower part of sidewalls thereof, a gate insulating film formed over the semiconductor substrate including the recess channel region, and a gate electrode formed over the gate insulating film to fill up the recess channel region.
    • 具有凹陷沟道晶体管的半导体器件包括形成在半导体衬底中的器件隔离结构,以限定其侧壁下部具有凹陷区域的有源区域和在有源区域下形成在半导体衬底中的凹槽沟道区域。 一种制造半导体器件的方法包括:在半导体衬底中形成器件隔离结构,以形成在其侧壁的下部具有凹陷区域的有源区,形成在包括凹槽沟道区域的半导体衬底上的栅极绝缘膜,以及 形成在所述栅极绝缘膜上方以填充所述凹陷沟道区域的栅电极。
    • 2. 发明申请
    • Semiconductor device having a recess channel transistor
    • 具有凹槽通道晶体管的半导体器件
    • US20070252199A1
    • 2007-11-01
    • US11529420
    • 2006-09-29
    • Sung Woong ChungSang Don Lee
    • Sung Woong ChungSang Don Lee
    • H01L29/94
    • H01L29/66621H01L27/10876
    • The semiconductor device having a recess channel transistor includes a device isolation structure formed in a semiconductor substrate to define an active region having a recess region at a lower part of sidewalls thereof and a recess channel region formed in the semiconductor substrate under the active region. A method for fabricating the semiconductor device includes forming a device isolation structure in a semiconductor substrate to form an active region having a recess region at a lower part of sidewalls thereof, a gate insulating film formed over the semiconductor substrate including the recess channel region, and a gate electrode formed over the gate insulating film to fill up the recess channel region.
    • 具有凹陷沟道晶体管的半导体器件包括形成在半导体衬底中的器件隔离结构,以限定其侧壁下部具有凹陷区域的有源区域和在有源区域下形成在半导体衬底中的凹槽沟道区域。 一种制造半导体器件的方法包括:在半导体衬底中形成器件隔离结构,以形成在其侧壁的下部具有凹陷区域的有源区,形成在包括凹槽沟道区域的半导体衬底上的栅极绝缘膜,以及 形成在所述栅极绝缘膜上方以填充所述凹陷沟道区域的栅电极。
    • 3. 发明授权
    • Semiconductor device having a recess channel transistor
    • 具有凹槽通道晶体管的半导体器件
    • US07960761B2
    • 2011-06-14
    • US12615210
    • 2009-11-09
    • Sung Woong ChungSang Don Lee
    • Sung Woong ChungSang Don Lee
    • H01L29/78H01L29/94
    • H01L29/66621H01L27/10876
    • The semiconductor device having a recess channel transistor includes a device isolation structure formed in a semiconductor substrate to define an active region having a recess region at a lower part of sidewalls thereof and a recess channel region formed in the semiconductor substrate under the active region. A method for fabricating the semiconductor device includes forming a device isolation structure in a semiconductor substrate to form an active region having a recess region at a lower part of sidewalls thereof, a gate insulating film formed over the semiconductor substrate including the recess channel region, and a gate electrode formed over the gate insulating film to fill up the recess channel region.
    • 具有凹陷沟道晶体管的半导体器件包括形成在半导体衬底中的器件隔离结构,以限定其侧壁下部具有凹陷区域的有源区域和在有源区域下形成在半导体衬底中的凹槽沟道区域。 一种制造半导体器件的方法包括:在半导体衬底中形成器件隔离结构,以形成在其侧壁的下部具有凹陷区域的有源区,形成在包括凹槽沟道区域的半导体衬底上的栅极绝缘膜,以及 形成在所述栅极绝缘膜上方以填充所述凹陷沟道区域的栅电极。
    • 5. 发明授权
    • Semiconductor device with recess and fin structure
    • 具有凹槽和鳍结构的半导体器件
    • US08110871B2
    • 2012-02-07
    • US12323391
    • 2008-11-25
    • Sang Don LeeSung Woong Chung
    • Sang Don LeeSung Woong Chung
    • H01L29/78
    • H01L29/66795H01L21/823437H01L29/4236H01L29/66621H01L29/7851
    • The semiconductor device includes an active region, a recess, a Fin channel region, a gate insulating film, and a gate electrode. The active region is defined by a device isolation structure formed in a semiconductor substrate. The recess is formed by etching the active region and its neighboring device isolation structure using an island shaped recess gate mask as an etching mask. The Fin channel region is formed on the semiconductor substrate at a lower part of the recess. The gate insulating film is formed over the active region including the Fin channel region and the recess. The gate electrode is formed over the gate insulating film to fill up the Fin channel region and the recess.
    • 半导体器件包括有源区,凹槽,Fin沟道区,栅极绝缘膜和栅电极。 有源区由半导体衬底中形成的器件隔离结构限定。 通过使用岛状凹陷栅极掩模作为蚀刻掩模来蚀刻有源区及其邻近的器件隔离结构来形成凹部。 鳍状沟道区在凹部的下部形成在半导体衬底上。 栅极绝缘膜形成在包括鳍状沟道区域和凹部的有源区域上。 栅电极形成在栅极绝缘膜上,以填充鳍沟道区域和凹槽。