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    • 3. 发明申请
    • METHOD FOR FORMING CERAMIC THICK FILM ELEMENT ARRAYS
    • 形成陶瓷厚膜元件阵列的方法
    • US20060130956A1
    • 2006-06-22
    • US11017325
    • 2004-12-20
    • Stephen WhiteBaomin Xu
    • Stephen WhiteBaomin Xu
    • C03B29/00B32B37/00
    • H01L27/20H01L41/313H01L41/43
    • An improved process for producing ceramic thick film array elements is provided. In this regard, ceramic elements are formed on a temporary, or printing, substrate by screen printing or other forming methods. The temporary, or printing, substrate is advantageously provided with a release layer. This makes it possible to release the printed and soft-baked ceramic elements from the temporary substrate and transfer the ceramic elements to the sintering substrate. The contemplated release technique takes advantage of the phase transition of a liquid, e.g. water, to transfer the elements to a sintering substrate. After sintering and electrode deposition, the ceramic element array is bonded to a target substrate. Then, the sintering substrate is removed to make the array available for implementation in a variety of suitable environments.
    • 提供了一种制备陶瓷厚膜阵列元件的改进方法。 在这方面,通过丝网印刷或其它成形方法在临时或印刷基板上形成陶瓷元件。 临时或印刷衬底有利地设置有释放层。 这使得可以从临时衬底释放印刷和软烘烤的陶瓷元件并将陶瓷元件转移到烧结衬底。 预期的释放技术利用液体的相变,例如, 水,以将元件转移到烧结基底。 在烧结和电极沉积之后,将陶瓷元件阵列结合到目标衬底。 然后,去除烧结衬底以使阵列可用于在各种合适的环境中实现。