会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明申请
    • Method and system for processing sensor data in context-aware system
    • 在上下文感知系统中处理传感器数据的方法和系统
    • US20070136740A1
    • 2007-06-14
    • US11592356
    • 2006-11-03
    • Kang LeeHan NamgoongNam ParkTae Kang
    • Kang LeeHan NamgoongNam ParkTae Kang
    • H04H9/00H04N7/16
    • H04H60/45A63F2300/1062A63F2300/69G06F9/542H04H60/65
    • A method and system for processing sensor data in a context-aware system is provided. The system includes: a sensor service collecting the sensor data from a driver of a physical sensor and generating a low level event; an STHQ temporarily storing the generated event and an event generated previously by an event interceptor; and a sensor framework comprised of the event interceptor forming an EIC (event interpretation chain) which interprets the generated event and the event stored in the STHQ and generated previously in connection with each other, and generating or deleting an event or processing the generated event as an event necessary for an upper level application service through an interlocking with the STHQ. The present invention provides active services on the basis of context knowledge inputted from various sensors.
    • 提供了一种在上下文感知系统中处理传感器数据的方法和系统。 该系统包括:传感器服务,从物理传感器的驱动器收集传感器数据并产生低电平事件; STHQ临时存储生成的事件和事件拦截器先前生成的事件; 以及由事件拦截器组成的传感器框架,该事件拦截器形成解释所生成的事件的EIC(事件解释链)和事先存储在STHQ中并且先前相互连接生成的事件,以及生成或删除事件或将生成的事件处理为 通过与STHQ互锁,上级应用服务所需的事件。 本发明基于从各种传感器输入的上下文知识提供主动服务。
    • 4. 发明申请
    • Pad redistribution chip for compactness, method of manufacturing the same, and stacked package using the same
    • 垫片再分配芯片的紧凑性,制造方法和使用其的堆叠封装
    • US20070102800A1
    • 2007-05-10
    • US11322901
    • 2005-12-30
    • Tae Kang
    • Tae Kang
    • H01L23/02
    • H01L25/0657H01L2224/32145H01L2224/48091H01L2225/06513H01L2225/06551H01L2225/06575H01L2225/06579H01L2924/01078H01L2924/00014
    • A substrate includes a substrate; a number of pad redistribution chips stacked on the substrate and on one another after being rotated 90° in a predetermined direction relative to one another, the pad redistribution chips having a number of center pads positioned at the center thereof, a number of (+) edge pads positioned on an end thereof while corresponding to those of the center pads lying in (+) direction from a middle center pad located in the middle of the center pads, a number of (−) edge pads positioned on the other end thereof while corresponding to those of the center pads lying in (−) direction with symmetry to those of the center pads lying in the (+) direction, and a number of traces for electrically connecting the center pads to the corresponding (±) edge pads, respectively; a flexible PCB for electrically connecting the substrate to the pad redistribution chips; and an anisotropic dielectric film for electrically connecting the pad redistribution chips to the flexible PCB and the substrate to the flexible PCB.
    • 基板包括基板; 多个衬垫再分布芯片,在相对于彼此沿预定方向旋转90°之后堆叠在衬底上并且彼此相对,衬垫再分配芯片具有位于其中心的多个中心衬垫,多个(+) 边缘焊盘位于其一端,同时对应于位于中心焊盘中间的中间焊盘位于(+)方向的中心焊盘的边缘焊盘,位于其另一端的多个( - )边焊盘,同时 对应于位于( - )方向的中心焊盘的中心焊盘的对应于位于(+)方向的中心焊盘的中心焊盘,以及用于将中心焊盘电连接到相应的(±)边缘焊盘的数量的迹线 ; 用于将衬底电连接到衬垫再分配芯片的柔性PCB; 以及用于将焊盘再分布芯片电连接到柔性PCB和基板到柔性PCB的各向异性绝缘膜。