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    • 8. 发明授权
    • Narrow write head pole tip fabricated by sidewall processing
    • 通过侧壁加工制造的窄写头磁极尖端
    • US07127800B2
    • 2006-10-31
    • US10610970
    • 2003-06-30
    • Thomas Edward DinanRichard Hsiao
    • Thomas Edward DinanRichard Hsiao
    • G11B5/187C25D5/02
    • G11B5/3163G11B5/012G11B5/3116Y10T29/49043Y10T29/49044Y10T29/49046Y10T29/4906
    • The magnetic head includes a P2 pole tip in which the P2 pole tip material is electroplated upon a sidewall of the P2 pole tip photolithographic trench. To accomplish this, a block of material is deposited upon a write gap layer, such that a generally straight, vertical sidewall of the block of material is disposed at the P2 pole tip location. Thereafter, an electroplating seed layer is deposited upon the sidewall. A P2 pole tip trench is photolithographically fabricated such that the sidewall (with its deposited seed layer) is exposed within the P2 pole tip trench. Thereafter, the P2 pole tip is formed by electroplating pole tip material upon the seed layer and outward from the sidewall within the trench. The width of the P2 pole tip is thus determined by the quantity of pole tip material that is deposited upon the sidewall.
    • 磁头包括P 2极尖端,其中P 2极尖端材料电镀在P 2极端光刻沟槽的侧壁上。 为了实现这一点,一块材料沉积在写间隙层上,使得材料块的大致直的垂直侧壁设置在P 2极尖端位置处。 此后,电镀种子层沉积在侧壁上。 光刻地制造P 2极端沟槽,使得侧壁(其沉积的种子层)暴露在P 2极尖端沟槽内。 此后,P 2极端部通过将电极端部材料电镀在种子层上并且从沟槽内的侧壁向外而形成。 因此,P 2极尖的宽度由沉积在侧壁上的极尖材料的量决定。
    • 9. 发明授权
    • Dual coil and lead connections fabricated by image transfer and selective etch
    • 通过图像传输和选择性蚀刻制造的双线圈和引线连接
    • US06507456B1
    • 2003-01-14
    • US09651149
    • 2000-08-30
    • Thomas Edward DinanRichard HsiaoEric James LeeScott A. MacDonald
    • Thomas Edward DinanRichard HsiaoEric James LeeScott A. MacDonald
    • G11B517
    • G11B5/17G11B5/313G11B5/3163
    • A magnetic head including a dual layer induction coil fabricated by reactive ion etching (RIE) techniques. An etch stop layer and an etchable insulation material layer and an induction coil etching mask are fabricated on a first magnetic pole. Induction coil trenches are thereafter RIE etched into the insulation material to the etch stop layer, and the first induction coil is fabricated into the induction coil trenches. Following a chemical mechanical polishing (CMP) step, a second etch stop layer, a second layer of etchable insulation material and a second induction coil etching mask are fabricated. Second induction coil trenches are RIE etched into the second insulation material layer to the second etch stop layer, and a second induction coil is fabricated into the second induction coil trenches. A second CMP step is followed by an insulation layer and the fabrication of a second magnetic pole (P2) upon the insulation layer.
    • 包括通过反应离子蚀刻(RIE)技术制造的双层感应线圈的磁头。 在第一磁极上制造蚀刻停止层和可蚀刻绝缘材料层和感应线圈蚀刻掩模。 此后,感应线圈沟槽RIE蚀刻到绝缘材料到蚀刻停止层,并且第一感应线圈被制造成感应线圈沟槽。 在化学机械抛光(CMP)步骤之后,制造第二蚀刻停止层,第二层可蚀刻绝缘材料和第二感应线圈蚀刻掩模。 将第二感应线圈沟槽RIE蚀刻到第二绝缘材料层到第二蚀刻停止层,并且将第二感应线圈制造成第二感应线圈沟槽。 第二CMP步骤之后是绝缘层,并且在绝缘层上制造第二磁极(P2)。