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1. 发明申请

US20140077366A1 Wafer Level Fan-Out Package With a Fiducial Die 有权
标题翻译：具有基准晶片的晶圆级扇出封装
公开(公告)号：US20140077366A1
公开(公告)日：2014-03-20
申请号：US13963384
申请日：2013-08-09
申请人： Sung Kyu Kim , Jin Young Kim , Yoon Joo Kim , Jin Han Kim , Seung Jae Lee , Se Woong Cha , Jae Hun Bae , Dong Jin Kim , Won Myoung Ki
发明人： Sung Kyu Kim , Jin Young Kim , Yoon Joo Kim , Jin Han Kim , Seung Jae Lee , Se Woong Cha , Jae Hun Bae , Dong Jin Kim , Won Myoung Ki
IPC分类号： H01L23/498 , H01L23/48 , H01L21/56
CPC分类号： H01L23/49811 , H01L21/486 , H01L21/56 , H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/48 , H01L23/481 , H01L23/498 , H01L23/49816 , H01L23/49827 , H01L23/5389 , H01L23/544 , H01L24/19 , H01L24/96 , H01L2223/54426 , H01L2223/54486 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/00
摘要： A wafer level fan-out package with a fiducial die is disclosed and may include a semiconductor die and a transparent fiducial die both encapsulated in a molding compound resin, passivation layers on an upper surface and a lower surface of the molding compound resin except where redistribution layers are formed on upper and lower surfaces of the molding compound resin, and a metal pattern on a lower surface of the transparent fiducial die that is visible through an exposed upper surface of the transparent fiducial die. The pattern may comprise a standard coordinate for forming a through mold via utilizing laser drilling.
摘要翻译：公开了具有基准晶片的晶片级扇出封装，并且可以包括半导体管芯和透明基准管芯，两者均封装在模制复合树脂中，模制复合树脂的上表面和下表面上的钝化层，除了重新分布在模制复合树脂的上表面和下表面上形成层，并且在通过透明基准裸片的暴露的上表面可见的透明基准模具的下表面上的金属图案。图案可以包括通过利用激光钻孔形成贯穿模的标准坐标。

2. 发明申请

US20140042600A1 Semiconductor Package and Manufacturing Method Thereof 有权
标题翻译：半导体封装及制造方法
公开(公告)号：US20140042600A1
公开(公告)日：2014-02-13
申请号：US13962735
申请日：2013-08-08
申请人： Jin Young Kim , No Sun Park , Yoon Joo Kim , Choon Heung Lee , Jin Han Kim , Seung Jae Lee , Se Woong Cha , Sung Kyu Kim , Glenn Rinne
发明人： Jin Young Kim , No Sun Park , Yoon Joo Kim , Choon Heung Lee , Jin Han Kim , Seung Jae Lee , Se Woong Cha , Sung Kyu Kim , Glenn Rinne
IPC分类号： H01L23/00
CPC分类号： H01L25/0657 , H01L23/00 , H01L23/293 , H01L23/3135 , H01L23/3171 , H01L24/09 , H01L24/19 , H01L24/73 , H01L24/81 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73209 , H01L2224/73267 , H01L2924/1461 , H01L2924/18162 , H01L2924/19107 , H01L2924/00
摘要： A semiconductor package and manufacturing method thereof are disclosed and may include a first semiconductor device comprising a first bond pad on a first surface of the first semiconductor device, a first encapsulant material surrounding side edges of the first semiconductor device, and a redistribution layer (RDL) formed on the first surface of the first semiconductor device and on a first surface of the encapsulant material. The RDL may electrically couple the first bond pad to a second bond pad formed above the first surface of the encapsulant material. A second semiconductor device comprising a third bond pad on a first surface of the second semiconductor device may face the first surface of the first semiconductor device and be electrically coupled to the first bond pad on the first semiconductor device. The first surface of the first semiconductor device may be coplanar with the first surface of the encapsulant material.
摘要翻译：公开了半导体封装及其制造方法，并且可以包括第一半导体器件，其包括在第一半导体器件的第一表面上的第一接合焊盘，围绕第一半导体器件的侧边缘的第一密封材料和再分配层（RDL ）形成在第一半导体器件的第一表面上并且在密封剂材料的第一表面上。 RDL可以将第一接合焊盘电耦合到形成在密封剂材料的第一表面上方的第二接合焊盘。包括在第二半导体器件的第一表面上的第三接合焊盘的第二半导体器件可面向第一半导体器件的第一表面并且电耦合到第一半导体器件上的第一接合焊盘。第一半导体器件的第一表面可以与密封剂材料的第一表面共面。

3. 发明申请

US20130276663A1 GAS GENERATOR 审中-公开
标题翻译：气体发电机
公开(公告)号：US20130276663A1
公开(公告)日：2013-10-24
申请号：US13978474
申请日：2012-01-06
申请人： Satoshi Ohsugi , Hirotaka Mukunoki , Yusuke Tanaka , Jin Han Kim
发明人： Satoshi Ohsugi , Hirotaka Mukunoki , Yusuke Tanaka , Jin Han Kim
IPC分类号： C06D5/00
CPC分类号： C06D5/00 , B60R21/2644 , B60R2021/2648
摘要： A gas generator (1A) includes a lower shell (10), an upper shell (20), a holding portion (30), an igniter (40), an enhancer cup (46), and a filter (70). The lower shell (10) is made of a press-formed product formed by press-working one plate-shaped member made of metal, and includes a protruding cylindrical portion (13) and an opening (15) provided in the protruding cylindrical portion (13). The holding portion (13) is made of a resin-molded portion formed by attaching an insulating fluid resin material to a bottom plate portion (11) so as to reach a part of an outer surface from a part of an inner surface of the bottom plate portion (11) of the lower shell (10) through the opening (15) and solidifying the same. The enhancer cup (46) is held by the holding portion (30) as an locking protruding portion (46a) provided in the enhancer cup (46) is locked to a locking recess portion (36a) provided in the holding portion (30).
摘要翻译：气体发生器（1A）包括下壳体（10），上壳体（20），保持部分（30），点火器（40），增强器杯（46）和过滤器（70）。下壳体（10）由压制成型的一个由金属制成的板状构件形成的压制成形品构成，并且包括突出的圆柱形部分（13）和设置在突出的圆柱形部分中的开口（15） 13）。保持部（13）由将绝缘性流体树脂材料附着到底板部（11）而形成的树脂模制部形成，以从底部的内表面的一部分到达外表面的一部分通过开口（15）将下壳体（10）的板部分（11）固化并固化。增强杯（46）由保持部（30）保持，因为设置在增强杯（46）中的锁定突出部（46a）被锁定在设置在保持部（30）中的锁定凹部（36a）。

4. 发明授权

US07528001B2 Method of manufacturing a CMOS image sensor 失效
标题翻译： CMOS图像传感器的制造方法
公开(公告)号：US07528001B2
公开(公告)日：2009-05-05
申请号：US11615730
申请日：2006-12-22
申请人： Jin Han Kim
发明人： Jin Han Kim
IPC分类号： H01L12/00
CPC分类号： H01L27/14687 , H01L27/14621 , H01L27/14627 , H01L27/14632 , H01L27/14636 , H01L27/14685
摘要： A complementary metal oxide silicon (CMOS) image sensor includes a pad protection layer having a dual-layer structure including a plasma enhanced-tetra ethyl ortho silicate (PE-TEOS) layer as a lower layer and a thermo-setting resin layer as an upper layer. The thermo-setting resin layer is removed before a micro-lens process and after a planarization process. The plasma enhanced-tetra ethyl ortho silicate (PE-TEOS) layer is removed after the planarization process and the micro-lens process.
摘要翻译：互补金属氧化物硅（CMOS）图像传感器包括具有双层结构的焊盘保护层，其包括作为下层的等离子体增强四乙基原硅酸盐（PE-TEOS）层和作为上层的热固性树脂层层。在微透镜处理之前和平坦化处理之后，去除热固性树脂层。在平坦化处理和微透镜工艺之后，除去等离子体增强四乙基原硅酸盐（PE-TEOS）层。

5. 发明申请

US20120066387A1 METHOD, APPARATUS AND SYSTEM FOR PROVIDING CONTENTS TO MULTIPLE DEVICES 有权
标题翻译：用于向多个设备提供内容的方法，装置和系统
公开(公告)号：US20120066387A1
公开(公告)日：2012-03-15
申请号：US13228948
申请日：2011-09-09
申请人： Hoon Kyu Park , Jin Han Kim , Young Min Chin
发明人： Hoon Kyu Park , Jin Han Kim , Young Min Chin
IPC分类号： G06F15/173
CPC分类号： H04N21/25825 , H04L63/08 , H04L63/102 , H04N21/433 , H04N21/6125 , H04N21/6131
摘要： In some examples, a contents providing apparatus that provides contents to multiple devices may include a user information management unit, a contents management unit, a contents usage information management unit, and a contents usage information searching unit.
摘要翻译：在一些示例中，向多个设备提供内容的内容提供设备可以包括用户信息管理单元，内容管理单元，内容使用信息管理单元和内容使用信息搜索单元。

6. 发明申请

US20070161143A1 METHOD OF MANUFACTURING A COMPLEMENTARY METAL OXIDE SILICON IMAGE SENSOR 失效
标题翻译：制造补充金属氧化硅图像传感器的方法
公开(公告)号：US20070161143A1
公开(公告)日：2007-07-12
申请号：US11615763
申请日：2006-12-22
申请人： Jin Han Kim
发明人： Jin Han Kim
IPC分类号： H01L21/00
CPC分类号： H01L27/14698
摘要： A method for manufacturing a CMOS image sensor increases the performance of the CMOS image sensor by reducing a peeling phenomenon near a wafer edge and a preventing a circle defect in a pixel region. The method reduces defects in the external appearance of the pad. In order to accomplish the object, there is provided a method for manufacturing a CMOS image sensor, the method including depositing an oxide layer and a nitride layer after forming a pad on a substrate. The pad is exposed and cleaned by etching the oxide layer and the nitride layer. A portion of the oxide layer and the nitride layer over the edge region of the substrate may be etched and removed. A first ashing process, a solvent cleaning process, and a second ashing process may be performed. A pad protection layer is deposited. A hydrogen anneal process is performed. A micro-lens process, a planarization process, and a color filter array process are performed. The pad protection layer over a pad area is removed.
摘要翻译： CMOS图像传感器的制造方法通过减少晶片边缘附近的剥离现象和防止像素区域中的圆缺陷来提高CMOS图像传感器的性能。该方法减少了焊盘外观的缺陷。为了实现该目的，提供了一种用于制造CMOS图像传感器的方法，该方法包括在衬底上形成焊盘之后沉积氧化物层和氮化物层。通过蚀刻氧化物层和氮化物层来暴露和清洁焊盘。氧化物层和衬底的边缘区域上的氮化物层的一部分可被蚀刻和去除。可以执行第一灰化过程，溶剂清洁处理和第二灰化处理。衬垫保护层被沉积。进行氢退火处理。执行微透镜处理，平坦化处理和滤色器阵列处理。去除焊盘区域上的焊盘保护层。

7. 发明授权

US07091594B1 Leadframe type semiconductor package having reduced inductance and its manufacturing method 有权
标题翻译：具有降低的电感的引线框式半导体封装及其制造方法
公开(公告)号：US07091594B1
公开(公告)日：2006-08-15
申请号：US10766046
申请日：2004-01-28
申请人： Gi Jeong Kim , Jin Han Kim , Jin Seok Oh
发明人： Gi Jeong Kim , Jin Han Kim , Jin Seok Oh
IPC分类号： H01L23/22
CPC分类号： H01L23/4334 , H01L23/49541 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/4911 , H01L2224/73265 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor die comprising a heat sink having opposed top and bottom surfaces and defining a peripheral edge. Attached to the top surface of the heat sink is a semiconductor die. Extending at least partially about the semiconductor die is a plurality of leads, at least some of which are electrically connected to the semiconductor die. Attached to the top surface of the heat sink between the semiconductor die and the peripheral edge thereof is at least one first ground lead. Also attached to the top surface of the heat sink and protruding beyond the peripheral edge thereof is at least one second ground lead. A plurality of ground wires conductively connect the semiconductor die, the first and second ground leads and the heat sink to each other. A package body at least partially encapsulates the heat sink, the semiconductor die, the leads, the first and second ground leads, and the ground wires such that at least portions of the second ground leads and the leads protrude from the package body.
摘要翻译：一种半导体管芯，包括具有相对的顶表面和底表面并限定外围边缘的散热器。连接到散热器的顶表面是半导体管芯。至少部分地围绕半导体管芯延伸的是多个引线，其中至少一些引线电连接到半导体管芯。连接到半导体管芯和其周边边缘之间的散热器的顶表面是至少一个第一接地引线。还附接到散热器的顶表面并突出超过其周边的至少一个第二接地引线。多个接地线将半导体管芯，第一和第二接地引线和散热器彼此导电连接。封装体至少部分地封装散热器，半导体管芯，引线，第一和第二接地引线以及接地线，使得第二接地引线和引线的至少一部分从封装主体突出。

8. 发明申请

US20130276664A1 GAS GENERATOR 审中-公开
标题翻译：气体发电机
公开(公告)号：US20130276664A1
公开(公告)日：2013-10-24
申请号：US13978483
申请日：2012-01-06
申请人： Satoshi Ohsugi , Yusuke Tanaka , Hirotaka Mukunoki , Jin Han Kim
发明人： Satoshi Ohsugi , Yusuke Tanaka , Hirotaka Mukunoki , Jin Han Kim
IPC分类号： C06D5/00
CPC分类号： C06D5/00 , B60R21/2644 , B60R2021/26029 , B60R2021/26076
摘要： A gas generator includes a lower shell, an upper shell, a holding portion, an igniter, and a filter. The lower shell is made of a press-formed product formed by press-working one plate-shaped member made of metal, and includes a protruding cylindrical portion and an opening provided in the protruding cylindrical portion. The holding portion is formed from a resin-molded portion formed by attaching an insulating fluid resin material to a bottom plate portion so as to reach a part of an outer surface from a part of an inner surface of the bottom plate portion of the lower shell through the opening and solidifying the same, and includes an accommodation recess portion in a portion opposed to a top plate portion. The igniter is held by the holding portion while it is inserted in the accommodation recess portion from a side of the top plate portion and fitted therein.
摘要翻译：气体发生器包括下壳体，上壳体，保持部分，点火器和过滤器。下壳体是由压制加工的一个由金属制成的板状构件形成的压制成型制品，并且包括突出的圆筒形部分和设置在突出圆柱形部分中的开口。保持部由树脂模制部形成，该树脂模制部分通过将绝缘流体树脂材料附着到底板部分，以便从下壳体的底板部分的内表面的一部分到达外表面的一部分通过开口固化，并且在与顶板部相对的部分中包括容纳凹部。点火器由保持部保持，同时从顶板部分的一侧插入到容纳凹部中并嵌入其中。

9. 发明授权

US09306984B2 Method and server for continuously providing contents for mobile user devices based on locations thereof 有权
标题翻译：基于其位置为移动用户设备连续提供内容的方法和服务器
公开(公告)号：US09306984B2
公开(公告)日：2016-04-05
申请号：US13225065
申请日：2011-09-02
申请人： Jung Ho Choi , Jin Han Kim , Young Min Chin
发明人： Jung Ho Choi , Jin Han Kim , Young Min Chin
IPC分类号： G06F15/16 , H04L29/06
CPC分类号： H04L65/1083 , H04L65/80
摘要： Provided are a continuous contents reproduction service providing server, a user device, and a method of providing a continuous contents reproduction service for continuously providing contents to a plurality of devices. The server may include: a device management unit to store identification information of a first device and a second device; a service interruption monitoring unit to determine whether reproducing of contents in the first device is interrupted; a continuous reproduction information message transceiving unit to generate a continuous reproduction information message when the reproducing of the contents is interrupted, and to transmit the generated continuous reproduction information message to the second device; a continuous reproduction management unit to receive a request for a continuous reproduction service and to determine whether to continuously provide the contents to the second device; and a contents providing unit to provide the contents to the second device based on the determination.
摘要翻译：提供了一种连续的内容再现服务提供服务器，用户设备和提供连续内容再现服务的方法，用于连续向多个设备提供内容。服务器可以包括：设备管理单元，用于存储第一设备和第二设备的标识信息; 服务中断监视单元，确定第一设备中的内容的再现是否中断; 连续再现信息消息收发单元，用于当内容的再现中断时产生连续的再现信息消息，并将所生成的连续再现信息消息发送到第二设备; 连续再现管理单元，用于接收对连续再现服务的请求，并确定是否连续向第二设备提供内容; 以及内容提供单元，用于基于该确定向第二设备提供内容。

10. 发明授权

US07611921B2 Method for manufacturing CMOS image sensor which improves sensitivity by removing a passivation membrane in a pixel region of the CMOS image sensor 失效
标题翻译：用于制造CMOS图像传感器的方法，其通过去除CMOS图像传感器的像素区域中的钝化膜来提高灵敏度
公开(公告)号：US07611921B2
公开(公告)日：2009-11-03
申请号：US11644221
申请日：2006-12-21
申请人： Jin Han Kim
发明人： Jin Han Kim
IPC分类号： H01L21/00
CPC分类号： H01L27/14698 , H01L27/14621 , H01L27/14627 , H01L27/14643 , H01L27/14685 , H01L27/14687
摘要： A method for manufacturing a CMOS image sensor is disclosed. The method includes the steps of: forming a passivation oxide and a passivation nitride after forming a pad; performing a hydrogen anneal; selectively removing the passivation nitride and cleaning the passivation oxide; opening and cleaning the pad by removing the passivation oxide from the pad region; forming a pad protection membrane; forming color filter array, planarization layer and a plurality of microlenses; and removing the pad protection membrane from the pad region. A circle defect in a pixel region may be removed according to the disclosed method for manufacturing the CMOS image sensor. Accordingly, the sensitivity of the CMOS image sensor may be increased by raising the quality of the CMOS image sensor and reducing reflectance of the light.
摘要翻译：公开了一种用于制造CMOS图像传感器的方法。该方法包括以下步骤：在形成焊盘之后形成钝化氧化物和钝化氮化物; 进行氢退火; 选择性地去除钝化氮化物并清洁钝化氧化物; 通过从焊盘区域去除钝化氧化物来打开和清洁焊盘; 形成垫保护膜; 形成滤色器阵列，平坦化层和多个微透镜; 以及从所述垫区域移除所述垫保护膜。根据所公开的用于制造CMOS图像传感器的方法，可以去除像素区域中的圆形缺陷。因此，通过提高CMOS图像传感器的质量并降低光的反射率，可以提高CMOS图像传感器的灵敏度。

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