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    • 4. 发明申请
    • Trench isolation method in flash memory device
    • 闪存设备中的沟槽隔离方法
    • US20050142745A1
    • 2005-06-30
    • US11019302
    • 2004-12-23
    • Sung JungJum Kim
    • Sung JungJum Kim
    • H01L21/76H01L21/762H01L21/8247H01L27/115H01L21/336
    • H01L27/11521H01L21/76224H01L27/115
    • The present invention provides a trench isolation method in a flash memory device, by which stability and reliability of the device are enhanced in a manner of forming a pad oxide layer thick in the vicinity of an edge of a trench isolation layer. The present invention includes forming a mask layer pattern on a semiconductor substrate to expose a device isolation area but to cover an active area thereof, the mask layer pattern comprising a first insulating layer pattern and a second insulating layer pattern stacked thereon, forming a trench in the semiconductor substrate corresponding to the device isolation area, removing an exposed portion of the first insulating layer pattern enough to expose a portion of the semiconductor substrate in the active area adjacent to the trench, forming a sidewall oxide layer on an inside of the trench and the exposed portion of the semiconductor substrate, filling up the trench with a third insulating layer to cover the sidewall oxide layer, and removing the mask layer pattern.
    • 本发明提供了一种闪速存储器件中的沟槽隔离方法,通过这种方法,在沟槽隔离层的边缘附近形成厚的衬垫氧化物层,增强了器件的稳定性和可靠性。 本发明包括在半导体衬底上形成掩模层图案以暴露器件隔离区域而覆盖其有效区域,掩模层图案包括第一绝缘层图案和叠置在其上的第二绝缘层图案,形成沟槽 所述半导体衬底对应于所述器件隔离区域,去除所述第一绝缘层图案的暴露部分以足以暴露所述半导体衬底在与所述沟槽相邻的有源区域中的一部分,在所述沟槽的内部形成侧壁氧化物层,以及 半导体衬底的暴露部分,用第三绝缘层填充沟槽以覆盖侧壁氧化物层,以及去除掩模层图案。
    • 5. 发明申请
    • High voltage semiconductor device and fabricating method thereof
    • 高压半导体器件及其制造方法
    • US20050139916A1
    • 2005-06-30
    • US11020276
    • 2004-12-27
    • Jum KimSung Jung
    • Jum KimSung Jung
    • H01L29/78H01L29/417H01L29/76H01L29/94H01L31/062H01L31/113
    • H01L29/41775
    • A high voltage semiconductor device and fabricating method thereof, enable a high breakdown voltage to be provided from a surface area without forming a dual spacer layer. The semiconductor device includes a semiconductor substrate having source/drain regions separated from each other by a channel region in-between, a gate insulating layer pattern on the channel region, a gate conductor layer pattern on the gate insulating layer, a sidewall insulating layer provided on a sidewall of the gate conductor layer pattern, a salicide suppress layer pattern covering partial, but not entire, surfaces of the source/drain regions, and covering the sidewall insulating layer, and the gate conductor layer pattern, and a metal salicide layer on remaining portions surfaces of the source/drain regions that are not covered with the salicide suppress layer pattern.
    • 高压半导体器件及其制造方法能够从表面区域提供高的击穿电压而不形成双间隔层。 半导体器件包括具有源极/漏极区域的半导体衬底,沟道区域之间的沟道区域彼此分离,沟道区域上的栅极绝缘层图案,栅极绝缘层上的栅极导体层图案,提供的侧壁绝缘层 在栅极导体层图案的侧壁上,覆盖源极/漏极区域的部分但不是整个表面并且覆盖侧壁绝缘层和栅极导体层图案以及金属硅化物层的自对准硅化物抑制层图案 未被自对准硅化物抑制层图案覆盖的源/漏区的剩余部分表面。
    • 9. 发明申请
    • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A PRE-METAL DIELECTRIC LINER
    • 制造具有预金属电介质衬底的半导体器件的方法
    • US20070148959A1
    • 2007-06-28
    • US11616808
    • 2006-12-27
    • Sung Jung
    • Sung Jung
    • H01L21/31H01L21/469H01L21/4763
    • H01L21/76832
    • Embodiments relate to a semiconductor device and a method of manufacturing a semiconductor device having a pre-metal dielectric liner. In embodiments, method for forming a semiconductor device may include forming a pre-metal dielectric liner, which has a multi-layer structure including a plurality of interfacial surfaces, on an entire surface of a semiconductor substrate formed with a transistor, and forming a boron phospho silicate glass (BPSG) oxide layer on the pre-metal dielectric liner. Since the pre-metal dielectric liner is formed in a multi-layer structure having a plurality of interfacial surfaces, boron (B) of an upper BPSG oxide layer is not penetrated into the semiconductor substrate.
    • 实施例涉及半导体器件和制造具有预金属电介质衬垫的半导体器件的方法。 在实施例中,用于形成半导体器件的方法可以包括在形成有晶体管的半导体衬底的整个表面上形成具有包括多个界面的多层结构的预金属电介质衬垫,并形成硼 磷酸硅玻璃(BPSG)氧化物层在预金属电介质衬垫上。 由于预金属电介质衬垫形成为具有多个界面的多层结构,因此上部BPSG氧化物层的硼(B)不会渗透到半导体衬底中。