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    • 1. 发明申请
    • Systems and methods for mitigating variances on a patterned wafer using a prediction model
    • 使用预测模型减轻图案化晶片上的方差的系统和方法
    • US20060240336A1
    • 2006-10-26
    • US11394900
    • 2006-03-31
    • Sterling WatsonAdy LevyChris MackStanley StokowskiZain Saidin
    • Sterling WatsonAdy LevyChris MackStanley StokowskiZain Saidin
    • G06F17/50G03F1/00
    • G03F1/84G03F1/36Y10S430/146
    • Disclosed are systems and methods for mitigating variances (e.g., critical dimension variances) on a patterned wafer are provided. In general, variances of a patterned wafer are predicted using one or more reticle fabrication and/or wafer processing models. The predicted variances are used to modify selected transparent portions of the reticle that is to be used to produce the patterned wafer. In a specific implementation, an optical beam, such as a femto-second laser, is applied to the reticle at a plurality of embedded positions, and the optical beam is configured to form specific volumes of altered optical properties within the transparent material of the reticle at the specified positions. These reticle volumes that are created at specific positions of the reticle result in varying amounts of light transmission or dose through the reticle at such specific positions so as to mitigate the identified variances on a wafer that is patterned using the modified reticle.
    • 公开了用于减轻图案化晶片上的方差(例如,临界尺寸方差)的系统和方法。 通常,使用一个或多个掩模版制造和/或晶片处理模型预测图案化晶片的变化。 预测的方差用于修改用于产生图案化晶片的掩模版的所选透明部分。 在具体实现中,诸如毫微微秒激光器的光束在多个嵌入位置被施加到掩模版,并且光束被配置为在掩模版的透明材料内形成改变的光学特性的特定体积 在指定位置。 在掩模版的特定位置处产生的这些掩模版体积在这样的特定位置处导致通过掩模版的光透射或剂量的变化量,以便减轻使用修改的掩模版图案化的晶片上识别的方差。
    • 4. 发明申请
    • Method for determining and correcting reticle variations
    • 确定和校正标线差异的方法
    • US20060234145A1
    • 2006-10-19
    • US11394177
    • 2006-03-29
    • Sterling WatsonAdy LevyChris MackStanley StokowskiZain Saidin
    • Sterling WatsonAdy LevyChris MackStanley StokowskiZain Saidin
    • G03F1/00G03C5/00G06K9/00
    • G03F1/84Y10S430/146
    • Disclosed are techniques for determining and correcting reticle variations using a reticle global variation map generated by comparing a set of measured reticle parameters to a set of reference reticle parameters. The measured reticle parameters are obtained by reticle inspection, and the variation map identifies reticle regions and associated levels of correction. In one embodiment, the variation data is communicated to a system which modifies the reticle by embedding scattering centers within the reticle at identified reticle regions, thereby improving the variations. In another embodiment the variation data is transferred to a wafer stepper or scanner which in turn modifies the conditions under which the reticle is used to manufacture wafers, thereby compensating for the variations and producing wafers that are according to design.
    • 公开了用于使用通过将测量的标线参数的集合与一组参考掩模版参数进行比较而生成的光罩全局变化图来确定和校正光罩变化的技术。 通过掩模版检查获得测量的掩模版参数,并且变化图识别标线区域和相关联的校正水平。 在一个实施例中,将变化数据传送到通过在标定的标线区域内的散射中心嵌入来修改掩模版的系统,从而改善变化。 在另一个实施例中,变化数据被传送到晶片步进器或扫描器,该晶片步进器或扫描器又改变了使用掩模版制造晶片的条件,从而补偿了根据设计的变化和生产晶片。
    • 5. 发明申请
    • System and method for determining reticle defect printability
    • 用于确定掩模版缺陷可印刷性的系统和方法
    • US20070140548A1
    • 2007-06-21
    • US11603536
    • 2006-11-22
    • Anthony VaccaThomas VavulDonald ParkerZain SaidinSterling WatsonJames Wiley
    • Anthony VaccaThomas VavulDonald ParkerZain SaidinSterling WatsonJames Wiley
    • G06K9/00
    • G06K9/00G01N21/95607G03F1/84G06K2209/19
    • A method and software program for determining printability of a defect on a reticle or photomask onto a substrate during processing. That is performed by creating a pixel grid image having a plurality of individual pixel images showing the defect. A gray scale value is assigned to each pixel image of the pixel grid image and a probable center pixel of the defect is selected. Then the polarity of the defect is determined, with a coarse center pixel of the defect optionally selected using the probable center defect and polarity of the defect. If a coarse center pixel is selected, then a fine center of the defect can optionally be selected from the coarse center pixel and polarity of the defect. From the center pixel the physical extent of the defect can be determined followed by the determination the transmissivity energy level of the physical extent of the defect. Optionally, the proximity of the defect to a pattern edge on the reticle or photomask can be determined using the physical extent and polarity of the defect. Then the printability of the defect can be determined from the transmissivity energy level of the defect and characteristics of the wafer fabrication process being used to produce the substrate from the reticle or photomask.
    • 一种用于在加工过程中确定掩模版或光掩模上的基板上的缺陷的可印刷性的方法和软件程序。 这是通过创建具有显示缺陷的多个单独像素图像的像素网格图像来执行的。 将灰度值分配给像素网格图像的每个像素图像,并且选择缺陷的可能的中心像素。 然后确定缺陷的极性,使用可能的中心缺陷和缺陷的极性任选地选择缺陷的粗略中心像素。 如果选择粗中心像素,则可以可选地从缺陷的粗中心像素和极性中选择缺陷的精细中心。 从中心像素可以确定缺陷的物理范围,然后确定缺陷的物理范围的透射能级。 可选地,可以使用缺陷的物理范围和极性来确定缺陷与掩模版或光掩模上的图案边缘的接近度。 然后,可以从缺陷的透射能级和用于从掩模版或光掩模制造衬底的晶片制造工艺的特性确定缺陷的可印刷性。
    • 6. 发明申请
    • System and method for determining reticle defect printability
    • 用于确定掩模版缺陷可印刷性的系统和方法
    • US20050140970A1
    • 2005-06-30
    • US11067179
    • 2005-02-25
    • Anthony VaccaThomas VavulDonald ParkerZain SaidinSterling WatsonJames Wiley
    • Anthony VaccaThomas VavulDonald ParkerZain SaidinSterling WatsonJames Wiley
    • G01N21/956G01N21/00
    • G06K9/00G01N21/95607G03F1/84G06K2209/19
    • A method and software program for determining printability of a defect on a reticle or photomask onto a substrate during processing. That is performed by creating a pixel grid image having a plurality of individual pixel images showing the defect. A gray scale value is assigned to each pixel image of the pixel grid image and a probable center pixel of the defect is selected. Then the polarity of the defect is determined, with a coarse center pixel of the defect optionally selected using the probable center defect and polarity of the defect. If a coarse center pixel is selected, then a fine center of the defect can optionally be selected from the coarse center pixel and polarity of the defect. From the center pixel the physical extent of the defect can be determined followed by the determination the transmissivity energy level of the physical extent of the defect. Optionally, the proximity of the defect to a pattern edge on the reticle or photomask can be determined using the physical extent and polarity of the defect. Then the printability of the defect can be determined from the transmissivity energy level of the defect and characteristics of the wafer fabrication process being used to produce the substrate from the reticle or photomask.
    • 一种用于在加工过程中确定掩模版或光掩模上的基板上的缺陷的可印刷性的方法和软件程序。 这是通过创建具有显示缺陷的多个单独像素图像的像素网格图像来执行的。 将灰度值分配给像素网格图像的每个像素图像,并且选择缺陷的可能的中心像素。 然后确定缺陷的极性,使用可能的中心缺陷和缺陷的极性任选地选择缺陷的粗略中心像素。 如果选择粗中心像素,则可以可选地从缺陷的粗中心像素和极性中选择缺陷的精细中心。 从中心像素可以确定缺陷的物理范围,然后确定缺陷的物理范围的透射能级。 可选地,可以使用缺陷的物理范围和极性来确定缺陷与掩模版或光掩模上的图案边缘的接近度。 然后,可以从缺陷的透射能级和用于从掩模版或光掩模制造衬底的晶片制造工艺的特性确定缺陷的可印刷性。