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    • 3. 发明授权
    • Mechanical loading of a land grid array component using a wave spring
    • 使用波形弹簧对地面阵列部件进行机械加载
    • US06430050B1
    • 2002-08-06
    • US09872194
    • 2001-05-31
    • James David HensleyStephen Daniel CromwellGregory S. Meyer
    • James David HensleyStephen Daniel CromwellGregory S. Meyer
    • H05K720
    • H01L23/40H01L23/4006H01L2023/405H01L2023/4081H01L2924/0002Y10T29/4913H01L2924/00
    • A method and substrate using a wave spring to clamp a component to the substrate. One embodiment of the invention involves a method to use a wave spring to clamp a component to a substrate. The method includes placing the component on the substrate, placing a structure having holes on the component, placing a number of wave springs on a corresponding number of bolts, inserting the bolts into the holes in the structure, and attaching the bolts to the substrate. A second embodiment of the invention involves a substrate with an electrical contact area, an interposer placed on the electrical contact area, a component placed on the interposer, a block having holes placed on the component, bolts and wave springs inserted in the holes, wherein the bolts and wave springs clamp the component, the interposer and the substrate together on the electrical contact area of the substrate.
    • 使用波形弹簧将部件夹持到基板的方法和基板。 本发明的一个实施例涉及使用波形弹簧来将部件夹持到基底的方法。 该方法包括将部件放置在基板上,将具有孔的结构放置在部件上,将多个波形弹簧放置在相应数量的螺栓上,将螺栓插入结构中的孔中,并将螺栓附接到基板。 本发明的第二个实施例涉及具有电接触面积的基板,放置在电接触区域上的插入件,放置在插入件上的部件,插入在部件上的孔,插入孔中的螺栓和波形弹簧的块,其中 螺栓和波形弹簧将部件,插入器和基板一起夹在基板的电接触区域上。