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1. 发明申请

US20090256289A1 Preserving Filled Features When Vacuum Wiping 有权
标题翻译：真空擦拭时保存填充特性
公开(公告)号：US20090256289A1
公开(公告)日：2009-10-15
申请号：US12488642
申请日：2009-06-22
申请人： Steven C. Shackleton , Pankaj B. Lad , Ian M. McMackin , Frank Y. Xu , Sidlgata V. Sreenivasan
发明人： Steven C. Shackleton , Pankaj B. Lad , Ian M. McMackin , Frank Y. Xu , Sidlgata V. Sreenivasan
IPC分类号： B29C35/08
CPC分类号： G03F7/0002 , B29C43/003 , B29C43/021 , B29C43/34 , B29C2043/025 , B29C2043/142 , B29C2043/3438 , B29K2105/0002 , B82Y10/00 , B82Y40/00
摘要： A method/process for curing imprint on a template prior to contact with a substrate. A curing process is used to adhere the imprint to a wafer or substrate. Monomer is deposited on a template and then partially cured using a UV exposure. The exposure is controlled so that the imprint is cured past the gel point, but still retains a thin liquid layer of uncured monomer at the surface that will bond with the wafer. Further, this partially cured layer enables the alignment adjustments between the template and the substrate to be performed after contact between the two without pulling any monomer out of the features.
摘要翻译：在与基底接触之前在模板上固化印模的方法/方法。使用固化过程将印记粘附到晶片或基板上。将单体沉积在模板上，然后使用UV曝光部分固化。控制曝光使得印迹经过凝胶点固化，但仍然保留在将与晶片结合的表面上的未固化单体的薄液体层。此外，这种部分固化的层使得能够在两者之间接触之后进行模板和基板之间的对准调整，而不将任何单体拉出特征。

2. 发明授权

US08021594B2 Preserving filled features when vacuum wiping 有权
标题翻译：真空擦拭时保存充满的功能
公开(公告)号：US08021594B2
公开(公告)日：2011-09-20
申请号：US12488642
申请日：2009-06-22
申请人： Steven C. Shackleton , Pankaj B. Lad , Ian Matthew McMackin , Frank Y. Xu , Sidlgata V. Sreenivasan
发明人： Steven C. Shackleton , Pankaj B. Lad , Ian Matthew McMackin , Frank Y. Xu , Sidlgata V. Sreenivasan
IPC分类号： B29C35/08 , B29C59/02
CPC分类号： G03F7/0002 , B29C43/003 , B29C43/021 , B29C43/34 , B29C2043/025 , B29C2043/142 , B29C2043/3438 , B29K2105/0002 , B82Y10/00 , B82Y40/00
摘要： A method/process for curing imprint on a template prior to contact with a substrate. A curing process is used to adhere the imprint to a wafer or substrate. Monomer is deposited on a template and then partially cured using a UV exposure. The exposure is controlled so that the imprint is cured past the gel point, but still retains a thin liquid layer of uncured monomer at the surface that will bond with the wafer. Further, this partially cured layer enables the alignment adjustments between the template and the substrate to be performed after contact between the two without pulling any monomer out of the features.
摘要翻译：在与基底接触之前在模板上固化印模的方法/方法。使用固化过程将印记粘附到晶片或基板上。将单体沉积在模板上，然后使用UV曝光部分固化。控制曝光使得印迹经过凝胶点固化，但仍然保留在将与晶片结合的表面上的未固化单体的薄液体层。此外，这种部分固化的层使得能够在两者之间接触之后进行模板和基板之间的对准调整，而不将任何单体拉出特征。

3. 发明申请

US20100143521A1 Method for Expelling Gas Positioned Between a Substrate and a Mold 有权
标题翻译：排出位于基板和模具之间的气体的方法
公开(公告)号：US20100143521A1
公开(公告)日：2010-06-10
申请号：US12707345
申请日：2010-02-17
申请人： Byung-Jin Choi , Sidlgata V. Sreenivasan , Ian M. McMackin , Pankaj B. Lad
发明人： Byung-Jin Choi , Sidlgata V. Sreenivasan , Ian M. McMackin , Pankaj B. Lad
IPC分类号： B29C33/18
CPC分类号： G03F7/70875 , B29C33/20 , B29C43/003 , B29C43/021 , B29C43/36 , B29C43/58 , B29C2043/025 , B29C2043/3233 , B29C2043/3488 , B29C2043/5841 , B29D11/00365 , G03B27/62 , G03F7/707
摘要： The present invention is directed towards a system for expelling a gas positioned between a substrate and a mold, the substrate and the mold further having a liquid positioned therebetween.
摘要翻译：本发明涉及一种用于排出位于基底和模具之间的气体的系统，所述基底和模具进一步具有位于其间的液体。

4. 发明授权

US07691313B2 Method for expelling gas positioned between a substrate and a mold 有权
标题翻译：用于排出位于基底和模具之间的气体的方法
公开(公告)号：US07691313B2
公开(公告)日：2010-04-06
申请号：US11565393
申请日：2006-11-30
申请人： Byung-Jin Choi , Sidlgata V. Sreenivasan , Ian M. McMackin , Pankaj B. Lad
发明人： Byung-Jin Choi , Sidlgata V. Sreenivasan , Ian M. McMackin , Pankaj B. Lad
IPC分类号： B29D11/00
CPC分类号： G03F7/70875 , B29C33/20 , B29C43/003 , B29C43/021 , B29C43/36 , B29C43/58 , B29C2043/025 , B29C2043/3233 , B29C2043/3488 , B29C2043/5841 , B29D11/00365 , G03B27/62 , G03F7/707
摘要： The present invention is directed towards a method and a system of expelling a gas positioned between a substrate and a mold, the substrate and the mold further having a liquid positioned therebetween.
摘要翻译：本发明涉及排出位于基底和模具之间的气体的方法和系统，所述基底和模具进一步具有位于其间的液体。

5. 发明授权

US08282383B2 Method for expelling gas positioned between a substrate and a mold 有权
标题翻译：用于排出位于基底和模具之间的气体的方法
公开(公告)号：US08282383B2
公开(公告)日：2012-10-09
申请号：US12707345
申请日：2010-02-17
申请人： Byung-Jin Choi , Sidlgata V. Sreenivasan , Ian Matthew McMackin , Pankaj B. Lad
发明人： Byung-Jin Choi , Sidlgata V. Sreenivasan , Ian Matthew McMackin , Pankaj B. Lad
IPC分类号： B29D11/00
CPC分类号： G03F7/70875 , B29C33/20 , B29C43/003 , B29C43/021 , B29C43/36 , B29C43/58 , B29C2043/025 , B29C2043/3233 , B29C2043/3488 , B29C2043/5841 , B29D11/00365 , G03B27/62 , G03F7/707
摘要： The present invention is directed towards a system for expelling a gas positioned between a substrate and a mold, the substrate and the mold further having a liquid positioned therebetween.
摘要翻译：本发明涉及一种用于排出位于基底和模具之间的气体的系统，所述基底和模具进一步具有位于其间的液体。

6. 发明授权

US08850980B2 Tessellated patterns in imprint lithography 有权
标题翻译：压印光刻中的镶嵌图案
公开(公告)号：US08850980B2
公开(公告)日：2014-10-07
申请号：US11694612
申请日：2007-03-30
申请人： Sidlgata V. Sreenivasan , Philip D. Schumaker , Ian M. McMackin
发明人： Sidlgata V. Sreenivasan , Philip D. Schumaker , Ian M. McMackin
IPC分类号： B29C59/02 , H01L21/02 , G03F9/00 , B82Y40/00 , G03F7/00 , G03B27/42 , G03B27/62 , B82Y10/00
CPC分类号： G03B27/62 , B82Y10/00 , B82Y40/00 , G03B27/42 , G03F7/0002 , G03F9/00 , G03F9/7042 , G03F9/7076 , G03F9/7084
摘要： The present invention is directed towards a choice of the shape of the patterned fields for Level 0 (patterned by imprint or photolithography or e-beam, etc.) and Level 1 (patterned by imprint) such that these shapes when tessellated together eliminate the open areas causes by the moats.
摘要翻译：本发明涉及用于0级（通过压印或光刻或电子束等图案化）和1级（通过印记图案化）的图案化场的形状的选择，使得这些形状在细分时一起消除开路地区由护城河引起。

7. 发明申请

US20100278954A1 Method of Concurrently Patterning a Substrate Having a Plurality of Fields and a Plurality of Alignment Marks 审中-公开
标题翻译：同时形成具有多个场和多个对准标记的基板的方法
公开(公告)号：US20100278954A1
公开(公告)日：2010-11-04
申请号：US12835018
申请日：2010-07-13
申请人： Sidlgata V. Sreenivasan , Ian M. McMackin , Christopher Mark Melliar-Smith , Byung-Jin Choi
发明人： Sidlgata V. Sreenivasan , Ian M. McMackin , Christopher Mark Melliar-Smith , Byung-Jin Choi
IPC分类号： B28B11/08
CPC分类号： B29C43/021 , B29C43/003 , B29C43/58 , B29C2043/025 , B29C2043/142 , B29C2043/5825 , B82Y10/00 , B82Y40/00 , G03F7/0002 , G03F9/703 , G03F9/7042 , G03F9/7076 , G03F9/708 , G03F9/7084 , Y10S977/887
摘要： Imprint lithography templates for patterning substrates are described. The templates include a section having a mold a first pattern of alignment forming areas and template alignment marks. The additional sections are generally devoid of a mold. One or more of the additional section may include the first pattern of a second pattern of alignment forming areas and template alignment marks. The second pattern may correspond to the first pattern.
摘要翻译：描述用于图案化基板的印刷光刻模板。模板包括具有模具的部分，其具有对准形成区域的第一图案和模板对准标记。附加部分通常没有模具。附加部分中的一个或多个可以包括对准形成区域和模板对准标记的第二图案的第一图案。第二图案可以对应于第一图案。

8. 发明授权

US07491637B2 Formation of conductive templates employing indium tin oxide 有权
标题翻译：使用氧化铟锡形成导电模板
公开(公告)号：US07491637B2
公开(公告)日：2009-02-17
申请号：US11470829
申请日：2006-09-07
申请人： Sidlgata V. Sreenivasan , Ian M. McMackin , Byung-Jin Choi , Ronald D. Voisin
发明人： Sidlgata V. Sreenivasan , Ian M. McMackin , Byung-Jin Choi , Ronald D. Voisin
IPC分类号： H01L21/4763
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , C03C17/3417 , C03C2217/77 , C03C2218/31 , C03C2218/328
摘要： The present invention is directed to a method forming conductive templates that includes providing a substrate; forming a mesa on the substrate; and forming a plurality of recessions and projections on the mesa with a nadir of the recessions comprising electrically conductive material and the projections comprising electrically insulative material. It is desired that the mesa be substantially transparent to a predetermined wavelength of radiation, for example ultraviolet radiation. As a result, it is desired to form the electrically conductive material from a material that allows ultraviolet radiation to propagate therethrough. In the present invention indium tin oxide is a suitable material from which to form the electrical conductive material.
摘要翻译：本发明涉及一种形成导电模板的方法，其包括提供衬底; 在基板上形成台面; 以及在所述台面上形成多个凹陷和突出部，其中所述凹陷的最低点包括导电材料，并且所述突起包括电绝缘材料。期望台面对于预定波长的辐射例如紫外线辐射基本上是透明的。结果，期望由允许紫外线辐射传播的材料形成导电材料。在本发明中，氧化铟锡是形成导电材料的合适材料。

9. 发明授权

US07780893B2 Method of concurrently patterning a substrate having a plurality of fields and a plurality of alignment marks 有权
标题翻译：同时构图具有多个场的衬底和多个对准标记的方法
公开(公告)号：US07780893B2
公开(公告)日：2010-08-24
申请号：US11695850
申请日：2007-04-03
申请人： Sidlgata V. Sreenivasan , Ian M. McMackin , Christopher Mark Melliar-Smith , Byung-Jin Choi
发明人： Sidlgata V. Sreenivasan , Ian M. McMackin , Christopher Mark Melliar-Smith , Byung-Jin Choi
IPC分类号： B28B11/08
CPC分类号： B29C43/021 , B29C43/003 , B29C43/58 , B29C2043/025 , B29C2043/142 , B29C2043/5825 , B82Y10/00 , B82Y40/00 , G03F7/0002 , G03F9/703 , G03F9/7042 , G03F9/7076 , G03F9/708 , G03F9/7084 , Y10S977/887
摘要： A method of patterning a substrate comprising first and second fields with a template, the template having a mold and a plurality of alignment forming areas and a plurality of template alignment marks, the method comprising: positioning a material on the first field of the substrate and a plurality of regions of the substrate, the plurality of regions laying outside of the first and second fields; positioning the mold and the substrate such that a desired spatial relationship between the mold and the first field of the substrate is obtained to define a pattern in the material on the first field of the substrate while concurrently defining a plurality of substrate alignment marks with the material in the plurality of regions of the substrate in superimposition with the plurality of alignment forming areas of the template; positioning a material on the second field of the substrate; and positioning the mold and the substrate to obtain a desired spatial relationship between the plurality of template alignment marks and the plurality of substrate alignment marks such that a desired spatial relationship between the mold and the second field of the substrate is obtained to define a pattern in the material on the second field of the substrate.
摘要翻译：一种使用模板构图包括第一场和第二场的衬底的方法，所述模板具有模具和多个对准形成区域和多个模板对准标记，所述方法包括：将材料定位在所述衬底的第一场上，以及所述基板的多个区域，所述多个区域布置在所述第一和第二场外; 定位模具和基板，使得获得模具和基板的第一场之间的期望的空间关系，以在基板的第一场上的材料中限定图案，同时用材料限定多个基板对准标记在与所述模板的所述多个对准形成区域重叠的所述基板的所述多个区域中; 将材料定位在基板的第二场上; 并且定位所述模具和所述基板以获得所述多个模板对准标记与所述多个基板对准标记之间的期望的空间关系，使得获得所述模具和所述基板的所述第二场之间的期望的空间关系，以限定所述模板衬底的第二场上的材料。

10. 发明授权

US07635445B2 Method of separating a mold from a solidified layer disposed on a substrate 有权
标题翻译：从设置在基板上的凝固层分离模具的方法
公开(公告)号：US07635445B2
公开(公告)日：2009-12-22
申请号：US11108208
申请日：2005-04-18
申请人： Byung-Jin Choi , Anshuman Cherala , Yeong-jun Choi , Mario J. Meissl , Sidlgata V. Sreenivasan , Norman E. Schumaker , Xiaoming Lu , Ian M. McMackin , Daniel A. Babbs
发明人： Byung-Jin Choi , Anshuman Cherala , Yeong-jun Choi , Mario J. Meissl , Sidlgata V. Sreenivasan , Norman E. Schumaker , Xiaoming Lu , Ian M. McMackin , Daniel A. Babbs
IPC分类号： H01L21/31 , H01L21/469
CPC分类号： H01L21/6875 , B82Y10/00 , B82Y40/00 , G03F7/0002 , H01L21/6838 , Y10S977/887
摘要： The present invention is directed towards a method of separating a mold, included in a template, from a layer disposed on a substrate, the method including, inter alia, applying a separation force to the template to separate the template from the layer; and facilitating localized deformation in the substrate to reduce the separation force required to achieve separation.
摘要翻译：本发明涉及一种将包含在模板中的模具与设置在基板上的层分离的方法，该方法尤其包括向模板施加分离力以将模板与层分离; 并且促进基板中的局部变形以减小实现分离所需的分离力。

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