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1. 发明授权

US5378307A Fluid treatment apparatus 失效
标题翻译：流体处理设备
公开(公告)号：US5378307A
公开(公告)日：1995-01-03
申请号：US54108
申请日：1993-04-28
申请人： Steven L. Bard , Gerald A. Bendz , Michael J. Canestaro , John R. Chapura , Edward J. Frankoski , Michael S. Horan , Jeffrey D. Jones , James S. Kamperman , John R. Kjelgaard, Jr. , Jack M. McCreary
发明人： Steven L. Bard , Gerald A. Bendz , Michael J. Canestaro , John R. Chapura , Edward J. Frankoski , Michael S. Horan , Jeffrey D. Jones , James S. Kamperman , John R. Kjelgaard, Jr. , Jack M. McCreary
IPC分类号： B05C5/00 , B05B15/04 , C23F1/08 , H01L23/12 , H05K3/00 , H05K3/06 , H05K3/18 , B08B3/02
CPC分类号： H05K3/0085 , B05B15/0406 , Y02P70/36
摘要： A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article and thereafter collected within the apparatus' common housing. The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injecters, each including at least two rows of fluid jet injectors therein. The collected fluids are each returned to the respective impingement means. Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid. The first fluid is also maintained at an established level above the article's surface using suitable means (e.g., dual rollers) located relative (e.g., on opposite sides of) the first fluid impingement means. Similar level retention for the second fluid is also possible. Cascading of the collected second fluid is also defined, this occurring within the same housing chamber which serves to collect the first fluid.
摘要翻译：一种用于将第一和第二流体（例如蚀刻剂和水）施加到以预定速率穿过设备的制品（例如电路板）的流体处理装置和方法。第一流体冲击在物品的表面上，然后收集在设备的共用外壳内。第二流体冲击到制品的表面上并收集在相同的壳体内，但是在与收集的第一流体分开的位置处，以至少部分地防止其混合。用于实现流体冲击的优选方式包括单独的流体注射器，每个流体注射器在其中包括至少两排流体喷射喷射器。收集的流体各自返回到相应的冲击装置。使用供应第二流体的泵来实现第二流体的补充，同时该装置还包括以与第二流体的供给速率相似的速率有效地去除第二流体的装置（例如排水管）。使用位于第一流体冲击装置相对（例如，在相对侧）上的合适的装置（例如，双辊），第一流体也保持在制品表面上方的确定水平。第二流体的相似水平保持也是可能的。还定义了所收集的第二流体的级联，其发生在用于收集第一流体的相同壳体室内。

2. 发明授权

US5292688A Solder interconnection structure on organic substrates and process for making 失效
标题翻译：有机基板上的焊接互连结构和制造工艺
公开(公告)号：US5292688A
公开(公告)日：1994-03-08
申请号：US890798
申请日：1992-06-01
申请人： Richard Hsiao , Jack M. McCreary , Voya R. Markovich , Donald P. Seraphim
发明人： Richard Hsiao , Jack M. McCreary , Voya R. Markovich , Donald P. Seraphim
IPC分类号： H01L21/56 , H01L21/60 , H01L23/14 , H01L23/29 , H01L21/20
CPC分类号： H01L24/81 , H01L21/563 , H01L23/145 , H01L23/295 , H01L2224/13111 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/0105 , H01L2924/01082 , H01L2924/01092 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , Y10T29/49144 , Y10T29/49146
摘要： Solder interconnection whereby the gap created by solder connections between an organic substrate and semiconductor device is filled with a composition obtained from curing a thermosetting preparation containing a thermosetting binder; and filler having a maximum particle size of 50 microns.
摘要翻译：焊接互连，由此通过固化含有热固性粘合剂的热固性制剂获得的组合物填充有机衬底和半导体器件之间的焊料连接所产生的间隙; 和最大粒度为50微米的填料。

3. 发明授权

US5274913A Method of fabricating a reworkable module 失效
标题翻译：制造可再加工模块的方法
公开(公告)号：US5274913A
公开(公告)日：1994-01-04
申请号：US782701
申请日：1991-10-25
申请人： Kurt R. Grebe , Jack M. McCreary , Darbha Suryanarayana , Ho-Ming Tong
发明人： Kurt R. Grebe , Jack M. McCreary , Darbha Suryanarayana , Ho-Ming Tong
IPC分类号： C08G61/02 , C08G61/00 , C08J5/18 , H01L21/56 , H01L21/60 , H01L23/08 , H01L23/50 , H05K3/28 , H05K3/34
CPC分类号： H01L24/81 , H01L21/563 , H01L23/3135 , H05K3/284 , H01L2224/73203 , H01L2224/81801 , H01L2224/8192 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , Y10T29/49144 , Y10T29/49146
摘要： Disclosed is a reworkable circuit .package formed by controlled collapse chip connection ("C4") bonding of integrated circuit chips to circuit cards and boards, and direct chip attachment ("DCA") where an encapsulant is disposed under the chip. The encapsulant offers protection of the C4 connections and a thermal expansion matched to that of the C4 joints. However, most encapsulants interfere with reworkability. The disclosed circuit package overcomes this problem by the provision of a passivating layer of Parylene is reworkable, dry processable, uniformly depositable by vapor phase deposition, forming thin films on facing surfaces at the 3-5 micron film thickness corresponding to the C4 lift-off distance.
摘要翻译：公开了一种可重复工作的电路，通过集成电路芯片与电路卡和电路板的控制崩溃芯片连接（“C4”）接合形成的封装，以及在芯片下方设置密封剂的直接芯片附接（“DCA”）。密封剂提供C4连接的保护和与C4接头匹配的热膨胀。然而，大多数密封剂干扰可再加工性。所公开的电路封装通过提供帕利灵的钝化层是可再加工的，可干法加工的，通过气相沉积可均匀沉积来克服这个问题，在相对于C4剥离的3-5微米膜厚度的相对表面上形成薄膜距离。

4. 发明授权

US5414928A Method of making an electronic package assembly with protective encapsulant material 失效
标题翻译：制造具有保护性密封材料的电子封装组件的方法
公开(公告)号：US5414928A
公开(公告)日：1995-05-16
申请号：US42196
申请日：1993-04-02
申请人： Barry A. Bonitz , James V. Ellerson , Kishen N. Kapur , Jack M. McCreary , Irving Memis , Gerald M. Vettel
发明人： Barry A. Bonitz , James V. Ellerson , Kishen N. Kapur , Jack M. McCreary , Irving Memis , Gerald M. Vettel
IPC分类号： H01L23/50 , H01L23/04 , H05K1/18 , H05K3/28 , H05K3/34 , H05K13/00
CPC分类号： H05K3/284 , H05K3/3421 , H01L2224/48247 , H01L2224/48472 , H05K2201/10689 , H05K2201/10977 , Y02P70/613 , Y10T29/49144 , Y10T29/49146
摘要： An electronic package assembly wherein a low profile package is soldered to an organic (e.g., epoxy resin) substrate (e.g., printed circuit board), the projecting conductive leads of the package and the solder which substantially covers these leads (and respective conductors on the substrate) having been substantially covered with encapsulant material (e.g., polymer resin) to provide reinforcement for the solder-lead connections. The encapsulant material is dispensed about the solder and lead joints following solder reflow and solidification so as to substantially surround the solder and any portions of the leads not covered with solder. The invention has particular useful with thin, small outline package (TSOP) structures which occupy a minimum of height on the substrate surface.
摘要翻译：一种电子封装组件，其中低剖面封装焊接到有机（例如环氧树脂）衬底（例如，印刷电路板）上，封装的突出导电引线和基本上覆盖这些引线的各个导体基底）基本上被密封剂材料（例如，聚合物树脂）覆盖，以提供焊锡引线连接的加强。在焊料回流和固化之后，密封剂材料围绕焊料和引线接头分配，以便基本上围绕焊料，并且引线的任何部分未被焊料覆盖。本发明对于在衬底表面上占据最小高度的薄的小外形封装（TSOP）结构特别有用。

5. 发明授权

US5121190A Solder interconnection structure on organic substrates 失效
标题翻译：有机基板上的焊接互连结构
公开(公告)号：US5121190A
公开(公告)日：1992-06-09
申请号：US493125
申请日：1990-03-14
申请人： Richard Hsiao , Jack M. McCreary , Voya R. Markovich , Donald P. Seraphim
发明人： Richard Hsiao , Jack M. McCreary , Voya R. Markovich , Donald P. Seraphim
IPC分类号： H01L21/56 , H01L21/60 , H01L23/14 , H01L23/29
CPC分类号： H01L24/81 , H01L21/563 , H01L23/145 , H01L23/295 , H01L2224/13111 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/0105 , H01L2924/01082 , H01L2924/01092 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , Y10T29/49144 , Y10T29/49146
摘要： Solder interconnection whereby the gap created by solder connections between an organic substrate and semiconductor device is filled with a composition obtained from curing a thermosetting preparation containing a thermosetting binder; and filler having a maximum particle size of 50 microns.

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