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    • 4. 发明申请
    • NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 氮化物半导体发光器件及其制造方法
    • US20120129289A1
    • 2012-05-24
    • US13365056
    • 2012-02-02
    • Jeong Tak OHYong Chun Kim
    • Jeong Tak OHYong Chun Kim
    • H01L33/02
    • H01L21/0254H01L21/0237H01L21/02458H01L21/02494H01L21/02587H01L33/007H01L33/06H01L33/20H01L33/24
    • A nitride semiconductor light emitting device, and a method of manufacturing the same are disclosed. The nitride semiconductor light emitting device includes a substrate, an n-type nitride semiconductor layer disposed on the substrate and including a plurality of V-shaped pits in a top surface thereof, an active layer disposed on the n-type nitride semiconductor layer and including depressions conforming to the shape of the plurality of V-shaped pits, and a p-type nitride semiconductor layer disposed on the active layer and including a plurality of protrusions on a top surface thereof. Since the plurality of V-shaped pits are formed in the top surface of the n-type nitride semiconductor layer, the protrusions can be formed on the p-type nitride semiconductor layer as an in-situ process. Accordingly, the resistance to ESD, and light extraction efficiency are enhanced.
    • 公开了一种氮化物半导体发光器件及其制造方法。 氮化物半导体发光器件包括衬底,设置在衬底上的n型氮化物半导体层,在其顶表面中包括多个V形凹坑,设置在n型氮化物半导体层上的有源层,并且包括 符合多个V形凹坑的形状的凹陷以及设置在活性层上的p型氮化物半导体层,并且在其顶表面上包括多个突起。 由于在n型氮化物半导体层的顶表面上形成多个V形凹坑,所以可以作为原位工艺在p型氮化物半导体层上形成突起。 因此,提高了对ESD的耐受性和光提取效率。