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1. 发明专利

JP2006077172A Insulating resin composition, manufacturing method therefor and electronic part 审中-公开
标题翻译：绝缘树脂组合物及其制造方法及电子部件
公开(公告)号：JP2006077172A
公开(公告)日：2006-03-23
申请号：JP2004264216
申请日：2004-09-10
申请人： Sumitomo Bakelite Co Ltd , Univ Nagoya , 住友ベークライト株式会社 , 国立大学法人名古屋大学
发明人： ISHIBASHI KATSUYUKI , NAKAMURA KENSUKE , TAKEDA KUNIHIKO , TANAHASHI MITSURU , MATSUDA NARIHIRO , HIROSE MAKI
IPC分类号： C08L101/00 , C08K7/24 , H01B3/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide, using an inorganic filler, an insulating resin composition which gives a resin molded part sufficiently suppressed in increase in the thermal expansion coefficient in the temperature region of not lower than its glass transition temperature, and to provide a method for manufacturing the insulating resin composition and an electronic part having a resin part formed of the insulating resin composition.
SOLUTION: The insulating resin composition comprises a porous inorganic fine particle having an average particle size of 1-50 μm, a porosity of at least 0.2 and an average pore size of 10-100 nm, and an insulating resin.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供使用无机填料的绝缘树脂组合物，其在不低于其玻璃化转变温度的温度区域中增加热膨胀系数而充分抑制树脂模塑部分，并且至少提供制造绝缘树脂组合物的方法和具有由绝缘树脂组合物形成的树脂部分的电子部件。解决方案：绝缘树脂组合物包含平均粒度为1-50μm，孔隙率为至少0.2，平均孔径为10-100nm的多孔无机细颗粒和绝缘树脂。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2007189216A Method of manufacturing multilayer wiring board 审中-公开
标题翻译：制造多层接线板的方法
公开(公告)号：JP2007189216A
公开(公告)日：2007-07-26
申请号：JP2006337450
申请日：2006-12-14
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： MEURA TORU , ISHIBASHI KATSUYUKI
IPC分类号： H05K3/46 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board, by which an adhesion between an insulating layer and a conductor circuit in the multilayer wiring board to carry out a face-down packaging of a semiconductor chip can be improved, a peeling between the conductor circuit and the insulating layer during a processing process can be reduced, and a fine wiring can be formed.
SOLUTION: The method of manufacturing the multilayer wiring board comprises the steps of: forming the insulating layer including a porosity inorganic filler on a front surface of a circuit board composed of an insulating substrate in which the conductor circuit is formed; and exposing the porosity inorganic filler on a front surface of the insulating layer by oxidizing roughening liquid.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种制造多层布线板的方法，通过该方法，可以将多层布线板中的绝缘层和导体电路之间的粘附性实现半导体芯片的面朝下封装改善了加工过程中导体电路与绝缘层之间的剥离，可以形成精细的布线。解决方案：制造多层布线板的方法包括以下步骤：在由形成导体电路的绝缘基板构成的电路板的正面上形成包括孔隙率无机填料的绝缘层; 并且通过氧化粗糙化液体将孔隙率无机填料暴露在绝缘层的前表面上。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2006216869A Composite substrate and its manufacturing method 审中-公开
标题翻译：复合基材及其制造方法
公开(公告)号：JP2006216869A
公开(公告)日：2006-08-17
申请号：JP2005029943
申请日：2005-02-07
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： ISHIBASHI KATSUYUKI , KAWAGUCHI HITOSHI
IPC分类号： H05K1/14 , H05K3/36 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a composite wiring board which is excellent in layout efficiency, can be thinned with the high degree of freedom of design, and is excellent in connection reliability as well, and a manufacturing method of the composite wiring board which is excellent in an yield and capable of simplifying processes. SOLUTION: For the composite substrate, a flexible wiring board provided with a conductor part for interlayer connection and a module wiring board provided with a land for conductor joining are joined on one surface. The joining part is constituted of a joining part by an adhesive material layer and the conductor joining part of the conductor part for the interlayer connection of the flexible wiring board, and the land for the conductor joining of the module wiring board. The manufacturing method of the composite substrate comprises a process of laminating the flexible wiring board provided with a conductor circuit, an insulating layer and the conductor for the interlayer connection exposed through the insulating layer onto the conductor circuit, and the module wiring board provided with the land for the conductor joining through the adhesive material layer, so that the conductor part for the interlayer connection, and the land for the conductor joining face each other; and a process of executing the interlayer connection by heating and press fitting. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供布局效率优异的复合布线板，可以以高设计自由度进行薄化，并且连接可靠性也优异，并且复合布线的制造方法产量优良，能简化工艺的板材。解决方案：对于复合基板，设置有用于层间连接的导体部分的柔性布线板和设置有用于导体接合的焊盘的模块布线板在一个表面上接合。接合部分由粘合材料层的接合部分和用于柔性布线板的层间连接的导体部分的导体接合部分和用于模块布线板的导体接合的焊盘构成。复合基板的制造方法包括将设置有导体电路的柔性布线板，绝缘层和通过绝缘层露出的层间连接导体层叠在导体电路上的工序，导体通过粘合材料层接合，使得用于层间连接的导体部分和用于导体接合的焊盘面彼此面对; 以及通过加热和压配合执行层间连接的过程。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2007115993A Printed wiring board, its production method and multilayered printed wiring board 有权
标题翻译：印刷线路板及其生产方法和多层印刷线路板
公开(公告)号：JP2007115993A
公开(公告)日：2007-05-10
申请号：JP2005307633
申请日：2005-10-21
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： ISHIBASHI KATSUYUKI , OKADA RYOICHI
IPC分类号： H05K1/09 , H05K3/38 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method for ensuring the even adhesion of an insulator layer and a circuit conductor independent of influence from a circuit conductor at the lower tier of the insulator layer. SOLUTION: This printed wiring board not only has a second insulator layer at a first circuit conductor formation side of a first insulator layer with a first circuit conductor formed on the surface, but also has an inactive conductor film on the surface of the first conductor. In addition, the presented printed wiring board production method includes: an inactive conductor film formation process for forming an inactive conductor film on the surface of the first circuit conductor; and a surface treatment process for roughening the surface of the second insulator layer formed at the first circuit conductor formation side of the first insulator layer with the first circuit conductor formed on the surface. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于确保绝缘体层和电路导体的均匀粘合的方法，而不受来自绝缘体层的下层处的电路导体的影响。解决方案：该印刷线路板不仅在第一绝缘体层的第一电路导体形成侧具有第二绝缘体层，其中在第一绝缘体层的表面上形成有第一电路导体，而且在该表面上具有非活性导体膜第一指挥另外，本发明的印刷电路板制造方法包括：在第一电路导体的表面上形成无活性导体膜的无效导体膜形成工艺; 以及表面处理工艺，用于在形成在表面上的第一电路导体上使形成在第一绝缘体层的第一电路导体形成侧的第二绝缘体层的表面粗糙化。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2012046755A Insulating resin composition, method for manufacturing the same, and electronic part 审中-公开
标题翻译：绝缘树脂组合物，其制造方法和电子部件
公开(公告)号：JP2012046755A
公开(公告)日：2012-03-08
申请号：JP2011209237
申请日：2011-09-26
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： ISHIBASHI KATSUYUKI , NAKAMURA KENSUKE , TAKEDA KUNIHIKO , TANAHASHI MITSURU , MATSUDA NARIHIRO , HIROSE MAKI
IPC分类号： C08L101/00 , C01B33/152 , C08K7/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide, using an inorganic filler, an insulating resin composition which gives a resin molded part sufficiently suppressed in increase in the thermal expansion coefficient in the temperature region of not lower than its glass transition temperature, and moreover to provide a method for manufacturing the insulating resin composition and an electronic part having a resin part formed by using the insulating resin composition.SOLUTION: The insulating resin composition includes: a porous inorganic fine particle having an average particle size of 1-50 μm, a porosity of at least 0.2, and an average pore size of 10-100 nm; and an insulating resin.
摘要翻译：要解决的问题：为了提供使用无机填料的绝缘树脂组合物，其在不低于其玻璃化转变温度的温度区域中增加热膨胀系数而充分抑制树脂模塑部分，此外提供一种用于制造绝缘树脂组合物的方法和具有通过使用该绝缘树脂组合物形成的树脂部件的电子部件。解决方案：绝缘树脂组合物包括：平均粒径为1-50μm，孔隙率为至少0.2，平均孔径为10-100nm的多孔无机细颗粒; 和绝缘树脂。版权所有（C）2012，JPO＆INPIT

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