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    • 3. 发明专利
    • Area array terminal surface-mounted package reinforcing underfill sealant
    • 区域阵列表面安装包装加固密封件
    • JP2003007927A
    • 2003-01-10
    • JP2001183155
    • 2001-06-18
    • Somar Corpソマール株式会社
    • KAWANO TAKAYUKIWATANABE YUICHINAGASE RIHEI
    • C08K5/04C08G59/50C08L63/00H01L21/56H01L23/29H01L23/31
    • H01L2924/0002H01L2924/00
    • PROBLEM TO BE SOLVED: To provide are array terminal surface mounted package reinforcing underfill sealant which satisfies filling property, hardening property in a low temperature, the heat-resistant cycle property and heat resistance of a cured object with good balance and which is superior in preservation stability at an ordinary temperature. SOLUTION: Underfill sealant is filled in a gap between the area array terminal surface-mounted package of an electronic unit and a substrate, and it reinforces junction between them. Sealant is formed of one liquid epoxy resin component. In the component, (B) amine system latent hardener of 20 to 65 pts.mass and (C) at least one type of reactive diluent of 5 to 60 pts.mass selected from acrylic acid or methacrylic acid ester having oxygen containing saturated heterocyclic residue or polyalkylene oxide residue are mixed with respect to (A) liquid epoxy resin of 100 pts.mass.
    • 要解决的问题:提供一种满足填充性能,低温硬化性能,耐热循环性能和耐热性的阵列端子表面安装封装加强底部填充密封剂,其平衡性好,保存性优异 在常温下稳定。 解决方案:底部填充密封剂填充在电子单元的面阵列端子表面安装封装和基板之间的间隙中,并且它加强了它们之间的连接。 密封剂由一种液体环氧树脂组分形成。 在组分中,(B)胺体系潜在硬化剂为20-65重量%,(C)选自具有含氧饱和杂环残基的丙烯酸或甲基丙烯酸酯的至少一种类型的反应性稀释剂为5至60重量份 或聚环氧烷残基相对于(A)100磅/平方米的液体环氧树脂混合。
    • 5. 发明专利
    • Powder coating material, process for producing powder coating material and coating method
    • 粉末涂料,生产粉末涂料的方法和涂料方法
    • JP2008063521A
    • 2008-03-21
    • JP2006245442
    • 2006-09-11
    • Somar Corpソマール株式会社
    • WATANABE YUICHITSUNEKAWA KENJISASAKI FUMIYUKISAITO AKIRA
    • C09D5/03B05D7/24C09D201/00
    • PROBLEM TO BE SOLVED: To provide techniques related to a powder coating material that particularly decreases pinholes in a coating film and the amount of air bubbles present therein by improving the powder coating material from the aspect of its component material and at the same time fulfills the increase in the efficiency of coating processes and the reduction in coating thickness on a coated surface.
      SOLUTION: The powder coating material is formed so that the powder coating material has a particle size distribution in which there are at least two peaks of a first powder (20a, 20b, 20c) having a first peak and a second powder (30) having a second peak and the particle size in the first peak is 4 times or more different than that in the second peak. It is more preferable that the difference in the particle size between the first peak and the second peak is not more than 9 times; the first peak is present in the range of 5-80 μm; and the second peak is present in the range of 0.5-20 μm.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供与粉末涂料相关的技术,该粉末涂料通过从其组分材料和相同的方面改进粉末涂料而特别减少涂膜中的针孔和其中存在的气泡量 时间实现了涂布工艺的效率的提高和涂布表面上的涂层厚度的降低。 解决方案:粉末涂料形成为使得粉末涂料具有粒度分布,其中存在具有第一峰和第二粉末的第一粉末(20a,20b,20c)的至少两个峰( 30),第一峰的粒径比第二峰的4倍以上。 更优选的是,第一峰和第二峰之间的粒径差不超过9倍; 第一个峰存在于5-80μm的范围内; 并且第二峰存在于0.5-20μm的范围内。 版权所有(C)2008,JPO&INPIT
    • 7. 发明专利
    • Epoxy resin powder coating material for electronic parts and electronic parts using the same
    • 电子部件用环氧树脂粉末涂料及其电子部件
    • JP2010155893A
    • 2010-07-15
    • JP2008334295
    • 2008-12-26
    • Somar Corpソマール株式会社
    • WATANABE YUICHINEGISHI HIROMITSU
    • C09D163/00C09D5/03C09D5/25C09D167/00H01B3/40
    • PROBLEM TO BE SOLVED: To provide an epoxy resin powder coating material for electronic parts which satisfies both of short-time curing and heat cycle resistance, and electronic parts having an insulating layer formed by applying and heat-curing the powder coating material. SOLUTION: The epoxy resin powder coating material for electronic parts is an epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, wherein the component (B) is an acid-terminated polyester having an acid value of 40-80 mgKOH/g and a softening point of 100-130°C, the blending ratio of the component (B) is confined so that 0.7-1.2 carboxy group is contained per 1 epoxy group of the component (A), and the component (C) is contained in an amount of 35-60 pts.mass based on 100 pts.mass, in total, of the components (A), (B) and (C). The electronic parts have an insulating layer formed by applying and heat-curing the powder coating material. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种满足短时固化和耐热循环性两者的电子部件用环氧树脂粉末涂料,以及具有通过涂敷和热固化粉末涂料形成的绝缘层的电子部件 。 解决方案:电子部件用环氧树脂粉末涂料是包含(A)环氧树脂,(B)固化剂和(C)无机填料的环氧树脂组合物,其中组分(B)是酸 酸值为40-80mgKOH / g,软化点为100-130℃的封端聚酯,组分(B)的配合比例被限制为每1个环氧基团含有0.7-1.2个羧基 组分(A)和组分(C)的含量相对于组分(A),(B)和(C)的总共100质量份计含有35-60质量份。 电子部件具有通过涂敷和热固化粉末涂料形成的绝缘层。 版权所有(C)2010,JPO&INPIT