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    • 3. 发明授权
    • Antiferromagnetically exchange-coupled structure for magnetic tunnel junction device
    • 用于磁性隧道结装置的反铁磁交换耦合结构
    • US06326637B1
    • 2001-12-04
    • US09420213
    • 1999-10-18
    • Stuart Stephen Papworth ParkinMahesh Govind Samant
    • Stuart Stephen Papworth ParkinMahesh Govind Samant
    • H01L2906
    • H01F10/3268B82Y10/00B82Y25/00G11B5/3903G11B5/3909G11B2005/3996H01L43/08H01L43/10
    • An antiferromagnetically exchange-coupled structure for use in various types of magnetic devices, such as magnetic tunnel junctions and spin-valve giant magnetoresistance recording heads, includes an antiferromagnetic layer formed of an alloy of osmium and manganese, wherein the osmium is present in the range of approximately 10 to 30 atomic %. The antiferromagnetic layer is deposited on a non-reactive underlayer, preferably one formed of a noble metal, such as platinum, palladium or alloys thereof. The antiferromagnetic material provides a strong exchange biasing for the ferromagnetic layer that is deposited on the antiferromagnetic layer. Iridium may be added to the osmium-manganese alloy, wherein the total of osmium and iridium is in the range of the approximately 10 to 30 atomic %, to increase the blocking temperature of the antiferromagnetic material. A template layer of permalloy (nickel-iron alloy) may be formed between the underlayer and the antiferromagnetic layer to improve the growth of the osmium-manganese alloy. The resulting antiferromagnetically exchange-coupled structure exhibits very high thermal stability, i.e., the magnetoresistance of magnetic tunnel junction devices is retained even during relatively high annealing process temperatures. This allows magnetic tunnel junction devices using the structure to be used as memory cells in magnetic random access memory arrays that are formed on substrates with electronic circuitry formed by conventional high-temperature CMOS processes and which require high temperature anneals of the completed memory chips.
    • 用于各种磁性装置(例如磁性隧道结和自旋阀巨磁电阻记录头)的反铁磁交换耦合结构包括由锇和锰合金形成的反铁磁层,其中锇存在于该范围内 约10至30原子%。 反铁磁层沉积在非反应性底层上,优选由贵金属形成的铂,钯或其合金形成。 反铁磁材料为沉积在反铁磁层上的铁磁层提供强的交换偏置。 铱可以添加到锇锰合金中,其中锇和铱的总和在大约10至30原子%的范围内,以增加反铁磁性材料的封闭温度。 可以在底层和反铁磁层之间形成坡莫合金(镍 - 铁合金)的模板层,以改善锇锰合金的生长。 所得到的反铁磁交换耦合结构表现出非常高的热稳定性,即即使在相对高的退火工艺温度下,磁性隧道结装置的磁阻仍然保持。 这允许使用该结构的磁隧道结器件用作磁性随机存取存储器阵列中的存储器单元,其形成在具有由常规高温CMOS工艺形成的电子电路的衬底上,并且需要完成的存储器芯片的高温退火。