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1. 发明申请

US20060076918A1 Servo system for a two-dimensional micro-electromechanical system (MEMS)-based scanner and method therefor 有权
公开(公告)号：US20060076918A1
公开(公告)日：2006-04-13
申请号：US11240833
申请日：2005-10-03
申请人： Sri Sri-Jayantha , Hien Dang , Arun Sharma , Evangelos Eleftheriou , Mark Lantz , Charalampos Pozidis
发明人： Sri Sri-Jayantha , Hien Dang , Arun Sharma , Evangelos Eleftheriou , Mark Lantz , Charalampos Pozidis
IPC分类号： G05B1/06
CPC分类号： G11B7/0901 , G11B7/08505 , G11B7/0941
摘要： A servo control system micro-electromechanical systems (MEMS)-based motion control system (and method therefor), includes a motion generator having an inherent stiffness component.

2. 发明申请

US20060082463A1 System and method for sensor replication for ensemble averaging in micro-electromechanical systems (MEMS) 有权
标题翻译：用于微机电系统（MEMS）中的集成平均的传感器复制的系统和方法
公开(公告)号：US20060082463A1
公开(公告)日：2006-04-20
申请号：US10968181
申请日：2004-10-20
申请人： Sri Sri-Jayantha , Arun Sharma , Hien Dang , Evangelos Eleftheriou , Mark Lantz , Charalampos Pozidis
发明人： Sri Sri-Jayantha , Arun Sharma , Hien Dang , Evangelos Eleftheriou , Mark Lantz , Charalampos Pozidis
IPC分类号： G08B21/00
CPC分类号： G01D3/08 , G01K2215/00
摘要： A MEMs-based system (and method), includes a sensor array including at least two sensors providing a basis for ensemble averaging.
摘要翻译：基于MEM的系统（和方法）包括传感器阵列，其包括至少两个传感器，为集合平均提供基础。

3. 发明申请

US20070069679A1 Servo system for a two-dimensional micro-electromechanical system (MEMS)-based scanner and method therefor 有权
标题翻译：用于二维微机电系统（MEMS）的扫描仪及其方法的伺服系统
公开(公告)号：US20070069679A1
公开(公告)日：2007-03-29
申请号：US11515910
申请日：2006-09-06
申请人： Sri Sri-Jayantha , Hien Dang , Arun Sharma , Evangelos Eleftheriou , Mark Lantz , Charalampos Pozidis
发明人： Sri Sri-Jayantha , Hien Dang , Arun Sharma , Evangelos Eleftheriou , Mark Lantz , Charalampos Pozidis
IPC分类号： G05B19/33
CPC分类号： G11B7/0901 , G11B7/08505 , G11B7/0941
摘要： A servo control system micro-electromechanical systems (MEMS)-based motion control system (and method therefor), includes a motion generator having an inherent stiffness component.
摘要翻译：基于微机电系统（MEMS）的运动控制系统（及其方法）包括具有固有刚度分量的运动发生器。

4. 发明申请

US20060013281A1 Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit 有权
标题翻译：用于实时估计和预测微处理器单元的热状态的方法和系统
公开(公告)号：US20060013281A1
公开(公告)日：2006-01-19
申请号：US10892211
申请日：2004-07-16
申请人： Sri Sri-Jayantha , Hien Dang , Arun Sharma
发明人： Sri Sri-Jayantha , Hien Dang , Arun Sharma
IPC分类号： G01K7/00
CPC分类号： G06F1/206
摘要： A method (and system) of predicting a thermal state of a transient thermal system, includes combining sensor outputs and thermal parameters to construct a consistent set of estimates of internal temperature of a transient thermal system.
摘要翻译：预测瞬态热系统的热状态的方法（和系统）包括组合传感器输出和热参数以构成瞬态热系统内部温度的一致性估计集合。

5. 发明申请

US20080064143A1 Microelectronic Devices and Methods 有权
标题翻译：微电子器件与方法
公开(公告)号：US20080064143A1
公开(公告)日：2008-03-13
申请号：US11932793
申请日：2007-10-31
申请人： Sri Sri-Jayantha , Gareth Hougham , Sung Kang , Lawrence Mok , Hien Dang , Arun Sharma
发明人： Sri Sri-Jayantha , Gareth Hougham , Sung Kang , Lawrence Mok , Hien Dang , Arun Sharma
IPC分类号： H01L21/00
CPC分类号： H01L23/552 , H01L23/3677 , H01L2924/0002 , H01L2924/00
摘要： A microelectronic device is made of a semiconductor substrate, a heat generating component in a layer thereof, and a body within the remaining semiconductor substrate. The body is made of materials which have a high thermal inertia and/or thermal conductivity. When high thermal conductivity materials are used, the body acts to transfer the heat away from the substrate to a heat sink.
摘要翻译：微电子器件由半导体衬底，其一层中的发热元件和剩余半导体衬底内的主体构成。主体由具有高热惯性和/或导热性的材料制成。当使用高导热性材料时，主体用于将热量从基板转移到散热器。

6. 发明申请

US20080059775A1 INSTRUCTION SET WITH THERMAL OPCODE FOR HIGH-PERFORMANCE MICROPROCESSOR, MICROPROCESSOR, AND METHOD THEREFOR 失效
标题翻译：具有高性能微处理器，微处理器及其方法的热操作码的指令集
公开(公告)号：US20080059775A1
公开(公告)日：2008-03-06
申请号：US11933910
申请日：2007-11-01
申请人： Hien Dang , Arun Sharma , Sri Sri-Jayantha
发明人： Hien Dang , Arun Sharma , Sri Sri-Jayantha
IPC分类号： G06F9/302
CPC分类号： G06F9/30181 , G06F1/206 , G06F9/30083 , G06F9/30145 , G06F9/30167 , G06F9/383 , G06F9/3885 , Y02D10/16
摘要： A method (and system) of managing heat in an electrical circuit, includes using a thermal instruction appended to an instruction to be processed to determine a heat load associated with the instruction.
摘要翻译：一种在电路中管理热量的方法（和系统）包括使用附加到要处理的指令的热指令来确定与指令相关联的热负荷。

7. 发明申请

US20060101289A1 Instruction set with thermal opcode for high-performance microprocessor, microprocessor, and method therefor 有权
标题翻译：用于高性能微处理器，微处理器及其方法的热操作码指令集
公开(公告)号：US20060101289A1
公开(公告)日：2006-05-11
申请号：US10981473
申请日：2004-11-05
申请人： Hien Dang , Arun Sharma , Sri Sri-Jayantha
发明人： Hien Dang , Arun Sharma , Sri Sri-Jayantha
IPC分类号： G06F1/30
CPC分类号： G06F9/30181 , G06F1/206 , G06F9/30083 , G06F9/30145 , G06F9/30167 , G06F9/383 , G06F9/3885 , Y02D10/16
摘要： A method (and system) of managing heat in an electrical circuit, includes using a thermal instruction appended to an instruction to be processed to determine a heat load associated with the instruction.
摘要翻译：一种在电路中管理热量的方法（和系统）包括使用附加到要处理的指令的热指令来确定与指令相关联的热负荷。

8. 发明授权

US06707207B1 High bandwidth track following actuator for hard disk drives 失效
标题翻译：用于硬盘驱动器的高带宽跟踪执行器
公开(公告)号：US06707207B1
公开(公告)日：2004-03-16
申请号：US10324337
申请日：2002-12-19
申请人： Vijayeshwar D. Khanna , Hien Dang , Arun Sharma , Sri Sri-Jayantha
发明人： Vijayeshwar D. Khanna , Hien Dang , Arun Sharma , Sri Sri-Jayantha
IPC分类号： H02K1602
CPC分类号： H02K7/09 , G11B5/4813 , G11B21/083 , H02K7/083
摘要： A motor for incorporation in an actuator pivot includes a coil disk, an upper magnet-yoke disk, and a lower magnet-yoke disk. The coil disk is attached to the pivot shaft to form a shaft-coil assembly. The coil disk includes a plurality of coils, each placed orthogonally to the axis of the shaft. Each coil is configured to receive an electrical current in a first direction. A second coil located diametrically opposite to the first coil is configured to receive a second electrical current in a second direction so that the coils generate a torque with a net resultant linear force being substantially equal to zero. The first magnet-yoke disk, for mounting relative to the shaft at a location above the coil disk so that the first magnet-yoke disk rotates with respect to the coil disk, the magnet-yoke ring comprising at least one magnet, aligned in a first direction, and a respective plurality of yokes, each yoke for holding at least one magnet such that magnetic lines of flux are generated parallel to the axis. The second magnet-yoke disk is mounted relative to the shaft at a location below the coil disk so that the second magnet-yoke disk rotates with respect to the coil disk. The second magnet-yoke disk comprising a plurality of magnets, aligned in a direction opposite from the first direction, and a respective plurality of yokes, each yoke for holding a magnet such that magnetic lines of flux are generated parallel to the axis.
摘要翻译：用于结合在致动器枢轴中的电动机包括线圈盘，上磁轭和上磁轭。线圈盘连接到枢轴以形成轴线圈组件。线圈盘包括多个线圈，每个线圈与轴的轴线正交放置。每个线圈被配置为在第一方向上接收电流。位于与第一线圈径向相对的第二线圈被配置为在第二方向上接收第二电流，使得线圈产生具有基本上等于零的净合成线性力的转矩。第一磁轭盘，用于在线圈盘上方的位置处相对于轴安装，使得第一磁轭盘相对于线圈盘旋转，磁轭环包括至少一个磁体，第一方向和相应的多个轭，每个磁轭用于保持至少一个磁体，使得平行于该轴产生磁通的磁线。第二磁轭盘相对于轴安装在线圈盘下方的位置，使得第二磁轭盘相对于线圈盘旋转。第二磁轭盘包括沿与第一方向相反的方向排列的多个磁体和相应的多个磁轭，每个磁轭用于保持磁体，使磁通的磁线平行于该轴产生。

9. 发明申请

US20060081979A1 Thermal properties for microelectronic devices 有权
标题翻译：微电子器件的热性能
公开(公告)号：US20060081979A1
公开(公告)日：2006-04-20
申请号：US10966202
申请日：2004-10-15
申请人： Sri Sri-Jayantha , Gareth Hougham , Sung Kang , Lawrence Mok , Hien Dang , Arun Sharma
发明人： Sri Sri-Jayantha , Gareth Hougham , Sung Kang , Lawrence Mok , Hien Dang , Arun Sharma
IPC分类号： H01L23/34
CPC分类号： H01L23/552 , H01L23/3677 , H01L2924/0002 , H01L2924/00
摘要： A microelectronic device is made of a semiconductor substrate, a heat generating component in a layer thereof, and a body within the remaining semiconductor substrate. The body is made of materials which have a high thermal inertia and/or thermal conductivity. When high thermal conductivity materials are used, the body acts to transfer the heat away from the substrate to a heat sink.
摘要翻译：微电子器件由半导体衬底，其一层中的发热元件和剩余半导体衬底内的主体构成。主体由具有高热惯性和/或导热性的材料制成。当使用高导热性材料时，主体用于将热量从基板转移到散热器。

10. 发明申请

US20080059774A1 INSTRUCTION SET WITH THERMAL OPCODE FOR HIGH-PERFORMANCE MICROPROCESSOR, MICROPROCESSOR, AND METHOD THEREFOR 失效
公开(公告)号：US20080059774A1
公开(公告)日：2008-03-06
申请号：US11933893
申请日：2007-11-01
申请人： Hien Dang , Arun Sharma , Sri Sri-Jayantha
发明人： Hien Dang , Arun Sharma , Sri Sri-Jayantha
IPC分类号： G06F7/44
CPC分类号： G06F9/30181 , G06F1/206 , G06F9/30083 , G06F9/30145 , G06F9/30167 , G06F9/383 , G06F9/3885 , Y02D10/16
摘要： A method (and system) of managing heat in an electrical circuit, includes using a thermal instruction appended to an instruction to be processed to determine a heat load associated with the instruction.

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