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1. 发明授权

US06390439B1 Hybrid molds for molten solder screening process 有权
公开(公告)号：US06390439B1
公开(公告)日：2002-05-21
申请号：US09287370
申请日：1999-04-07
申请人： Steven A. Cordes , David Hirsch Danovitch , Peter Alfred Gruber , James Louis Speidell , Joseph Peter Zinter
发明人： Steven A. Cordes , David Hirsch Danovitch , Peter Alfred Gruber , James Louis Speidell , Joseph Peter Zinter
IPC分类号： B29C3300
CPC分类号： B23K3/0623 , B23K3/0638 , B23K2101/40 , H05K3/3457 , Y10T156/10
摘要： Hybrid molds for molding a multiplicity of solder balls for use in a molten solder screening process and methods for preparing such molds are disclosed. A method for forming the multiplicity of cavities in a pyramidal shape by anisotropically etching a crystalline silicon substrate along a specific crystallographic plane is utilized to form a crystalline silicon face plate used in the present invention hybrid mold. In a preferred embodiment, a silicon face plate is bonded to a borosilicate glass backing plate by adhesive means in a method that ensures coplanarity is achieved between the top surfaces of the silicon face plate and the glass backing plate. In an alternate embodiment, an additional glass frame is used for bonding a silicon face plate to a glass backing plate, again with ensured coplanarity between the top surfaces of the silicon face plate and the glass frame. In a second alternate embodiment, a silicon face plate is encased in an extender material which may be borosilicate glass or a polymer. The encasing is performed on a leveling fixture such that the top surface of the silicon face plate and the top surface of the extender material after solidification are perfectly leveled.

2. 发明授权

US06832747B2 Hybrid molds for molten solder screening process 失效
标题翻译：熔融焊料筛选工艺的混合模具
公开(公告)号：US06832747B2
公开(公告)日：2004-12-21
申请号：US10128210
申请日：2002-04-23
申请人： Steven A. Cordes , David Hirsch Danovitch , Peter Alfred Gruber , James Louis Speidell , Joseph Peter Zinter
发明人： Steven A. Cordes , David Hirsch Danovitch , Peter Alfred Gruber , James Louis Speidell , Joseph Peter Zinter
IPC分类号： B29C3300
CPC分类号： B23K3/0623 , B23K3/0638 , B23K2101/40 , H05K3/3457 , Y10T156/10
摘要： Hybrid molds for molding a multiplicity of solder balls for use in a molten solder screening process and methods for preparing such molds are disclosed. A method for forming the multiplicity of cavities in a pyramidal shape by anisotropically etching a crystalline silicon substrate along a specific crystallographic plane is utilized to form a crystalline silicon face plate used in the present invention hybrid mold. In a preferred embodiment, a silicon face plate is bonded to a borosilicate glass backing plate by adhesive means in a method that ensures coplanarity is achieved between the top surfaces of the silicon face plate and the glass backing plate. In an alternate embodiment, an additional glass frame is used for bonding a silicon face plate to a glass backing plate, again with ensured coplanarity between the top surfaces of the silicon face plate and the glass frame. In a second alternate embodiment, a silicon face plate is encased in an extender material which may be borosilicate glass or a polymer. The encasing is performed on a leveling fixture such that the top surface of the silicon face plate and the top surface of the extender material after solidification are perfectly leveled.
摘要翻译：公开了用于模制用于熔融焊料筛选过程的多个焊球的混合模具和用于制备这种模具的方法。利用用于通过沿着特定结晶平面各向异性蚀刻晶体硅衬底而形成金字塔形状的多个空腔的方法来形成本发明混合模具中使用的结晶硅面板。在一个优选的实施例中，硅面板通过粘合方法以一种确保在硅面板和玻璃背板的顶表面之间实现共面性的方法结合到硼硅酸盐玻璃背板上。在替代实施例中，另外的玻璃框架用于将硅面板粘合到玻璃背板，再次确保硅面板的顶表面和玻璃框架之间的共面性。在第二替代实施例中，硅面板封装在可以是硼硅酸盐玻璃或聚合物的增量材料中。在平整装置上进行包装，使得硅面板的顶表面和固化后的增量材料的顶表面完美平整。

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