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1. 发明授权

US08624393B2 Methods and designs for localized wafer thinning 有权
标题翻译：局部晶片薄化的方法和设计
公开(公告)号：US08624393B2
公开(公告)日：2014-01-07
申请号：US13404317
申请日：2012-02-24
申请人： Suku Kim , James Murphy , Matthew Reynolds , Romel Manatad , Jan Mancelita , Michael Gruenhagen
发明人： Suku Kim , James Murphy , Matthew Reynolds , Romel Manatad , Jan Mancelita , Michael Gruenhagen
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/74 , H01L24/03 , H01L24/05 , H01L2224/0401 , H01L2224/05 , H01L2224/16 , H01L2924/01006 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/00
摘要： Methods for localized thinning of wafers used in semiconductor devices and the structures formed from such methods are described. The methods thin localized areas of the backside of the semiconductor wafer to form recesses with a bi-directional channel design that is repeated within the wafer (or die) so that no straight channel line crosses the wafer (or die). The bi-directional pattern design keeps the channels from being aligned with the crystal orientation of the wafer. The recesses are then filled by a solder ball drop process by dropping proper size solder balls into the recesses and then annealing the wafer to reflow the solder balls and flatten them out. The reflow process begins to fill in the recesses from the bottom up, thereby avoiding void formation and the resulting air traps in the reflowed solder material. Other embodiments are also described.
摘要翻译：描述了半导体器件中使用的晶片的局部变薄方法和由这些方法形成的结构。该方法使半导体晶片的背面薄的局部区域形成具有在晶片（或管芯）内重复的双向通道设计的凹槽，使得没有直通道线穿过晶片（或管芯）。双向图案设计保持通道不与晶片的晶体取向对齐。然后通过将适当尺寸的焊球落入凹槽中然后通过焊球落下工艺填充凹陷，然后退火晶片以回流焊球并使其平坦化。回流工艺开始从底部向上填充凹槽，从而避免了空隙形成和回流焊料中形成的空气阱。还描述了其它实施例。

2. 发明申请

US20110201179A1 METHOD AND STRUCTURE FOR DIVIDING A SUBSTRATE INTO INDIVIDUAL DEVICES 有权
标题翻译：将基板分解成个体设备的方法和结构
公开(公告)号：US20110201179A1
公开(公告)日：2011-08-18
申请号：US13095584
申请日：2011-04-27
申请人： Minhua Li , Qi Wang , Gordon Sim , Matthew Reynolds , Suku Kim , James J. Murphy , Hamza Yilmaz
发明人： Minhua Li , Qi Wang , Gordon Sim , Matthew Reynolds , Suku Kim , James J. Murphy , Hamza Yilmaz
IPC分类号： H01L21/78
CPC分类号： H01L21/78
摘要： A method for obtaining individual dies from a semiconductor structure is disclosed. The semiconductor structure includes a device layer, and the device layer in turn includes active regions separated by predefined spacings. Thick metal is selectively formed on backside of the device layer such that thick metal is formed on backside of active regions but not on backside of the predefined spacings. The semiconductor structure is then cut along the predefined spacings to separate the active regions with thick metal on their backside into individual dies.
摘要翻译：公开了一种从半导体结构获得单个管芯的方法。半导体结构包括器件层，器件层又包括由预定间隔隔开的有源区。在器件层的背侧选择性地形成厚金属，使得在有源区的背面形成厚金属，而不在预定间隔的背面形成厚金属。然后沿着预定的间隔切割半导体结构，以将其背面的厚金属的活性区域分离成单独的管芯。

3. 发明申请

US20090181520A1 Method and Structure for Dividing a Substrate into Individual Devices 有权
标题翻译：将基板划分为单个设备的方法和结构
公开(公告)号：US20090181520A1
公开(公告)日：2009-07-16
申请号：US12174863
申请日：2008-07-17
申请人： Minhua Li , Qi Wang , Gordon Sim , Matthew Reynolds , Suku Kim , James J. Murphy , Hamza Yilmaz
发明人： Minhua Li , Qi Wang , Gordon Sim , Matthew Reynolds , Suku Kim , James J. Murphy , Hamza Yilmaz
IPC分类号： H01L21/78
CPC分类号： H01L21/78
摘要： A method for obtaining individual dies from a semiconductor structure is disclosed. The semiconductor structure includes a device layer, and the device layer in turn includes active regions separated by predefined spacings. Thick metal is selectively formed on backside of the device layer such that thick metal is formed on backside of active regions but not on backside of the predefined spacings. The semiconductor structure is then cut along the predefined spacings to separate the active regions with thick metal on their backside into individual dies.
摘要翻译：公开了一种从半导体结构获得单个管芯的方法。半导体结构包括器件层，器件层又包括由预定间隔隔开的有源区。在器件层的背侧选择性地形成厚金属，使得在有源区的背面形成厚金属，而不在预定间隔的背面形成厚金属。然后沿着预定的间隔切割半导体结构，以将其背面的厚金属的活性区域分离成单独的管芯。

4. 发明授权

US07951688B2 Method and structure for dividing a substrate into individual devices 有权
标题翻译：将基板分割为各个装置的方法和结构
公开(公告)号：US07951688B2
公开(公告)日：2011-05-31
申请号：US12174863
申请日：2008-07-17
申请人： Minhua Li , Qi Wang , Gordon Sim , Matthew Reynolds , Suku Kim , James J. Murphy , Hamza Yilmaz
发明人： Minhua Li , Qi Wang , Gordon Sim , Matthew Reynolds , Suku Kim , James J. Murphy , Hamza Yilmaz
IPC分类号： H01L21/30 , H01L21/46
CPC分类号： H01L21/78
摘要： A method for obtaining individual dies from a semiconductor structure is disclosed. The semiconductor structure includes a device layer, and the device layer in turn includes active regions separated by predefined spacings. Thick metal is selectively formed on backside of the device layer such that thick metal is formed on backside of active regions but not on backside of the predefined spacings. The semiconductor structure is then cut along the predefined spacings to separate the active regions with thick metal on their backside into individual dies.
摘要翻译：公开了一种从半导体结构获得单个管芯的方法。半导体结构包括器件层，器件层又包括由预定间隔隔开的有源区。在器件层的背侧选择性地形成厚金属，使得在有源区的背面形成厚金属，而不在预定间隔的背面形成厚金属。然后沿着预定的间隔切割半导体结构，以将其背面的厚金属的活性区域分离成单独的管芯。

5. 发明授权

US08343852B2 Method and structure for dividing a substrate into individual devices 有权
标题翻译：将基板分割为各个装置的方法和结构
公开(公告)号：US08343852B2
公开(公告)日：2013-01-01
申请号：US13095584
申请日：2011-04-27
申请人： Minhua Li , Qi Wang , Gordon Sim , Matthew Reynolds , Suku Kim , James J. Murphy , Hamza Yilmaz
发明人： Minhua Li , Qi Wang , Gordon Sim , Matthew Reynolds , Suku Kim , James J. Murphy , Hamza Yilmaz
IPC分类号： H01L21/00
CPC分类号： H01L21/78
摘要： A method for obtaining individual dies from a semiconductor structure is disclosed. The semiconductor structure includes a device layer, and the device layer in turn includes active regions separated by predefined spacings. Thick metal is selectively formed on backside of the device layer such that thick metal is formed on backside of active regions but not on backside of the predefined spacings. The semiconductor structure is then cut along the predefined spacings to separate the active regions with thick metal on their backside into individual dies.
摘要翻译：公开了一种从半导体结构获得单个管芯的方法。半导体结构包括器件层，器件层又包括由预定间隔隔开的有源区。在器件层的背侧选择性地形成厚金属，使得在有源区的背面形成厚金属，而不在预定间隔的背面形成厚金属。然后沿着预定的间隔切割半导体结构，以将其背面的厚金属的活性区域分离成单独的管芯。

6. 发明申请

US20100069011A1 Methods and Apparatus For Self-Jamming Suppression In A Radio Frequency Identification (RFID) Reader 审中-公开
标题翻译：射频识别（RFID）阅读器中自干扰抑制的方法和装置
公开(公告)号：US20100069011A1
公开(公告)日：2010-03-18
申请号：US12595109
申请日：2008-04-21
申请人： John C. Carrick , Robert R. Herold , Sri Krishna , Matthew Reynolds , Yael G. Maguire , Ravikanth Pappu
发明人： John C. Carrick , Robert R. Herold , Sri Krishna , Matthew Reynolds , Yael G. Maguire , Ravikanth Pappu
IPC分类号： H04B15/00 , H04Q5/22
CPC分类号： G06K7/0008 , H04B15/04 , H04B2215/064 , H04K3/28 , H04K2203/20
摘要： A circuit for transmitter-receiver isolation that is useful in a monostatic (combined transmitting and receiving) antenna configuration is shown and described. In addition, methods and systems are shown for automatically adjusting the circuit in response to changes in antenna configuration, external signal reflectors, and jamming energy (e.g., self jammer energy) by adjusting the circuit to tune out these sources of jammer energy to yield an increase in RFID reader receiver sensitivity when compared to measurements of the receiver sensitivity when the jammer energy is not present.
摘要翻译：示出并描述了在单一（组合发射和接收）天线配置中有用的用于发射机 - 接收机隔离的电路。另外，示出了通过调节电路以调出这些干扰源能量来响应于天线配置，外部信号反射器和干扰能量（例如自干扰能量）的变化来自动调整电路的方法和系统，以产生当不存在干扰能量时，与读取器灵敏度的测量值相比，RFID读取器接收器灵敏度增加。

7. 发明申请

US20190328077A1 FLIP FLOP ACCESSORY DEVICE AND METHOD 审中-公开
公开(公告)号：US20190328077A1
公开(公告)日：2019-10-31
申请号：US16244957
申请日：2019-01-10
申请人： Matthew Reynolds
发明人： Matthew Reynolds
IPC分类号： A43B3/12
摘要： This flip flop accessory holds a flip flop more securely to the foot when the wearer wants to run, jump, walk backwards, or dangle their feet—activities where flip flops often dislodge. It is comprised of two anchoring points screws on either side of the sole and an elastic cord that attaches to the screws and wraps around the ankle. The wearer screws anchoring screws into the sides of the sole, wraps the cord around the ankle looping the ends around the anchor screws, and then adjusts the length of the cord to maximize comfort and functionality.

8. 发明申请

US20150339499A1 SECURE OPTIONALLY PASSIVE RFID TAG OR SENSOR WITH EXTERNAL POWER SOURCE AND DATA LOGGING 有权
标题翻译：安全的无源RFID标签或传感器与外部电源和数据记录
公开(公告)号：US20150339499A1
公开(公告)日：2015-11-26
申请号：US14715539
申请日：2015-05-18
申请人： Faranak Nekoogar , Matthew Reynolds , Scott Lefton , Farid Dowla , Richard Twogood
发明人： Faranak Nekoogar , Matthew Reynolds , Scott Lefton , Farid Dowla , Richard Twogood
IPC分类号： G06K7/10
CPC分类号： G08B21/00 , G06K19/0723 , G06K19/07798 , G06K2007/10504 , G08B13/128
摘要： A secure optionally passive RFID tag or sensor system comprises a passive RFID tag having means for receiving radio signals from at least one base station and for transmitting radio signals to at least one base station, where the tag is capable of being powered exclusively by received radio energy, and an external power and data logging device having at least one battery and electronic circuitry including a digital memory configured for storing and recalling data. The external power and data logging device has a means for powering the tag, and also has a means
摘要翻译：安全的可选择的无源RFID标签或传感器系统包括无源RFID标签，其具有用于接收来自至少一个基站的无线电信号的装置，并且用于向至少一个基站发送无线电信号，其中标签能够由接收到的无线电能量以及具有至少一个电池和电子电路的外部电力和数据记录装置，该电子电路包括被配置为存储和调用数据的数字存储器。外部电源和数据记录设备具有为标签供电的方法，并且还具有一种手段

9. 发明申请

US20070001851A1 Configurable, calibrated radio frequency identification tag system 审中-公开
标题翻译：可配置的校准射频识别标签系统
公开(公告)号：US20070001851A1
公开(公告)日：2007-01-04
申请号：US11171444
申请日：2005-07-01
申请人： Matthew Reynolds , Bernd Schoner
发明人： Matthew Reynolds , Bernd Schoner
IPC分类号： G08B13/14
CPC分类号： G06K19/0723 , G06K7/0095
摘要： A simulated RFID tag may be combined with other such tags to form a population of simulated tags. A method of testing an RFID reader includes providing at least one population of simulated RFID tags; configuring tags in the at least one population of simulated RFID tags; and querying the at least one population of simulated RFID tags with the RFID reader. The simulated RFID tags may be configured by assigning arbitrary static IDs to at least some of the simulated RFID tags; assigning a sequence of tag IDs to at least some of the simulated RFID tags; assigning a sequence of time-varying IDs to at least some the population of simulated RFID tags; and assigning arbitrary timing/persistence to at least some of the simulated RFID tags.
摘要翻译：模拟RFID标签可以与其他这样的标签组合以形成一组模拟标签。一种测试RFID读取器的方法包括提供至少一个模拟RFID标签群; 在至少一个模拟RFID标签群中配置标签; 并用RFID读取器查询至少一个模拟RFID标签的群体。模拟RFID标签可以通过向至少一些模拟的RFID标签分配任意静态ID来配置; 向至少一些所述模拟RFID标签分配标签ID序列; 向至少一些模拟RFID标签的群体分配时变ID序列; 以及向所述模拟的RFID标签中的至少一些分配任意的定时/持续性。

10. 发明授权

US11026470B2 Flip flop accessory device and method 有权
公开(公告)号：US11026470B2
公开(公告)日：2021-06-08
申请号：US16244957
申请日：2019-01-10
申请人： Matthew Reynolds
发明人： Matthew Reynolds
IPC分类号： A43B3/12 , A43B23/28
摘要： This flip flop accessory holds a flip flop more securely to the foot when the wearer wants to run, jump, walk backwards, or dangle their feet—activities where flip flops often dislodge. It is comprised of two anchoring points screws on either side of the sole and an elastic cord that attaches to the screws and wraps around the ankle. The wearer screws anchoring screws into the sides of the sole, wraps the cord around the ankle looping the ends around the anchor screws, and then adjusts the length of the cord to maximize comfort and functionality.

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