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    • 1. 发明授权
    • Method and apparatus for determining the endpoint in a plasma cleaning
process
    • 用于确定血浆清洁过程中的终点的方法和装置
    • US6079426A
    • 2000-06-27
    • US887165
    • 1997-07-02
    • Sudhakar SubrahmanyamTsutomu TanakaMukul Kelkar
    • Sudhakar SubrahmanyamTsutomu TanakaMukul Kelkar
    • H05H1/46C23C16/44C23G5/028C23G5/04H01J37/32H01L21/205H01L21/31B08B6/00G01L21/30
    • H01J37/32935C23C16/4405H01J37/32963H01J2237/335Y10S156/916
    • Apparatus and methods are disclosed for utilizing a plasma cleaning operation of a CVD system incorporating cleaning process endpoint detection. In one embodiment, the cleaning process is performed at a constant exhaust capacity and the endpoint detection is in response to a specified rate of change of chamber pressure. In another embodiment, a servo-controlled exhaust system maintains a controlled chamber pressure and the endpoint detection is in response to a specified control signal. In a preferred embodiment, nitrogen trifluoride is converted into a plasma containing free fluorine radicals in a magnetron-powered remote microwave plasma generator. The remotely produced free fluorine radicals are used to remove silicon nitride deposits from a substrate processing chamber. The use of such a remote plasma system provides an efficient cleaning process that takes as little as half the time compared to similar in situ plasma cleaning processes. The incorporation of endpoint detection provides optimal cleaning time for the remote plasma cleaning process.
    • 公开了利用包含清洁过程端点检测的CVD系统的等离子体清洁操作的装置和方法。 在一个实施例中,清洁过程以恒定的排气量执行,并且端点检测响应于室压力的指定变化率。 在另一个实施例中,伺服控制的排气系统保持受控的室压力,并且端点检测响应于指定的控制信号。 在优选的实施方案中,在由磁控管供电的远程微波等离子体发生器中将三氟化氮转化成含有游离氟自由基的等离子体。 远程产生的自由氟基团用于从衬底处理室去除氮化硅沉积物。 使用这样的远程等离子体系统提供了有效的清洁过程,与类似的原位等离子体清洁过程相比,其需要的时间只有时间的一半。 结合端点检测为远程等离子体清洗过程提供了最佳的清洗时间。
    • 5. 发明授权
    • Film to tie up loose fluorine in the chamber after a clean process
    • 在清洁过程之后,电影将室内的松散的氟结合起来
    • US06223685B1
    • 2001-05-01
    • US09452551
    • 1999-12-01
    • Anand GuptaMohan BhanSudhakar Subrahmanyam
    • Anand GuptaMohan BhanSudhakar Subrahmanyam
    • C23C1600
    • C23C14/564C23C16/4404C23C16/5096C23C16/52H01J37/32477H01J37/32862H01L21/02131H01L21/02164H01L21/02274H01L21/31612Y10S438/905
    • An improved method of reducing the level of contaminants (e.g., fluorine) absorbed in films deposited within a substrate processing chamber. A seasoning layer is deposited within the substrate processing chamber to cover contaminants that may be absorbed within walls or insulation areas of the chamber interior. The deposited seasoning layer is more stable than prior art seasoning layers and is thus less likely to release the absorbed contaminants into the substrate processing chamber during the subsequent deposition of films. In a preferred embodiment, the seasoning layer is formed from a mixed frequency PECVD process in which the low frequency RF signal is supplied at a high power level to increase ion bombardment and enhance film stability. The increased bombardment favors the formation of stable SiF bonds between silicon and fluorine atoms in the lattice structure of the film rather than unstable SiF2 or other bonds. When residual fluorine atoms (e.g., fluorine atoms absorbed within the chamber walls) are incorporated into the deposited seasoning layer, fewer loosely bonded fluorine atoms are incorporated into the layer than in prior art silicon oxide seasoning layers. Fewer loosely bonded fluorine atoms in the seasoning film results in fewer contaminants being incorporated into films deposited over substrates in subsequent processing steps.
    • 一种降低在衬底处理室内沉积的膜中吸收的污染物(例如氟)的水平的改进​​方法。 在基材处理室内沉积调味料层以覆盖可能被吸收在室内部的壁或绝缘区域内的污染物。 沉积的调味剂层比现有技术的调味料层更稳定,因此在随后的膜沉积期间不太可能将吸收的污染物释放到基材处理室中。 在优选实施例中,调味层由混合频率PECVD工艺形成,其中以高功率水平提供低频RF信号以增加离子轰击并提高膜的稳定性。 增加的轰击有利于在膜的晶格结构中硅和氟原子之间形成稳定的SiF键,而不是不稳定的SiF 2或其它键。 当剩余的氟原子(例如在室壁内吸收的氟原子)被并入沉积的调味层中时,与现有技术的氧化硅调味层相比,较少的松散键合的氟原子被掺入到该层中。 在调味膜中较少松散粘合的氟原子导致在随后的加工步骤中将沉积在基材上的薄膜中的污染物掺入较少。
    • 9. 发明授权
    • Film to tie up loose fluorine in the chamber after a clean process
    • 在清洁过程之后,电影将室内的松散的氟结合起来
    • US6020035A
    • 2000-02-01
    • US740381
    • 1996-10-29
    • Anand GuptaMohan BhanSudhakar Subrahmanyam
    • Anand GuptaMohan BhanSudhakar Subrahmanyam
    • C23C14/56C23C16/44C23C16/50C23C16/509C23C16/52H01L21/316B05D3/06B08B5/00H05H1/02
    • C23C14/564C23C16/4404C23C16/5096C23C16/52H01J37/32477H01J37/32862H01L21/02131H01L21/02164H01L21/02274H01L21/31612Y10S438/905
    • An improved method of reducing the level of contaminants (e.g., fluorine) absorbed in films deposited within a substrate processing chamber. A seasoning layer is deposited within the substrate processing chamber to cover contaminants that may be absorbed within walls or insulation areas of the chamber interior. The deposited seasoning layer is more stable than prior art seasoning layers and is thus less likely to release the absorbed contaminants into the substrate processing chamber during the subsequent deposition of films. In a preferred embodiment, the seasoning layer is formed from a mixed frequency PECVD process in which the low frequency RF signal is supplied at a high power level to increase ion bombardment and enhance film stability. The increased bombardment favors the formation of stable SiF bonds between silicon and fluorine atoms in the lattice structure of the film rather than unstable SiF.sub.2 or other bonds. When residual fluorine atoms (e.g., fluorine atoms absorbed within the chamber walls) are incorporated into the deposited seasoning layer, fewer loosely bonded fluorine atoms are incorporated into the layer than in prior art silicon oxide seasoning layers. Fewer loosely bonded fluorine atoms in the seasoning film results in fewer contaminants being incorporated into films deposited over substrates in subsequent processing steps.
    • 一种降低在衬底处理室内沉积的膜中吸收的污染物(例如氟)的水平的改进​​方法。 在基材处理室内沉积调味料层以覆盖可能被吸收在室内部的壁或绝缘区域内的污染物。 沉积的调味剂层比现有技术的调味料层更稳定,因此在随后的膜沉积期间不太可能将吸收的污染物释放到基材处理室中。 在优选实施例中,调味层由混合频率PECVD工艺形成,其中以高功率水平提供低频RF信号以增加离子轰击并提高膜的稳定性。 增加的轰击有利于在膜的晶格结构中硅和氟原子之间形成稳定的SiF键,而不是不稳定的SiF 2或其它键。 当剩余的氟原子(例如在室壁内吸收的氟原子)被并入沉积的调味层中时,与现有技术的氧化硅调味层相比,较少的松散键合的氟原子被掺入到该层中。 在调味膜中较少松散粘合的氟原子导致在随后的加工步骤中将沉积在基材上的薄膜中的污染物掺入较少。