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    • 5. 发明申请
    • Compact multi-LED light source with improved heat dissipation
    • 紧凑型多LED光源,散热性能更好
    • US20070187701A1
    • 2007-08-16
    • US11357276
    • 2006-02-16
    • Wooi GoonEng OngMeng Lee
    • Wooi GoonEng OngMeng Lee
    • H01L33/00
    • H01L33/647H01L25/0753H01L33/62H01L2224/48091H01L2924/00012H01L2924/00014
    • A light source having a substrate having first and second surfaces is disclosed. The substrate has first and second conducting traces on the first surface. A heat conducting metallic layer is attached to the second surface. First and second LEDs are disposed on the first surface, each LED having first and second contacts for powering that LED. The first contact is connected to a corresponding one of the first and second conducting traces. First and second conducting vias are in contact with the first and second LEDs, respectively. The first and second conducting vias extend from the first surface through the substrate and contact the heat conducting metallic layer. The second contacts of the first and second LEDs are electrically connected to the first and second conducting vias, respectively. The LEDs are powered by applying potentials between the external terminals and the heat-conducting layer.
    • 公开了具有具有第一表面和第二表面的基底的光源。 衬底在第一表面上具有第一和第二导电迹线。 导热金属层附着到第二表面。 第一和第二LED设置在第一表面上,每个LED具有用于为该LED供电的第一和第二触点。 第一触点连接到第一和第二导电迹线中相应的一个。 第一和第二导电通孔分别与第一和第二LED接触。 第一和第二导电通孔从第一表面延伸通过基底并与导热金属层接触。 第一和第二LED的第二触点分别电连接到第一和第二导电通孔。 LED通过在外部端子和导热层之间施加电位来供电。
    • 8. 发明申请
    • Small package high efficiency illuminator design
    • 小包装高效照明器设计
    • US20060092644A1
    • 2006-05-04
    • US10975823
    • 2004-10-28
    • Thye MokMeng LeeChien LyeKheng Tan
    • Thye MokMeng LeeChien LyeKheng Tan
    • F21V5/00
    • H01L33/60H01L33/50H01L33/54
    • Disclosed are systems and methods which provide an illuminator configuration in which an optical element is provided integral with a reflector component. Embodiments provide an LED encapsulation optical element having a boundary with a surrounding medium, such as air, which avoids or minimizes total internal reflection phenomena. Such an LED encapsulation optical element is formed integral with a reflector component in order to ensure proper relative placement of the LED light source, optical element, and reflector component and/or to facilitate rapid and predictable mechanical assembly of an illuminator. Plated through holes may be disposed in a substrate beneath the LED light source to dissipate heat from the LED light source, prolonging the life of the LED light source and/or the encapsulation material.
    • 公开了提供照明器配置的系统和方法,其中光学元件与反射器部件一体地设置。 实施例提供了一种与周围介质(例如空气)具有边界的LED封装光学元件,其避免或最小化全内反射现象。 这种LED封装光学元件与反射器部件形成一体,以便确保LED光源,光学元件和反射器部件的适当的相对放置和/或促进照明器的快速和可预测的机械组装。 电镀通孔可以设置在LED光源下面的衬底中以散发来自LED光源的热量,延长LED光源和/或封装材料的寿命。