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    • 1. 发明申请
    • High-Voltage Transistor Structure with Reduced Gate Capacitance
    • 具有降低栅极电容的高压晶体管结构
    • US20120273885A1
    • 2012-11-01
    • US13532583
    • 2012-06-25
    • Sujit BanerjeeVijay Parthasarathy
    • Sujit BanerjeeVijay Parthasarathy
    • H01L29/78
    • H01L29/7835H01L29/0634H01L29/0692H01L29/0882H01L29/42368
    • In one embodiment, a high voltage field-effect transistor (HVFET) includes a field oxide layer that covers a first well region, the field oxide layer having a first thickness and extending in a second lateral direction from a drain region to near a second well region. A gate oxide covers a channel region and has a second dimension in a first lateral direction. A gate extends in the second lateral direction from the source region to over a portion of the field oxide layer, the gate being insulated from the channel region by the gate oxide, the gate extending in the first lateral dimension over an inactive area of the HVFET beyond the second dimension of the gate oxide, the gate being insulated from the first and second well regions over the inactive area by the field oxide layer.
    • 在一个实施例中,高电压场效应晶体管(HVFET)包括覆盖第一阱区的场氧化物层,所述场氧化物层具有第一厚度并且在第二横向方向上从漏极区延伸到接近第二阱 地区。 栅极氧化物覆盖沟道区域并且具有在第一横向方向上的第二尺寸。 栅极在第二横向方向上从源极区域延伸到场氧化物层的一部分,栅极通过栅极氧化物与沟道区域绝缘,栅极在第一横向尺寸上延伸超过HVFET的非有效区域 超过栅极氧化物的第二维度,栅极通过场氧化物层与无源区域上的第一和第二阱区绝缘。
    • 2. 发明申请
    • High-voltage transistor device with integrated resistor
    • 具有集成电阻的高压晶体管器件
    • US20120146105A1
    • 2012-06-14
    • US13385264
    • 2012-02-10
    • Sujit BanerjeeVijay Parthasarathy
    • Sujit BanerjeeVijay Parthasarathy
    • H01L27/06
    • H01L29/808H01L27/0629H01L28/20H01L29/0634H01L29/1058H01L29/1066
    • A high-voltage device structure comprises a resistor coupled to a tap transistor that includes a JFET in a configuration wherein a voltage provided at a terminal of the JFET is substantially proportional to an external voltage when the external voltage is less than a pinch-off voltage of the JFET. The voltage provided at the terminal being substantially constant when the external voltage is greater than the pinch-off voltage. One end of the resistor is substantially at the external voltage when the external voltage is greater than the pinch-off voltage. When the external voltage is negative, the resistor limits current injected into the substrate. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure.
    • 高压器件结构包括耦合到抽头晶体管的电阻器,其包括JFET,其中当外部电压小于钳位电压时,在JFET的端子处提供的电压基本上与外部电压成比例 的JFET。 当外部电压大于夹断电压时,端子处提供的电压基本上恒定。 当外部电压大于夹断电压时,电阻器的一端基本上处于外部电压。 当外部电压为负时,电阻限制注入基板的电流。 要强调的是,该摘要被提供以符合要求抽象的规则,允许搜索者或其他读者快速确定技术公开的主题。
    • 4. 发明申请
    • Method and apparatus for programming an anti-fuse element in a high-voltage integrated circuit
    • 用于在高压集成电路中编程抗熔丝元件的方法和装置
    • US20110273950A1
    • 2011-11-10
    • US12800095
    • 2010-05-07
    • Sujit BanerjeeGiao Minh Pham
    • Sujit BanerjeeGiao Minh Pham
    • G11C17/16
    • G11C17/16
    • A method for programming a programmable block of a power IC device includes selecting an anti-fuse element of the programmable block to be programmed. The anti-fuse element includes first and second capacitive plates separated by a dielectric layer. A voltage pulse is then applied to a pin of the power IC device. The pin is connected to a drain of a high-voltage field-effect transistor (HVFET) that drives an external load via the pin during a normal operating mode of the power IC device. The voltage pulse, which is coupled to the first capacitive plate of the anti-fuse element, has a potential sufficiently high to cause a current to flow through the anti-fuse element that destroys at least a portion of the dielectric layer, thereby electrically shorting the first and second capacitive plates
    • 用于对功率IC器件的可编程块进行编程的方法包括选择要编程的可编程块的反熔丝元件。 反熔丝元件包括由电介质层分隔开的第一和第二电容板。 然后将电压脉冲施加到功率IC器件的引脚。 该引脚连接到高电压场效应晶体管(HVFET)的漏极,在功率IC器件的正常工作模式下通过引脚驱动外部负载。 耦合到抗熔丝元件的第一电容板的电压脉冲具有足够高的电位,使电流流过反熔丝元件,破坏电介质层的至少一部分,由此电短路 第一和第二电容板
    • 6. 发明申请
    • High-voltage transistor device with integrated resistor
    • 具有集成电阻的高压晶体管器件
    • US20110042726A1
    • 2011-02-24
    • US12583426
    • 2009-08-20
    • Sujit BanerjeeVijay Parthasarathy
    • Sujit BanerjeeVijay Parthasarathy
    • H01L29/80H01L27/105
    • H01L29/808H01L27/0629H01L28/20H01L29/0634H01L29/1058H01L29/1066
    • A high-voltage device structure comprises a resistor coupled to a tap transistor that includes a JFET in a configuration wherein a voltage provided at a terminal of the JFET is substantially proportional to an external voltage when the external voltage is less than a pinch-off voltage of the JFET. The voltage provided at the terminal being substantially constant when the external voltage is greater than the pinch-off voltage. One end of the resistor is substantially at the external voltage when the external voltage is greater than the pinch-off voltage. When the external voltage is negative, the resistor limits current injected into the substrate. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure.
    • 高压器件结构包括耦合到抽头晶体管的电阻器,其包括JFET,其中当外部电压小于钳位电压时,JFET端子处的电压基本上与外部电压成比例 的JFET。 当外部电压大于夹断电压时,端子处提供的电压基本上恒定。 当外部电压大于夹断电压时,电阻器的一端基本上处于外部电压。 当外部电压为负时,电阻限制注入基板的电流。 要强调的是,该摘要被提供以符合要求抽象的规则,允许搜索者或其他读者快速确定技术公开内容的主题。
    • 8. 发明申请
    • Deep trench insulated gate bipolar transistor
    • 深沟槽绝缘栅双极晶体管
    • US20100155831A1
    • 2010-06-24
    • US12317307
    • 2008-12-20
    • Vijay ParthasarathySujit Banerjee
    • Vijay ParthasarathySujit Banerjee
    • H01L29/78
    • H01L29/7397H01L29/0649H01L29/0653H01L29/66348
    • In one embodiment, a power transistor device comprises a substrate of a first conductivity type that forms a PN junction with an overlying buffer layer of a second conductivity type. The power transistor device further includes a first region of the second conductivity type, a drift region of the second conductivity type that adjoins a top surface of the buffer layer, and a body region of the first conductivity type. The body region separates the first region from the drift region. First and second dielectric regions respectively adjoin opposing lateral sidewall portions of the drift region. The dielectric regions extend in a vertical direction from at least just beneath the body region down at least into the buffer layer. A trench gate that controls forward conduction is disposed above the dielectric region adjacent to and insulated from the body region.
    • 在一个实施例中,功率晶体管器件包括与第二导电类型的上覆缓冲层形成PN结的第一导电类型的衬底。 功率晶体管器件还包括第二导电类型的第一区域,与缓冲层的顶表面相邻的第二导电类型的漂移区域和第一导电类型的体区域。 身体区域将第一区域与漂移区域分开。 第一和第二电介质区域分别邻接漂移区域的相对的侧向侧壁部分。 电介质区域至少在身体区域的正下方沿垂直方向向下延伸至少至缓冲层。 控制正向传导的沟槽栅极设置在与身体区域相邻并绝缘的电介质区域的上方。
    • 9. 发明授权
    • Method of fabricating a deep trench insulated gate bipolar transistor
    • 制造深沟槽绝缘栅双极晶体管的方法
    • US08410548B2
    • 2013-04-02
    • US13565846
    • 2012-08-03
    • Vijay ParthasarathySujit Banerjee
    • Vijay ParthasarathySujit Banerjee
    • H01L29/76
    • H01L29/7397H01L29/66333
    • In one embodiment, a method comprises forming an epitaxial layer over a substrate of an opposite conductivity type, the epitaxial layer being separated by a buffer layer having a doping concentration that is substantially constant in a vertical direction down to the buffer layer. A pair of spaced-apart trenches is formed in the epitaxial layer from a top surface of the epitaxial layer down at least into the buffer layer. A dielectric material is formed in the trenches over the first and second sidewall portions. Source/collector and body regions of are formed at the top of the epitaxial layer, the body region separating the source/collector region of the pillar from a drift region of the epitaxial layer that extends from the body region to the buffer layer. An insulated gate member is then formed in each of the trenches adjacent to and insulated from the body region.
    • 在一个实施例中,一种方法包括在相反导电类型的衬底上形成外延层,该外延层被缓冲层隔开,该缓冲层的垂直方向上的缓冲层的掺杂浓度基本上是恒定的。 至少在缓冲层中,从外延层的顶表面在外延层中形成一对间隔开的沟槽。 在第一和第二侧壁部分上的沟槽中形成电介质材料。 源极/集电极和主体区域形成在外延层的顶部,体区域将柱的源极/集电极区域与从体区域延伸到缓冲层的外延层的漂移区域分离。 然后在与身体区域相邻并与其绝缘的每个沟槽中形成绝缘门构件。
    • 10. 发明授权
    • VTS insulated gate bipolar transistor
    • VTS绝缘栅双极晶体管
    • US08399907B2
    • 2013-03-19
    • US13200793
    • 2011-09-30
    • Vijay ParthasarathySujit Banerjee
    • Vijay ParthasarathySujit Banerjee
    • H01L29/739
    • H01L29/7397H01L29/407H01L29/66348
    • In one embodiment, a power transistor device comprises a substrate that forms a PN junction with an overlying buffer layer. The power transistor device further includes a first region, a drift region that adjoins a top surface of the buffer layer, and a body region. The body region separates the first region from the drift region. First and second dielectric regions respectively adjoin opposing lateral sidewall portions of the drift region. The dielectric regions extend in a vertical direction from at least just beneath the body region down at least into the buffer layer. First and second field plates are respectively disposed in the first and second dielectric regions. A trench gate that controls forward conduction is disposed above the dielectric region adjacent to and insulated from the body region.
    • 在一个实施例中,功率晶体管器件包括与上覆缓冲层形成PN结的衬底。 功率晶体管器件还包括第一区域,与缓冲层的顶表面相邻的漂移区域和主体区域。 身体区域将第一区域与漂移区域分开。 第一和第二电介质区域分别邻接漂移区域的相对的侧向侧壁部分。 电介质区域至少在身体区域的正下方沿垂直方向向下延伸至少至缓冲层。 第一和第二场板分别设置在第一和第二电介质区域中。 控制正向传导的沟槽栅极设置在与身体区域相邻并绝缘的电介质区域的上方。