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    • 1. 发明授权
    • Device packaging and method
    • 设备包装和方法
    • US06597853B2
    • 2003-07-22
    • US09746922
    • 2000-12-21
    • Steven CabotDavid Stephen DeVincentisArturo HaleSandra Greenberg KosinskiSalvatore J Messana
    • Steven CabotDavid Stephen DeVincentisArturo HaleSandra Greenberg KosinskiSalvatore J Messana
    • G02B600
    • G02B6/2558G02B6/36G02B6/3636
    • A packaging system includes a medium which transports energy in a first form away from a radiation point in a device to where the energy can be converted to a second form without damaging the device or effecting other devices. In certain embodiments, the medium can inhibit the propagation of energy in the second form. For example, in an optical coupling device, the medium includes a substrate adjacent to the radiation point which transports light energy away from the radiation point to a housing which converts the light energy into thermal energy away from the radiation point. In accordance with another aspect, the packaging system suspends at least a portion of the device, for example, to protect the device against a third form of energy. For example, in the optical coupling device, the medium includes an air gap which separates the radiation point from the substrate to suspend at least a portion of the device. The air gap enables the device to be protected against the mechanical energy resulting from the expansion or contraction of the packaged device due to changing temperature. In certain embodiments, the housing is provided with at least one opening in which a pliable seal is inserted which can absorb the mechanical energy resulting from the expansion or contraction of the packaged device due to changing temperature.
    • 包装系统包括将能量转换成第二形式的第一形式的能量远离设备中的辐射点的能力传递到不损坏设备或影响其他设备的介质。 在某些实施方案中,介质可以抑制第二形式的能量传播。 例如,在光耦合器件中,介质包括与辐射点相邻的衬底,其将光能从辐射点传输到壳体,该壳体将光能转换成远离辐射点的热能。 根据另一方面,例如,包装系统暂停装置的至少一部分,以保护装置抵抗第三形式的能量。 例如,在光耦合装置中,介质包括一个气隙,该气隙将辐射点从衬底分离以悬挂该装置的至少一部分。 空气间隙使得能够防止装置由于温度变化而免受由于封装装置的膨胀或收缩而产生的机械能。 在某些实施例中,壳体设置有至少一个开口,其中插入柔性密封件,其可以吸收由于温度变化而导致的封装装置的膨胀或收缩所产生的机械能。