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    • 2. 发明申请
    • Flat Type Heat Transferring Device and Manufacturing Method of the Same
    • 平板式传热装置及其制造方法
    • US20070295494A1
    • 2007-12-27
    • US11768689
    • 2007-06-26
    • George MayerJae ChoiKi Nam
    • George MayerJae ChoiKi Nam
    • F28F3/12
    • F28D15/0233F28D15/046Y10T29/49353
    • The present invention relates to a flat type heat transferring device, and manufacturing method of the same, which is comprises of a capillary wick that is provided inside a case and formed by weaving a wire in the horizontal direction and the vertical direction so as to absorb a liquid coolant, and a linear member that is formed to have a different wire diameter from the wire of the capillary wick and woven in the capillary wick to form a space where a vapor coolant flows. Accordingly, the mechanically stabilized support rigidity can be secured and an ultra thin configuration can be implemented with a light-weight, in particular, the problem of degrading the capillary force is resolved, and it has the effect that the cooling efficiency can be improved with smooth flowing of a coolant.
    • 扁平型传热装置及其制造方法技术领域本发明涉及一种扁平型传热装置及其制造方法,其特征在于,包括:设置在壳体内部并通过在水平方向和垂直方向上编织电线形成的毛细管芯,以吸收 液体冷却剂和线性构件,其被形成为具有与毛细管芯的线不同的线直径并且在毛细管芯中织造以形成蒸气冷却剂流动的空间。 因此,可以确保机械稳定的支撑刚度,并且可以以轻的重量实现超薄结构,特别是解决了降低毛细管力的问题,并且具有可以通过以下方式改善冷却效率: 冷却液流畅。
    • 7. 发明申请
    • Surveillance device
    • 监控设备
    • US20050024493A1
    • 2005-02-03
    • US10844206
    • 2004-05-12
    • Ki Nam
    • Ki Nam
    • G08B13/196H04N5/225H04N7/18
    • H04N5/23238G08B13/19619G08B13/19628G08B13/19697H04N5/2252
    • A surveillance device that may be propelled, such as by throwing, into a room or other area for surveillance purposes. The device has an enclosure containing a solid state camera, a wireless transmitter, and a battery. The device is configured to seek a predetermined at rest position, and includes an omnidirectional imaging system positioned relative to the camera to provide a panoramic view of the immediate area to the camera for transmission when in the predetermined at rest position. Various embodiments are disclosed, including embodiments of different shapes, embodiments using one-way and two-way communication, embodiments using visible imaging and infrared imaging, embodiments including one or more microphones and/or other sensors and embodiments including direction sensing and communication capabilities.
    • 可能被推进的监视装置,例如通过投掷到房间或其他区域进行监视。 该设备具有包含固态照相机,无线发射器和电池的外壳。 该装置被配置成寻找预定的静止位置,并且包括相对于照相机定位的全向成像系统,以在处于预定的静止位置时向照相机提供立体区域的全景图以进行传播。 公开了各种实施例,包括不同形状的实施例,使用单向和双向通信的实施例,使用可见成像和红外成像的实施例,包括一个或多个麦克风和/或其他传感器的实施例以及包括方向感测和通信能力的实施例。
    • 9. 发明申请
    • Method of manufacturing semiconductor device
    • 制造半导体器件的方法
    • US20060141796A1
    • 2006-06-29
    • US11120531
    • 2005-05-02
    • Jae KimKi Nam
    • Jae KimKi Nam
    • H01L21/461H01L21/302
    • H01L21/02057H01L27/10876H01L29/1037
    • The method includes forming an isolation film on a silicon substrate to define an active region; forming an antireflective film on an entire surface of the substrate containing the isolation film; forming a photosensitive film pattern on the antireflective film while exposing a portion of the isolation film or the active region adjacent to the isolation film; etching the antireflective film, the isolation film, and the substrate by using the photosensitive film pattern as an etching mask to recess the active region; performing a light etch treatment on a substrate resultant without removing the remaining photosensitive film pattern, so as to remove a damaged layer and a carbon pollutant formed on a surface of the recessed active region; and removing the remaining photosensitive film pattern and the antireflective film.
    • 该方法包括在硅衬底上形成隔离膜以限定有源区; 在包含隔离膜的基板的整个表面上形成抗反射膜; 在防反射膜上形成感光膜图案,同时使隔离膜的一部分或与隔离膜相邻的有源区域暴露; 通过使用感光膜图案作为蚀刻掩模来蚀刻抗反射膜,隔离膜和基板以使有源区域凹陷; 对基板结果进行光蚀刻处理,而不去除剩余的感光膜图案,以去除在凹入的有源区域的表面上形成的损伤层和碳污染物; 并除去剩余的感光膜图案和抗反射膜。
    • 10. 发明申请
    • Method for forming landing plug poly of semiconductor device
    • 用于形成半导体器件的着陆塞多晶的方法
    • US20060110910A1
    • 2006-05-25
    • US11123557
    • 2005-05-06
    • Jung LeeKi Nam
    • Jung LeeKi Nam
    • H01L21/4763H01L21/44H01L21/336
    • H01L21/76895H01L21/28061H01L21/76897
    • Disclosed is a method for forming a landing plug poly of a semiconductor device. In such a method, there is provided a substrate formed with gates, each of which has a nitride film as a gate hard mask and nitride film spacers. An insulating interlayer is formed over the entire surface of the substrate and then is subjected to CMP until the nitride film is exposed. A material film having etching selectivity to the nitride film is deposited on the resultant substrate structure. The material film is patterned and the exposed insulating interlayer portions are etched to form a landing plug contact which simultaneously exposes several gates and substrate regions between the gates. A polysilicon film is deposited to fill up the landing plug contact. Finally, the polysilicon film is subjected to CMP until the gates are exposed.
    • 公开了一种用于形成半导体器件的着陆塞多晶的方法。 在这种方法中,提供了形成有栅极的基板,每个栅极具有氮化膜作为栅极硬掩模和氮化物膜间隔物。 在衬底的整个表面上形成绝缘中间层,然后进行CMP直到氮化膜露出。 在所得到的基板结构上沉积具有对氮化物膜的蚀刻选择性的材料膜。 对材料膜进行图案化,并且暴露的绝缘夹层部分被蚀刻以形成同时在栅极之间暴露几个栅极和衬底区域的着色插头接触。 沉积多晶硅膜以填满着陆插头触点。 最后,对多晶硅膜进行CMP直到栅极暴露。