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1. 发明授权

US08702365B2 Substrate processing apparatus and method for transferring substrate for the apparatus 有权
标题翻译：用于转移该装置的基板的基板处理装置和方法
公开(公告)号：US08702365B2
公开(公告)日：2014-04-22
申请号：US12544552
申请日：2009-08-20
申请人： Sun Yong Park , Choon Sik Kim , Jeong Yong Bae
发明人： Sun Yong Park , Choon Sik Kim , Jeong Yong Bae
IPC分类号： H01L21/677
CPC分类号： H01L21/67769 , H01L21/67775
摘要： A substrate processing apparatus includes a main load unit, a buffer load unit, and a transfer unit. Containers each accommodating substrates are placed on the main load unit and the buffer load unit. The buffer load unit is disposed above the main load unit and movable into and outward from a process module. Therefore, more containers can be placed in the substrate processing apparatus without increasing the footprint of the substrate processing apparatus, and thus it is possible to reduce equipment idle time during which standby substrates wait before being processed, thereby improving productivity.
摘要翻译：衬底处理装置包括主负载单元，缓冲器负载单元和转移单元。容纳各容纳基板的容器被放置在主负载单元和缓冲装载单元上。缓冲装载单元设置在主负载单元上方，并可从处理模块移入和移出。因此，可以在基板处理装置中放置更多的容器，而不会增加基板处理装置的占地面积，从而可以减少备用基板在处理之前等待的设备空闲时间，从而提高生产率。

2. 发明申请

US20100047045A1 SUBSTRATE PROCESSING APPARATUS AND METHOD FOR TRANSFERRING SUBSTRATE FOR THE APPARATUS 有权
标题翻译：基板处理装置和用于传送装置的基板的方法
公开(公告)号：US20100047045A1
公开(公告)日：2010-02-25
申请号：US12544552
申请日：2009-08-20
申请人： Sun Yong Park , Choon Sik Kim , Jeong Yong Bae
发明人： Sun Yong Park , Choon Sik Kim , Jeong Yong Bae
IPC分类号： H01L21/677
CPC分类号： H01L21/67769 , H01L21/67775
摘要： A substrate processing apparatus includes a main load unit, a buffer load unit, and a transfer unit. Containers each accommodating substrates are placed on the main load unit and the buffer load unit. The buffer load unit is disposed above the main load unit and movable into and outward from a process module. Therefore, more containers can be placed in the substrate processing apparatus without increasing the footprint of the substrate processing apparatus, and thus it is possible to reduce equipment idle time during which standby substrates wait before being processed, thereby improving productivity.
摘要翻译：衬底处理装置包括主负载单元，缓冲器负载单元和转移单元。容纳各容纳基板的容器被放置在主负载单元和缓冲装载单元上。缓冲装载单元设置在主负载单元上方，并可从处理模块移入和移出。因此，可以在基板处理装置中放置更多的容器，而不会增加基板处理装置的占地面积，从而可以减少备用基板在处理之前等待的设备空闲时间，从而提高生产率。

3. 发明授权

US08714169B2 Spin head, apparatus for treating substrate, and method for treating substrate 有权
标题翻译：旋转头，处理基板的设备，以及处理基板的方法
公开(公告)号：US08714169B2
公开(公告)日：2014-05-06
申请号：US12623582
申请日：2009-11-23
申请人： Taek Youb Lee , Jeong Yong Bae , Choon Sik Kim
发明人： Taek Youb Lee , Jeong Yong Bae , Choon Sik Kim
IPC分类号： B08B3/00
CPC分类号： H01L21/68728 , H01L21/67051 , H01L21/68785
摘要： Provided is a spin head supporting a substrate and rotating the substrate. The spin head includes a body, chuck pins installed on the body and moving between supporting positions where a substrate is supported and waiting positions providing space for loading/unloading of the substrate, and a chuck pin moving unit configured to move the chuck pins. The chuck pin moving unit includes a rotation rod coupled with each of the chuck pins, a pivot pin fixing the rotation rod to the body, and a driving member rotating the rotation rod about the pivot pin as a rotation shaft to move the chuck pin from the supporting position to the waiting position. When the body rotates, the rotation rod uses reverse centrifugal force to apply force to the chuck pin from the waiting position to the supporting position. The chuck pins include first pins and second pins that alternately chuck a substrate during a process.
摘要翻译：提供了支撑衬底并旋转衬底的旋转头。旋转头包括主体，安装在主体上的卡盘销，并且在支撑基板的支撑位置和在提供用于装载/卸载基板的空间的等待位置之间移动的卡盘销以及配置成移动卡盘销的卡盘销移动单元。卡盘销移动单元包括与每个卡盘销连接的旋转杆，将旋转杆固定到主体上的枢轴销和驱动构件，该旋转杆将旋转杆围绕枢转销旋转，以将卡盘销从支持位置到等待位置。当主体旋转时，旋转杆使用反向离心力将卡盘销从等待位置向支撑位置施加力。卡盘销包括在过程中交替地卡住基板的第一销和第二销。

4. 发明授权

US08540854B2 Apparatus and method for plating substrate 有权
标题翻译：电镀基板的设备及方法
公开(公告)号：US08540854B2
公开(公告)日：2013-09-24
申请号：US12656683
申请日：2010-02-12
申请人： Yijung Kim , Eun Su Rho , Jeong Yong Bae
发明人： Yijung Kim , Eun Su Rho , Jeong Yong Bae
IPC分类号： C25D5/08 , C25D7/12 , C25D11/32
CPC分类号： C25D7/12 , C25D17/001 , H01L21/2885 , H01L21/76877
摘要： Provided are a substrate plating apparatus and a substrate plating method. In the substrate plating apparatus, a substrate support member supports a substrate to allow a plating surface to look up. A plating solution containing positive ions dissolved from a positive electrode is supplied from a plating solution supply member onto the substrate at an upper side of the substrate support member. A plating bath surrounds the substrate support member. The substrate support member is rotated in a state where it is immersed into the plating solution and an additive. The substrate can be supported by the substrate support member without reversing the substrate. Also, a pattern defect due to bubbles generated during a plating process can be prevented.
摘要翻译：提供了基板电镀装置和基板电镀方法。在基板电镀装置中，基板支撑部件支撑基板以允许电镀表面查找。从正极溶解的含有正离子的电镀溶液从电镀溶液供给部件在基板支撑部件的上侧供给到基板上。电镀浴围绕衬底支撑构件。衬底支撑构件在浸入电镀溶液和添加剂的状态下旋转。衬底可以由衬底支撑构件支撑，而不会反转衬底。此外，可以防止由于在电镀工艺期间产生的气泡引起的图案缺陷。

5. 发明申请

US20100200397A1 Apparatus and method for plating substrate 有权
标题翻译：电镀基板的设备及方法
公开(公告)号：US20100200397A1
公开(公告)日：2010-08-12
申请号：US12656683
申请日：2010-02-12
申请人： Yijung Kim , Eun Su Rho , Jeong Yong Bae
发明人： Yijung Kim , Eun Su Rho , Jeong Yong Bae
IPC分类号： C25B9/08 , C25B9/06
CPC分类号： C25D7/12 , C25D17/001 , H01L21/2885 , H01L21/76877
摘要： Provided are a substrate plating apparatus and a substrate plating method. In the substrate plating apparatus, a substrate support member supports a substrate to allow a plating surface to look up. A plating solution containing positive ions dissolved from a positive electrode is supplied from a plating solution supply member onto the substrate at an upper side of the substrate support member. A plating bath surrounds the substrate support member. The substrate support member is rotated in a state where it is immersed into the plating solution and an additive. The substrate can be supported by the substrate support member without reversing the substrate. Also, a pattern defect due to bubbles generated during a plating process can be prevented.
摘要翻译：提供了基板电镀装置和基板电镀方法。在基板电镀装置中，基板支撑部件支撑基板以允许电镀表面查找。从正极溶解的含有正离子的电镀溶液从电镀溶液供给部件在基板支撑部件的上侧供给到基板上。电镀浴围绕衬底支撑构件。衬底支撑构件在浸入电镀溶液和添加剂的状态下旋转。衬底可以由衬底支撑构件支撑，而不会反转衬底。此外，可以防止由于在电镀工艺期间产生的气泡引起的图案缺陷。

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